公开(公告)号：US09263620B1

公开(公告)日：2016-02-16

申请号：US13912930

申请日：2013-06-07

Applicant: Flextronics AP, LLC

Inventor： Dason Cheung ,  Murad Kurwa ,  Richard Loi

IPC: B23K31/02 ,  H01L31/18 ,  B23K1/00 ,  B23K3/04 ,  B23K1/012 ,  B23K1/002 ,  B23K3/08

CPC classification number: B23K3/08 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K1/012 ,  B23K1/018 ,  B23K3/04 ,  B23K3/087 ,  H01L31/18 ,  H01L31/188 ,  Y02E10/50

Abstract: A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.