公开(公告)号：US11367700B2

公开(公告)日：2022-06-21

申请号：US16958565

申请日：2017-12-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hongbin Shi ,  Zhuqiu Wang ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.

公开(公告)号：US10761133B2

公开(公告)日：2020-09-01

申请号：US16095858

申请日：2016-10-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Runqing Ye ,  Weiqiang Hong ,  Yunfei Wang ,  Taixiang Liu

IPC: G01R31/28 ,  H01L21/66

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

公开(公告)号：US20200273770A1

公开(公告)日：2020-08-27

申请号：US16757012

申请日：2017-10-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianping Fang ,  Yanqin Liao ,  Haohui Long ,  Hui Si

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  G06K9/00

Abstract: A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.

公开(公告)号：US20190319465A1

公开(公告)日：2019-10-17

申请号：US16095848

申请日：2016-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Yanlin Wang ,  Taixiang Liu

IPC: H02J7/00

Abstract: A charging method and a related device are provided. A charge protection apparatus includes a micro control unit (MCU), a current detection circuit, a gating circuit, and an input/output (I/O) interface. The current detection circuit detects an external charging current flowing through a power cable. The current detection circuit transmits the external charging current to the MCU. The MCU transmits the external charging current to a user terminal using the I/O interface,such that the user terminal calculates a current difference between the external charging current and an internal charging current detected by the user terminal, and determines, based on the current difference, whether to generate a circuit control command. The MCU receives the circuit control command from the user terminal, and controls, according to the circuit control command, the gating circuit to be in a closed state or an open state.

公开(公告)号：US20190311996A1

公开(公告)日：2019-10-10

申请号：US16339195

申请日：2017-03-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hongbin Shi ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L23/498

Abstract: A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.

公开(公告)号：US11955080B2

公开(公告)日：2024-04-09

申请号：US18007259

申请日：2021-07-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Haohui Long ,  Xuan Cao ,  Runqing Ye ,  Jianping Fang ,  Xiaochen Chen

IPC: G09G3/3233 ,  G06V40/13 ,  G09G3/00 ,  H10K59/129

CPC classification number: G09G3/3233 ,  G06V40/1318 ,  G09G3/035 ,  H10K59/129 ,  G09G2300/0408 ,  G09G2300/0452 ,  G09G2330/02 ,  G09G2354/00

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

公开(公告)号：US20240030205A1

公开(公告)日：2024-01-25

申请号：US18044434

申请日：2021-09-02

Applicant: Huawei Technologies Co., Ltd.

Inventor： Haohui Long ,  Yang Zhou

IPC: H01L25/16 ,  H01L25/075 ,  H01L21/683 ,  H01L23/538 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L25/0753 ,  H01L21/6835 ,  H01L23/5387 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2933/0066

Abstract: A display screen includes a redistribution layer, a plurality of light emitting units, and a plurality of driver chips. The redistribution layer includes a flexible dielectric layer and a metal interconnection structure disposed in the flexible dielectric layer. The light emitting unit includes at least one light emitting chip. The light emitting diode is disposed on the redistribution layer. A pad of the light emitting chip is bonded to the metal interconnection structure. The plurality of driver chips are disposed on the redistribution layer. A pad of the driver chip is bonded to the metal interconnection structure. One driver chip is electrically connected to light emitting chips in the same light emitting unit by using metal interconnection structure, and the driver chip is configured to drive the light emitting chip to emit light.

公开(公告)号：US11658494B2

公开(公告)日：2023-05-23

申请号：US17458904

申请日：2021-08-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Yanlin Wang ,  Taixiang Liu

IPC: H02J7/00

CPC classification number: H02J7/0031 ,  H02J7/0042 ,  H02J7/00302 ,  H02J7/00304 ,  H02J7/00308 ,  H02J7/00309 ,  H02J7/007192 ,  H02J7/00 ,  H02J7/00034

Abstract: An electronic device comprises a processor, a charging port, and memory that stores program code. When the program code is executed by the processor, the electronic device charges a battery of the electronic device using the charging port when a charger is connected to the charging port, stops charging in response to detecting that the charging port is abnormal, and displays a first window on a display interface of the electronic device in response to detecting that the charging port is abnormal. The first window comprises a first prompt information and a second prompt information. The first prompt information is used to prompt that liquid intake exists in the charging port, and the second prompt information is used to prompt a user to exclude a liquid intake situation of the charging port.

公开(公告)号：US20220020779A1

公开(公告)日：2022-01-20

申请号：US17419118

申请日：2018-12-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shanshan Wei ,  Yanfeng Liang ,  Yuanjian Liu ,  Jianhui Li ,  Haohui Long

IPC: H01L27/12 ,  G02F1/1345 ,  H01L27/32 ,  H01L51/52 ,  G06F3/041

Abstract: A display includes at least an array substrate, and the array substrate has a drive circuit layer. At least one first notch is provided on an outer edge of a lead-out side of the array substrate, and a first conductor is disposed in each first notch. A first end of the first conductor is in contact with a lead end of the drive circuit layer, and a second end of the first conductor extends along the first notch to a back side of the array substrate.

公开(公告)号：US11011477B2

公开(公告)日：2021-05-18

申请号：US16339195

申请日：2017-03-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hongbin Shi ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/488 ,  H01L25/00 ,  B32B27/38

Abstract: A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.