公开(公告)号：US20140063124A1

公开(公告)日：2014-03-06

申请号：US13966336

申请日：2013-08-14

Applicant: Electronics and Telecommunications Research Institute

Inventor： Yong Suk Yang ,  In-Kyu You ,  Soon-Won Jung ,  Bock Soon Na ,  Seok-Hwan Moon

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1626 ,  B41J2/06 ,  B41J2/14 ,  B41J2/16 ,  B41J2/162 ,  B41J2/1621 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2202/04

Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.

Abstract translation: 提供了一种大面积纳米级活性印刷装置及其制造方法，以及使用其的印刷方法。 打印装置可以包括基板，沿着第一方向延伸的第一互连线，在基板上，设置在第一互连线上的具有部分地暴露第一互连线的孔的层间电介质层，邻近孔的第二互连线 所述层间电介质层与所述第一互连线交叉，以及设置在与所述第一和第二互连线交叉并与所述第一互连线连接的楔形电极。 楔形电极在孔的中心向上突出。

公开(公告)号：US20140062838A1

公开(公告)日：2014-03-06

申请号：US13946514

申请日：2013-07-19

Applicant: Electronics and Telecommunications Research Institute

Inventor： In-Kyu YOU ,  Seok-Hwan Moon ,  Yong-Suk Yang ,  Soon-Won Jung

IPC: G06F3/14

CPC classification number: G06F3/1423 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/1652 ,  G06F3/147 ,  G09G2380/02 ,  G09G2380/14

Abstract: Provided is a mobile e-binder system including at least one display configured to display data, a docking system electrically connected to the at least one display to exchange the data using a standardized communication protocol, and a computing device configured to store and process the data and send the data to the at least one display. The at least one display may be configured to be attachable and detachable to the docking system.

Abstract translation: 提供了一种移动电子绑定系统，其包括被配置为显示数据的至少一个显示器，电连接到所述至少一个显示器的对接系统，以使用标准化通信协议来交换数据;以及计算设备，被配置为存储和处理数据 并将数据发送到至少一个显示器。 所述至少一个显示器可以被配置为可附接和可拆卸到对接系统。

公开(公告)号：US10026844B2

公开(公告)日：2018-07-17

申请号：US15461567

申请日：2017-03-17

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Kyoung Ik Cho ,  Jae Bon Koo ,  Chan Woo Park ,  Bock Soon Na ,  Sang Seok Lee ,  Sang Chul Lim ,  Soon-Won Jung ,  Hye Yong Chu

IPC: H01L29/10 ,  H01L29/786 ,  H01L29/66 ,  H01L27/12 ,  H01L21/3105 ,  H01L21/311

Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

公开(公告)号：US09865559B2

公开(公告)日：2018-01-09

申请号：US15220145

申请日：2016-07-26

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Chan Woo Park ,  Jae Bon Koo ,  Bock Soon Na ,  Rae-Man Park ,  Ji-Young Oh ,  Sang Seok Lee ,  Soon-Won Jung

IPC: H01L23/00 ,  H01L21/683

CPC classification number: H01L24/43 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/6835 ,  H01L2224/24137 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.

公开(公告)号：US09807886B2

公开(公告)日：2017-10-31

申请号：US13772288

申请日：2013-02-20

Applicant: Electronics and Telecommunications Research Institute

Inventor： Chan Woo Park ,  Jae Bon Koo ,  Sang Chul Lim ,  Ji-Young Oh ,  Soon-Won Jung

IPC: H05K3/34 ,  H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K3/10 ,  H05K1/0283 ,  H05K1/0287 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/284

Abstract: Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region.

公开(公告)号：US09634120B2

公开(公告)日：2017-04-25

申请号：US14610410

申请日：2015-01-30

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Kyoung Ik Cho ,  Jae Bon Koo ,  Chan Woo Park ,  Bock Soon Na ,  Sang Seok Lee ,  Sang Chul Lim ,  Soon-Won Jung ,  Hye Yong Chu

IPC: H01L29/10 ,  H01L29/66 ,  H01L29/786 ,  H01L27/12 ,  H01L21/3105

CPC classification number: H01L29/78603 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31144 ,  H01L27/1218 ,  H01L27/1266 ,  H01L29/66742

Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

公开(公告)号：US08912094B2

公开(公告)日：2014-12-16

申请号：US13846437

申请日：2013-03-18

Applicant: Electronics and Telecommunications Research Institute

Inventor： Jae Bon Koo ,  Chan Woo Park ,  Soon-Won Jung ,  Sang Chul Lim ,  Ji-Young Oh ,  Bock Soon Na ,  Hye Yong Chu

IPC: H01L21/44 ,  H01L21/768

CPC classification number: H01L29/78603 ,  H01L27/1218 ,  H01L27/1262

Abstract: Provided is a method for manufacturing a stretchable thin film transistor. The method for manufacturing a stretchable thin film transistor includes forming a mold substrate, forming a stretchable insulator on the mold substrate, forming a flat substrate on the stretchable insulator, removing the mold substrate, forming discontinuous and corrugated wires on the stretchable insulator, forming a thin film transistor connected between the wires, and removing the flat substrate.

Abstract translation: 提供一种制造可拉伸薄膜晶体管的方法。 制造可伸缩薄膜晶体管的方法包括：在模具基板上形成模具基板，形成可拉伸绝缘体，在可伸缩绝缘体上形成平坦的基板，去除模具基板，在可拉伸的绝缘体上形成不连续的和波纹的导线， 连接在电线之间的薄膜晶体管，以及去除平坦的基板。

公开(公告)号：US20140076610A1

公开(公告)日：2014-03-20

申请号：US13934635

申请日：2013-07-03

Applicant: Electronics and Telecommunications Research Institute

Inventor： Yong Suk YANG ,  In-Kyu You ,  Minseok Kim ,  Soon-Won Jung ,  Bock Soon Na ,  Sang Chul Lim

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/02 ,  H01L51/0022 ,  H01L51/003 ,  H01L51/102 ,  H01L51/441 ,  H01L51/5203 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/207 ,  H05K2201/0376

Abstract: Disclosed are a method for manufacturing a planarizing printed electronic device and a planarizing printed electronic device manufactured by using the same by simply implementing a large-area embedded printed electronic device by coupling a printing process such as inkjet printing and gravure printing and a transferring process using a laminating device and particularly, solving defects due to large surface roughness and a thickness of a printed layer included in the printed electronic device, when manufacturing an embedded printed electronic device where a printed layer is embedded in a substrate.

Abstract translation: 公开了一种制造平面印刷电子器件的方法和通过使用它们简单地实现大面积嵌入式印刷电子器件而制造的平面化印刷电子器件，其通过联接诸如喷墨印刷和凹版印刷的印刷工艺和使用 层压装置，特别是在制造嵌入印刷电子器件时，其中印刷层嵌入基板中，特别是解决了印刷电子器件中包括的印刷层的大的表面粗糙度和厚度的缺陷。