公开(公告)号：US20230241649A1

公开(公告)日：2023-08-03

申请号：US18133972

申请日：2023-04-12

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Khalid MAKHAMREH ,  Eliyahu Shlomo DAGAN

IPC: B08B3/12 ,  G01B11/30 ,  B08B13/00

CPC classification number: B08B3/123 ,  G01B11/303 ,  B08B13/00

Abstract: Embodiments of megasonic cleaning chambers are provided herein. In some embodiments, a megasonic cleaning chamber includes: a chamber body defining an interior volume therein; a substrate support to support a substrate disposed in the interior volume; a supply tube comprising a transparent material configured to direct a cleaning fluid to the substrate support; a megasonic power generator coupled to the supply tube to provide megasonic power to the cleaning fluid; a megasonic transducer coupled to the megasonic power generator and the supply tube to create megasonic waves in the cleaning fluid and to form cavities in the cleaning fluid, wherein the megasonic transducer is configured to direct the megasonic waves and cavities toward the substrate support; and one or more sensors configured to generate a signal indicative of a property of the cavities in the cleaning fluid.

公开(公告)号：US20200183268A1

公开(公告)日：2020-06-11

申请号：US16661541

申请日：2019-10-23

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Eli DAGAN ,  Khalid MAKHAMREH ,  Bruce J. FENDER

IPC: G03F1/82 ,  G03F7/20

Abstract: Embodiments of the present disclosure generally provide apparatus and methods for removing an attachment feature utilized to hold a pellicle from a photomask. In one embodiment, an attachment feature removal apparatus for processing a photomask includes an attachment feature puller comprising an actuator, a clamp coupled to the actuator, the clamp adapted to grip an attachment feature, and a coil assembly disposed adjacent to the attachment feature.

公开(公告)号：US20200057362A1

公开(公告)日：2020-02-20

申请号：US16510855

申请日：2019-07-12

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Eli DAGAN

IPC: G03F1/00 ,  G03F1/54

Abstract: Embodiments described herein relate to apparatus and methods for removing one or more films from a photomask to create a black border and one or more pellicle anchor areas thereon. A photomask substrate is exposed by removing the one or more films in the black border and pellicle anchor areas. The black border prevents a pattern on the photomask from overlapping a pattern on a substrate being processed. To create the black border and pellicle anchor areas, a laser beam is projected through a lens and focused on a surface of the films. The films are ablated by the laser beam without damaging the photomask substrate.

公开(公告)号：US20200009854A1

公开(公告)日：2020-01-09

申请号：US16443341

申请日：2019-06-17

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Eli DAGAN

IPC: B41C1/10 ,  H01L21/027 ,  G03F7/20

Abstract: Embodiments described herein generally relate to an apparatus and methods for removing a glue residue from a photomask. The glue residue may be exposed when a pellicle is removed from the photomask. Before a new pellicle can be adhered to the photomask, the glue residue may be removed. To remove the glue residue, a laser beam may be projected through a lens and focused on a surface of the glue residue. The glue residue may be ablated from the photomask by the laser beam.

公开(公告)号：US20170213709A1

公开(公告)日：2017-07-27

申请号：US15006966

申请日：2016-01-26

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Xiaoyi CHEN ,  David KNICK

IPC: H01J37/32 ,  B08B9/08 ,  C23F1/12

CPC classification number: H01J37/32862 ,  B08B9/08 ,  C23F1/12 ,  C23F4/00 ,  C23G5/00 ,  H01J37/32082 ,  H01J37/32816

Abstract: Embodiments of the disclosure include methods for in-situ chamber cleaning a plasma processing chamber utilized for photomask plasma fabrication process. In one embodiment, a method for in-situ chamber cleaning after a plasma process includes supplying a cleaning gas mixture including at least an oxygen containing gas and a hydrogen containing gas into the plasma processing chamber, controlling the processing pressure at less than 2 millitorr, applying a RF source power to the processing chamber to form a plasma from the cleaning gas mixture, and cleaning the processing chamber in the presence of the plasma.

公开(公告)号：US20140253887A1

公开(公告)日：2014-09-11

申请号：US14199626

申请日：2014-03-06

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Ajay KUMAR

IPC: G03F7/20

CPC classification number: G03F7/70925 ,  G03F1/82

Abstract: Embodiments of the present invention provide methods and apparatus for removing debris particles using a stream of charged species. In one embodiment, an apparatus for removing debris particles from a beam of radiation includes a mask station comprising a chamber body, a mask stage disposed in the mask station, and a conductive plate having an opening formed therein, wherein the conductive plate is disposed in a spaced apart relationship to the mask stage in the mask station, defining an interior volume between the mask stage and the conductive plate.

Abstract translation: 本发明的实施例提供了使用带电物质流去除碎屑颗粒的方法和装置。 在一个实施例中，用于从辐射束去除碎屑颗粒的装置包括掩模站，其包括室主体，设置在掩模站中的掩模台以及其中形成有开口的导电板，其中导电板设置在 与掩模台中的掩模台间隔开的关系，限定掩模台和导电板之间的内部空间。

公开(公告)号：US20250157800A1

公开(公告)日：2025-05-15

申请号：US18388211

申请日：2023-11-09

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Khalid MAKHAMREH ,  Eliyahu Shlomo DAGAN

IPC: H01J37/32

Abstract: Methods and systems for treating a photomask are provided, which include producing a plasma comprising a radical species; measuring an optical emission spectrum of the radical species; and contacting the photomask with the radical species in a process chamber to remove a contaminant from a surface or to modify the surface of the photomask, wherein a presence of the radical species is controlled based at least in part on the measured optical emission spectrum.

公开(公告)号：US20240201580A1

公开(公告)日：2024-06-20

申请号：US18082948

申请日：2022-12-16

Applicant: Applied Materials, Inc.

Inventor： Nolan Layne ZIMMERMAN ,  Banqiu WU

IPC: G03F1/82 ,  G03F1/66 ,  G03F9/00

CPC classification number: G03F1/82 ,  G03F1/66 ,  G03F9/7046

Abstract: An automatic photomask handling assembly is employed for holding a photomask for cleaning processes in an atmospheric pressure plasma (APP) chamber. The automatic photomask handling assembly includes a set of stationary standoffs with each of the stationary standoffs having a first end solidly mounted to the photomask handling assembly and a second end that contacts an underside of a photomask. The automatic photomask handling assembly also has a handling stage that holds the photomask for processing. The handling stage has a set of through openings that allow the set of stationary standoffs to pass through the handling stage as the handling stage moves vertically. The handling stage also has a set of plates that automatically clamp and unclamp a photomask as the handling stage moves vertically. The set of plates completely surrounds the photomask such that the clamped photomask and the set of plates form a continuous surface.

公开(公告)号：US20220326608A1

公开(公告)日：2022-10-13

申请号：US17229584

申请日：2021-04-13

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Khalid MAKHAMREH ,  Eliyahu Shlomo DAGAN

IPC: G03F1/82 ,  B08B7/00 ,  H05B3/22

Abstract: Embodiments of baking chambers are provided herein. In some embodiments, a baking chamber for baking a substrate includes: a chamber body enclosing an interior volume; a heater disposed in the interior volume, wherein the heater is configured to have a surface temperature of about 100 to about 400 degrees Celsius during use; a shroud disposed in the interior volume opposite the heater, wherein the shroud includes a central opening fluidly coupled to a gas inlet; a plurality of substrate lift pins configured to support a substrate in the interior volume between the heater and the shroud, wherein the shroud includes a plurality of first openings to facilitate the plurality of substrate lift pins; and a gas outlet disposed in the chamber body opposite the shroud such that a gas flow path through the interior volume extends from the gas inlet, around the heater, and to the gas outlet.

公开(公告)号：US20220326605A1

公开(公告)日：2022-10-13

申请号：US17226762

申请日：2021-04-09

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Khalid MAKHAMREH ,  Eliyahu Shlomo DAGAN

IPC: G03F1/82 ,  G03F7/20 ,  G03F7/16

Abstract: Embodiments of baking chambers for baking a substrate and methods of use thereof are provided herein. In some embodiments, a multi-chamber process tool for processing a substrate including: a wet clean chamber for cleaning the substrate; and a baking chamber configured to heat the substrate to remove residue or haze left over after a wet clean process performed in the wet clean chamber, the baking chamber comprising: a chamber body enclosing an interior volume; a heater disposed in the interior volume, wherein the heater is configured to have a surface temperature of about 100 to about 400 degrees Celsius during use; a substrate support configured to support a substrate disposed in the interior volume, wherein the substrate support has a direct line of sight with the heater such that the heater heats the substrate support via convection; and a gas inlet and a gas outlet coupled to the interior volume.