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公开(公告)号：US20180092212A1
公开(公告)日：2018-03-29
申请号：US15702046
申请日：2017-09-12
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Curtis C. Mead , Scott D. Morrison , Giancarlo F. De La Cruz , Lin Chen , Albert Wang , Brad W. Simeral
CPC classification number: H05K1/181 , H01F27/29 , H01G2/06 , H01G4/12 , H01G4/228 , H01G4/30 , H01G4/40 , H03H1/00 , H03H7/0115 , H03H7/38 , H03H2001/0085 , H05K3/3436 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10515 , H05K2201/10636 , Y02P70/611 , Y02P70/613
Abstract: Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.
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公开(公告)号：US20160064992A1
公开(公告)日：2016-03-03
申请号：US14795723
申请日：2015-07-09
Applicant: Apple Inc.
Inventor： Steven G. Herbst , Scott D. Morrison , Jeffrey M. Alves , Brandon R. Garbus , Jim C. Hwang , Robert S. Parnell , Terry L. Tikalsky
Abstract: A receiver device in an inductive energy transfer system can include a touch sensing device. If the input surface of the touch sensing device is touched, a transmitter device can periodically stop transferring energy to allow the touch sensing device to sense touch samples while inductive energy transfer is inactive. Additionally or alternatively, a transmitter device can produce an averaged duty cycle by transferring energy to the receiver device for one or more periods at a first duty cycle step and for one or more periods at different second first duty cycle step. Additionally or alternatively, a transmitter device can reduce a current level received by a DC-to-AC converter if the current received by the DC-to-AC converter equals or exceeds a threshold. Additionally or alternatively, a transmitter device can ping a receiver device and transfer energy only after a response signal is received from the receiver device.
Abstract translation: 感应能量传递系统中的接收器装置可以包括触摸感测装置。 如果触摸感测装置的输入表面被触摸，则发射机装置可以周期性地停止传送能量，以允许触摸感测装置感测触摸样本，同时感应能量传递不活动。 附加地或替代地，发射机设备可以通过在第一占空比步骤和在不同的第二第一占空比步骤的一个或多个周期将能量传送到接收机设备来产生平均占空比。 另外或替代地，如果由DC-AC转换器接收的电流等于或超过阈值，则发射机设备可以降低DC-AC转换器接收的电流电平。 附加地或替代地，发射机设备可以仅在从接收机设备接收到响应信号之后对接收机设备进行ping，并传送能量。
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公开(公告)号：US12165956B2
公开(公告)日：2024-12-10
申请号：US17643247
申请日：2021-12-08
Applicant: Apple Inc.
Inventor： Kumar Nagarajan , Flynn P. Carson , Karthik Shanmugam , Menglu Li , Raymundo M. Camenforte , Scott D. Morrison
IPC: H01L23/495 , H01L23/31 , H01L23/532 , H01L23/538 , H01L25/16 , H01L49/02
Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.
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公开(公告)号：US12153268B2
公开(公告)日：2024-11-26
申请号：US17646784
申请日：2022-01-03
Applicant: Apple Inc.
Inventor： Scott D. Morrison , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Lan H. Hoang , Manoj Vadeentavida
Abstract: Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.
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Patent Agency Ranking
公开(公告)号：US20230178458A1
公开(公告)日：2023-06-08
申请号：US17643247
申请日：2021-12-08
Applicant: Apple Inc.
Inventor： Kumar Nagarajan , Flynn P. Carson , Karthik Shanmugam , Menglu Li , Raymundo M. Camenforte , Scott D. Morrison
IPC: H01L23/495 , H01L23/31 , H01L23/538 , H01L23/532 , H01L49/02
CPC classification number: H01L23/4952 , H01L23/31 , H01L23/5381 , H01L23/53228 , H01L28/00
Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.
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公开(公告)号：US20220071013A1
公开(公告)日：2022-03-03
申请号：US17005607
申请日：2020-08-28
Applicant: Apple Inc.
Inventor： Scott D. Morrison , Karthik Shanmugam , Raymundo M. Camenforte , Rakshit Agrawal , Flynn P. Carson , Kiranjit Dhaliwal
Abstract: Wafer level passive array packages, modules, and methods of fabrication are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.
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公开(公告)号：US10332683B2
公开(公告)日：2019-06-25
申请号：US15717431
申请日：2017-09-27
Applicant: Apple Inc.
Inventor： Behzad Reyhani Masoleh , Ming Y. Tsai , Paul A. Martinez , Scott D. Morrison , Tracey L. Chavers
IPC: H01G4/248 , H01G4/30 , H01G4/002 , H01G4/224 , H05K1/02 , H05K1/18 , H05K1/11 , H01G4/232 , H05K3/34
Abstract: Capacitor devices with electrodes that are geometrically arranged to reduce parasitic capacitances are described. The capacitors may be multilayer ceramic capacitor (MLCC) structures in which certain electrodes may have a clearance from a capacitor structure wall, such as top wall. In circuits and devices where that particular capacitor wall may be placed near a shielding structure, the clearance may reduce unintended parasitic capacitances between the shield structure and the electrodes. As a result, the shield structures may be placed closer to the electronic components, which may allow circuit boards and electronic devices with a lower profile.
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公开(公告)号：US20190157898A1
公开(公告)日：2019-05-23
申请号：US16260061
申请日：2019-01-28
Applicant: Apple Inc.
Inventor： Steven G. Herbst , Scott D. Morrison , Jeffrey M. Alves , Brandon R. Garbus , Jim C. Hwang , Robert S. Parnell , Terry L. Tikalsky
Abstract: A receiver device in an inductive energy transfer system can include a touch sensing device. If the input surface of the touch sensing device is touched, a transmitter device can periodically stop transferring energy to allow the touch sensing device to sense touch samples while inductive energy transfer is inactive. Additionally or alternatively, a transmitter device can produce an averaged duty cycle by transferring energy to the receiver device for one or more periods at a first duty cycle step and for one or more periods at different second first duty cycle step. Additionally or alternatively, a transmitter device can reduce a current level received by a DC-to-AC converter if the current received by the DC-to-AC converter equals or exceeds a threshold. Additionally or alternatively, a transmitter device can ping a receiver device and transfer energy only after a response signal is received from the receiver device.
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公开(公告)号：US20170208690A1
公开(公告)日：2017-07-20
申请号：US15275369
申请日：2016-09-24
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Curtis C. Mead , Scott D. Morrison , Giancarlo F. De La Cruz , Lin Chen , Albert Wang , Brad W. Simeral , Vu Vo , Wyeman Chen
IPC: H05K1/18 , H05K1/11 , H01G4/30 , H01G4/228 , H01G4/38 , H01G4/005 , H01G2/06 , H05K3/30 , H01G4/40
Abstract: Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.
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