METHOD FOR PRODUCING INDIUM TIN OXIDE PARTICLES AND METHOD FOR PRODUCING CURABLE COMPOSITION

    公开(公告)号:US20210162500A1

    公开(公告)日:2021-06-03

    申请号:US17169563

    申请日:2021-02-08

    IPC分类号: B22F9/16 C08F20/18

    摘要: Provided are a method for producing indium tin oxide particles and a method for producing a curable composition, the methods including a step of obtaining a precursor solution including indium and tin by heating indium acetate and tin acetate in a solvent including a carboxylic acid and having 6 to 20 carbon atoms, and a step of obtaining a reaction solution including indium tin oxide particles by dropwise adding the obtained precursor solution to a solvent having a hydroxy group and having 14 to 22 carbon atoms, which has a temperature of 230° C. to 320° C., in which an acetic acid concentration in the precursor solution is in a range of 0.5% by mass to 6% by mass.

    METAL OXIDE FILM, METHOD FOR MANUFACTURING SAME, THIN FILM TRANSISTOR, DISPLAY APPARATUS, IMAGE SENSOR, AND X-RAY SENSOR
    12.
    发明申请
    METAL OXIDE FILM, METHOD FOR MANUFACTURING SAME, THIN FILM TRANSISTOR, DISPLAY APPARATUS, IMAGE SENSOR, AND X-RAY SENSOR 有权
    金属氧化物膜,其制造方法,薄膜晶体管,显示装置,图像传感器和X射线传感器

    公开(公告)号:US20160005879A1

    公开(公告)日:2016-01-07

    申请号:US14856047

    申请日:2015-09-16

    摘要: Provided is a metal oxide film, including a component having a peak position, in an XPS spectrum thereof, within a range corresponding to a binding energy of from 402 eV to 405 eV, the metal oxide film satisfying a relationship represented by Equation (1): A/(A+B)≧0.39, when an intensity of peak energy attributed to nitrogen 1s electron is obtained by peak separation, and a manufacturing method of the same, an oxide semiconductor film, a thin-film transistor, a display apparatus, an image sensor, and an X-ray sensor. In Equation (1), A represents a peak area of the component having a peak position within a range corresponding to a binding energy of from 402 eV to 405 eV, and B represents a peak area of a component having a peak position within a range corresponding to a binding energy of from 406 eV to 408 eV.

    摘要翻译: 本发明提供一种金属氧化物膜,其特征在于,具有在XPS光谱中具有峰值位置的成分在与402eV〜405eV的结合能对应的范围内,所述金属氧化物膜满足由式(1)表示的关系, :A /(A + B)≥0.39,当通过峰值分离获得归因于氮1s电子的峰值能量的强度时,其制造方法,氧化物半导体膜,薄膜晶体管,显示装置 ,图像传感器和X射线传感器。 在式(1)中,A表示在与402eV〜405eV的结合能对应的范围内具有峰值位置的成分的峰面积,B表示峰值位置在一定范围内的成分的峰面积 对应于从406eV到408eV的结合能。

    METHOD FOR PRODUCING FIELD EFFECT TRANSISTOR, FIELD EFFECT TRANSISTOR, DISPLAY DEVICE, IMAGE SENSOR, AND X-RAY SENSOR
    13.
    发明申请
    METHOD FOR PRODUCING FIELD EFFECT TRANSISTOR, FIELD EFFECT TRANSISTOR, DISPLAY DEVICE, IMAGE SENSOR, AND X-RAY SENSOR 有权
    用于产生场效应晶体管,场效应晶体管,显示器件,图像传感器和X射线传感器的方法

    公开(公告)号:US20140131696A1

    公开(公告)日:2014-05-15

    申请号:US14160730

    申请日:2014-01-22

    摘要: There is provided a method of fabricating a field effect transistor including: forming a first oxide semiconductor film on a gate insulation layer disposed on a gate electrode; forming a second oxide semiconductor film on the first oxide semiconductor film, the second oxide semiconductor film differing in cation composition from the first oxide semiconductor film and being lower in electrical conductivity than the first oxide semiconductor film; applying a heat treatment at over 300° C. in an oxidizing atmosphere; forming a third oxide semiconductor film on the second oxide semiconductor film, the third oxide semiconductor film differing in cation composition from the first oxide semiconductor film and being lower in electrical conductivity than the first oxide semiconductor film; applying a heat treatment in an oxidizing atmosphere; and, forming a source electrode and a drain electrode on the third oxide semiconductor film.

    摘要翻译: 提供一种制造场效应晶体管的方法,包括:在设置在栅电极上的栅极绝缘层上形成第一氧化物半导体膜; 在所述第一氧化物半导体膜上形成第二氧化物半导体膜,所述第二氧化物半导体膜与所述第一氧化物半导体膜的阳离子组成不同,导电性低于所述第一氧化物半导体膜; 在氧化气氛中在300℃以上进行热处理; 在所述第二氧化物半导体膜上形成第三氧化物半导体膜,所述第三氧化物半导体膜的阳离子组成与所述第一氧化物半导体膜不同,导电率低于所述第一氧化物半导体膜; 在氧化气氛中进行热处理; 以及在所述第三氧化物半导体膜上形成源电极和漏电极。

    THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAME
    14.
    发明申请
    THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAME 审中-公开
    薄膜晶体管及其制造方法

    公开(公告)号:US20130234135A1

    公开(公告)日:2013-09-12

    申请号:US13871305

    申请日:2013-04-26

    IPC分类号: H01L29/786 H01L29/66

    摘要: A thin film transistor includes at least a gate electrode, a gate insulating film, an active layer, a source electrode and a drain electrode are provided on a substrate, with the source electrode and the drain electrode being provided on the active layer. The active layer is configured of an amorphous oxide semiconductor. A first amount of moisture present in the gate insulating film is smaller than a second amount of moisture present in the active layer.

    摘要翻译: 薄膜晶体管至少包括栅电极,栅极绝缘膜,有源层,源电极和漏电极,源极电极和漏电极设置在有源层上。 有源层由无定形氧化物半导体构成。 存在于栅极绝缘膜中的第一量的水分小于活性层中存在的第二量的水分。

    SEMICONDUCTOR FILM, OXIDE MICROPARTICLE DISPERSION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM, AND THIN FILM TRANSISTOR
    15.
    发明申请
    SEMICONDUCTOR FILM, OXIDE MICROPARTICLE DISPERSION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM, AND THIN FILM TRANSISTOR 审中-公开
    半导体膜,氧化物微球分散体,制造半导体膜的方法和薄膜晶体管

    公开(公告)号:US20160190452A1

    公开(公告)日:2016-06-30

    申请号:US15058336

    申请日:2016-03-02

    IPC分类号: H01L51/00 H01L51/05

    摘要: There is provided a semiconductor film, including: an aggregate of oxide microparticles including at least one type of metal selected from the group consisting of In, Zn, and Sn; and at least one type of a ligand which is selected from the group consisting of a ligand expressed by General Formula (A) below, a ligand expressed by General Formula (B) below, and a ligand expressed by General Formula (C) below and which is coordinated with the oxide microparticles: in which, in General Formula (A), each of X1 and X2 independently represents —SH, —NH2, —OH, or —COOH, and each of A1 and B1 independently represents a hydrogen atom or a substituent having an atomic number of 1 to 10, in which, in General Formula (B), each of X3 and X4 independently represents —SH, —NH2, —OH, or —COOH and each of A2 and B2 independently represents a hydrogen atom or a substituent having an atomic number of 1 to 10, and in which, in General Formula (C), X5 represents —SH, —NH2, or —OH, and A3 represents a hydrogen atom or a substituent having an atomic number of 1 to 10.

    摘要翻译: 提供一种半导体膜,其包括:包含选自In,Zn和Sn中的至少一种类型的金属的氧化物微粒的集合体; 和选自下述通式(A)表示的配体,下述通式(B)表示的配位体和下述通式(C)表示的配体的配体中的至少一种配体,以及 其与氧化物微粒配位:其中,在通式(A)中,X1和X2各自独立地表示-SH,-NH2,-OH或-COOH,A1和B1各自独立地表示氢原子或 原子数为1〜10的取代基,其中,在通式(B)中,X 3和X 4各自独立地表示-SH,-NH 2,-OH或-COOH,A2和B2各自独立地表示氢 原子或原子数为1〜10的取代基,其中,在通式(C)中,X 5表示-SH,-NH2或-OH,A3表示氢原子或原子序数为 1到10。

    SEMICONDUCTOR ELEMENT MANUFACTURING METHOD
    17.
    发明申请
    SEMICONDUCTOR ELEMENT MANUFACTURING METHOD 有权
    半导体元件制造方法

    公开(公告)号:US20140134795A1

    公开(公告)日:2014-05-15

    申请号:US14158461

    申请日:2014-01-17

    IPC分类号: H01L29/66 H01L21/02

    摘要: There is provided a method of manufacturing a semiconductor element including: forming a semiconductor film of which a principal constituent is an oxide semiconductor; forming a first insulation film on a surface of the semiconductor film; applying a heat treatment in an oxidizing atmosphere; and, forming a second insulation film on a surface of the first insulation film, wherein a thickness of the first insulation film and a temperature of the heat treatment in the third step are adjusted such that, if the thickness of the first insulation film is represented by Z (nm), the heat treatment temperature is represented by T (° C.) and a diffusion distance of oxygen into the first insulation film and the semiconductor film is represented by L (nm), the relational expression 0

    摘要翻译: 提供一种制造半导体元件的方法,包括:形成主要成分为氧化物半导体的半导体膜; 在所述半导体膜的表面上形成第一绝缘膜; 在氧化气氛中进行热处理; 以及在所述第一绝缘膜的表面上形成第二绝缘膜,其中调整所述第一绝缘膜的厚度和所述第三步骤中的热处理温度,使得如果所述第一绝缘膜的厚度被表示 通过Z(nm),热处理温度由T(℃)表示,并且氧进入第一绝缘膜的扩散距离,半导体膜由L(nm)表示,关系式0