Electronic device and method of fabricating the same
    18.
    发明授权
    Electronic device and method of fabricating the same 有权
    电子装置及其制造方法

    公开(公告)号:US09123914B2

    公开(公告)日:2015-09-01

    申请号:US14269609

    申请日:2014-05-05

    CPC classification number: H01L51/5275 H01L51/5212 H01L51/5228 H01L51/5268

    Abstract: Provided are an electronic device and a fabrication method thereof. The electronic device according to the concept of the present invention includes auxiliary interconnections disposed on a substrate, a light extraction layer that is provided on the substrate and fills between the auxiliary interconnection, and a first electrode provided on the auxiliary interconnections and the light extraction layer, wherein the light extraction layer may have a first surface facing the substrate and a second surface opposite to the first surface, the first surface may have protrusions, and the auxiliary interconnections may include a material having a lower resistance than the first electrode. Since electrical properties of the electronic device are improved, uniform light emission characteristics may be realized.

    Abstract translation: 提供一种电子设备及其制造方法。 根据本发明的概念的电子设备包括设置在基板上的辅助互连,设置在基板上并填充在辅助互连之间的光提取层和设置在辅助互连上的第一电极和光提取层 其中,所述光提取层可以具有面向所述基板的第一表面和与所述第一表面相对的第二表面,所述第一表面可以具有突起,并且所述辅助互连可以包括具有比所述第一电极低的电阻的材料。 由于电子设备的电气特性得到改善,所以可以实现均匀的发光特性。

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