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公开(公告)号：US20150187599A1
公开(公告)日：2015-07-02
申请号：US14310784
申请日：2014-06-20
Inventor： Sang Choon KO , Jae Kyoung MUN , Woojin CHANG , Sung-Bum BAE , Young Rak PARK , Chi Hoon JUN , Seok-Hwan MOON , Woo-Young JANG , Jeong-Jin KIM , Hyungyu JANG , Je Ho NA , Eun Soo NAM
IPC: H01L21/321 , H01L21/283 , H01L21/02
CPC classification number: H01L21/3212 , H01L21/0254 , H01L21/283 , H01L21/28575 , H01L21/28581 , H01L29/2003 , H01L29/41766 , H01L29/452 , H01L29/66462 , H01L29/7786
Abstract: Provided is a method of manufacturing a nitride semiconductor device. The method includes forming a plurality of electrodes on a growth substrate on which first and second nitride semiconductor layers are sequentially stacked, forming upper metal layers on the plurality of electrodes respectively, removing the growth substrate to expose a lower surface of the first nitride semiconductor layer, and forming a third nitride semiconductor layer and a lower metal layer sequentially on the exposed lower surface of the first nitride semiconductor layer.
Abstract translation: 提供一种制造氮化物半导体器件的方法。 该方法包括在生长衬底上形成多个电极，在其上依次层叠有第一和第二氮化物半导体层，分别在多个电极上形成上部金属层，去除生长衬底以暴露第一氮化物半导体层的下表面 并且在第一氮化物半导体层的暴露的下表面上顺序地形成第三氮化物半导体层和下金属层。
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公开(公告)号：US20140198195A1
公开(公告)日：2014-07-17
申请号：US14156804
申请日：2014-01-16
Inventor： Dong Suk JUN , Seok-Hwan MOON , In-Kyu YOU , Jae Ick CHOI
IPC: H04N5/33
CPC classification number: H04N5/2258 , H04N5/332
Abstract: Provided is a terahertz health checker. The terahertz health checker includes a terahertz wave transmitter generating terahertz waves in a terahertz band, a lens outputting the terahertz waves and receiving terahertz waves reflected from the outputted terahertz waves, an imaging chip connected to the lens, detecting the received terahertz waves, and generating a digital image signal based on the detected terahertz waves, a readout circuit reading out the digital image signal, and a transceiver outputting the read-out digital image signal to the outside.
Abstract translation: 提供了一个太赫兹健康检查器。 太赫兹健康检查器包括在太赫兹波段中产生太赫兹波的太赫兹波发射器，输出太赫兹波并接收从输出的太赫兹波反射的太赫兹波的透镜，连接到透镜的成像芯片，检测接收到的太赫兹波，并产生 基于检测到的太赫兹波的数字图像信号，读出数字图像信号的读出电路和将读出的数字图像信号输出到外部的收发器。
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13.发明公开公开(公告)号：US20230391956A1
公开(公告)日：2023-12-07
申请号：US18205153
申请日：2023-06-02
Inventor： GWANG-MUN CHOI , Yong Sung EOM , Jiho JOO , KWANG-SEONG CHOI , Seok-Hwan MOON , Jin Hyuk OH , Ho-Gyeong YUN , CHANMI LEE , Ki Seok JANG
IPC: C08G77/18
CPC classification number: C08G77/18
Abstract: Provided is an organic-inorganic compound including a first structural body and a curable reactive group, wherein the first structural body may have a structure in which silane and isohexide are chemically bonded through a silyl ether bond.
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14.发明公开公开(公告)号：US20230326810A1
公开(公告)日：2023-10-12
申请号：US18297461
申请日：2023-04-07
Inventor： GWANG-MUN CHOI , Yong Sung EOM , Jiho JOO , KWANG-SEONG CHOI , Seok-Hwan MOON , Jin Hyuk OH , Ho-Gyeong YUN , CHANMI LEE , Ki Seok JANG
CPC classification number: H01L22/20 , H05B6/6491 , H05B6/645 , H01L21/565
Abstract: Provided are a microwave heating device and a method for manufacturing a semiconductor packaging using the same. The microwave heating device includes a microwave generator configured to generate microwaves, a microwave absorbing layer configured to receive the microwaves so as to be heated, a temperature measuring layer provided on the microwave absorbing layer, a sensor configured to detect a temperature of the temperature measuring layer, and a controller connected to the sensor and the microwave generator to determine the temperature of the microwave absorbing layer using a detection signal of the sensor, the controller being configured to control a voltage of the microwaves provided from the microwave generator based on the temperature of the microwave absorbing layer.
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Patent Agency Ranking
公开(公告)号：US20220402070A1
公开(公告)日：2022-12-22
申请号：US17843504
申请日：2022-06-17
Inventor： Ki Seok JANG , Yong Sung EOM , GWANG-MUN CHOI , KWANG-SEONG CHOI , Jiho JOO , Seok-Hwan MOON , CHANMI LEE
IPC: B23K26/324
Abstract: Provided are a laser control structure and a laser bonding method using the same, and more particularly, a laser bonding method including: forming bonding portions on a substrate; providing a bonding object onto the bonding portions; providing a laser control structure onto the bonding object or the substrate; irradiating a laser toward the bonding object and the bonding portions; controlling quantity of laser light absorbed through the laser control structure; using the controlled quantity of laser light to heat the bonding portions and the bonding object to a bonding temperature; and bonding the bonding portions and the bonding object, wherein the laser control structure includes: a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region, wherein: the first thin film laminate includes at least one first thin film layer and at least one second thin film layer, which are laminated on the first region; the second thin film laminate includes at least one third thin film layer and at least one fourth thin film layer, which are laminated on the second region; reflectance or absorptivity of the first thin film laminate with respect to laser is different from reflectance or absorptivity of the second thin film laminate; and the bonding temperature varies according to the quantity of laser light.
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公开(公告)号：US20220102603A1
公开(公告)日：2022-03-31
申请号：US17399754
申请日：2021-08-11
Inventor： Kwang-Seong CHOI , Yong Sung EOM , Jiho JOO , Gwang-Mun CHOI , Seok-Hwan MOON , Chanmi LEE , Ki Seok JANG
Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.
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公开(公告)号：US20210252620A1
公开(公告)日：2021-08-19
申请号：US17178571
申请日：2021-02-18
Inventor： KWANG-SEONG CHOI , Yong Sung EOM , Jiho JOO , Seok-Hwan MOON , Ho-Gyeong YUN , Ki Seok JANG , GWANG-MUN CHOI
Abstract: The present disclosure relates to a transfer and bonding method using a laser. As a plurality of devices or packages are simultaneously transferred onto a substrate from a transfer tape by irradiating a top surface of the transfer tape with a first laser, and the plurality of transferred devices or packages are simultaneously bonded to pads of a substrate by irradiating a top surface of the devices or packages with a second laser, a speed of a transfer and bonding process may be extremely maximized.
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公开(公告)号：US20190287870A1
公开(公告)日：2019-09-19
申请号：US16356615
申请日：2019-03-18
Inventor： KeonSoo JANG , Yong Sung EOM , KWANG-SEONG CHOI , Seok-Hwan MOON , Hyun-cheol BAE
Abstract: The inventive concept relates to a filling composition for a semiconductor package. The filling composition for a semiconductor package may include a resin, a curing agent, and an insulating filler. The insulating filler may include a first filler body part, a second filler body part, a polymer chain coupled to the first filler body part and the second filler body part, and supramolecules coupled to the polymer chain.
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公开(公告)号：US20140352758A1
公开(公告)日：2014-12-04
申请号：US14177890
申请日：2014-02-11
Inventor： Seok-Hwan MOON
IPC: H01L31/052 , H01L31/042
CPC classification number: H01L31/0543 , H01L31/052 , H01L31/0547 , Y02E10/52
Abstract: Provided is a solar cell module. The solar cell module includes a heat sink, a light guide plate on the heat sink, a cooling part passing through a center of the light guide plate between the light guiding plate and the heat sink, the cooling part extending from a center of the heat sink up to each of edges of the heat sink, solar cells fixed to the cooling part, and a light concentrating plate disposed on the solar cells, cooling part, and the light guiding plate to concentrate solar light onto the light guide plate and the solar cells.
Abstract translation: 提供了一种太阳能电池组件。 太阳能电池模块包括散热器，散热器上的导光板，通过导光板和散热片之间的导光板中心的冷却部分，冷却部分从热中心延伸 下沉到散热器的每个边缘，固定到冷却部分的太阳能电池和设置在太阳能电池，冷却部分和导光板上的聚光板，以将太阳光聚集到导光板和太阳能 细胞。
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