公开(公告)号：US20190096581A1

公开(公告)日：2019-03-28

申请号：US15717431

申请日：2017-09-27

Applicant: Apple Inc.

Inventor： Behzad Reyhani Masoleh ,  Ming Y. Tsai ,  Paul A. Martinez ,  Scott D. Morrison ,  Tracey L. Chavers

IPC: H01G4/248 ,  H01G4/30 ,  H01G4/002 ,  H01G4/224 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01G4/248 ,  H01G2/22 ,  H01G4/002 ,  H01G4/005 ,  H01G4/224 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/181 ,  H05K3/34 ,  H05K2201/10015 ,  H05K2201/10371

Abstract: Capacitor devices with electrodes that are geometrically arranged to reduce parasitic capacitances are described. The capacitors may be multilayer ceramic capacitor (MLCC) structures in which certain electrodes may have a clearance from a capacitor structure wall, such as top wall. In circuits and devices where that particular capacitor wall may be placed near a shielding structure, the clearance may reduce unintended parasitic capacitances between the shield structure and the electrodes. As a result, the shield structures may be placed closer to the electronic components, which may allow circuit boards and electronic devices with a lower profile.

公开(公告)号：US10332683B2

公开(公告)日：2019-06-25

申请号：US15717431

申请日：2017-09-27

Applicant: Apple Inc.

Inventor： Behzad Reyhani Masoleh ,  Ming Y. Tsai ,  Paul A. Martinez ,  Scott D. Morrison ,  Tracey L. Chavers

IPC: H01G4/248 ,  H01G4/30 ,  H01G4/002 ,  H01G4/224 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H01G4/232 ,  H05K3/34

Abstract: Capacitor devices with electrodes that are geometrically arranged to reduce parasitic capacitances are described. The capacitors may be multilayer ceramic capacitor (MLCC) structures in which certain electrodes may have a clearance from a capacitor structure wall, such as top wall. In circuits and devices where that particular capacitor wall may be placed near a shielding structure, the clearance may reduce unintended parasitic capacitances between the shield structure and the electrodes. As a result, the shield structures may be placed closer to the electronic components, which may allow circuit boards and electronic devices with a lower profile.