公开(公告)号：US20220071013A1

公开(公告)日：2022-03-03

申请号：US17005607

申请日：2020-08-28

Applicant: Apple Inc.

Inventor： Scott D. Morrison ,  Karthik Shanmugam ,  Raymundo M. Camenforte ,  Rakshit Agrawal ,  Flynn P. Carson ,  Kiranjit Dhaliwal

IPC: H05K1/18 ,  H01L23/00

Abstract: Wafer level passive array packages, modules, and methods of fabrication are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.