公开(公告)号：US12095185B2

公开(公告)日：2024-09-17

申请号：US17478221

申请日：2021-09-17

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Manoj Vadeentavida ,  Jing Tao

IPC: H01R12/71 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/62 ,  H01R12/79 ,  H01R13/62 ,  H01R13/631

CPC classification number: H01R12/718 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/62 ,  H01R12/79 ,  H01R13/6205 ,  H01R13/631

Abstract: Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

公开(公告)号：US20230026254A1

公开(公告)日：2023-01-26

申请号：US17381931

申请日：2021-07-21

Applicant: Apple Inc.

Inventor： Dennis R. Pyper ,  Leilei Zhang ,  Lan H. Hoang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/58

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

公开(公告)号：US12040262B2

公开(公告)日：2024-07-16

申请号：US17381931

申请日：2021-07-21

Applicant: Apple Inc.

Inventor： Dennis R. Pyper ,  Leilei Zhang ,  Lan H. Hoang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/58 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/49822 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/49894 ,  H01L23/58 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4985 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16227

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

公开(公告)号：US20230078536A1

公开(公告)日：2023-03-16

申请号：US17832346

申请日：2022-06-03

Applicant: Apple Inc.

Inventor： Ali N. Ergun ,  Bilal Mohamed Ibrahim Kani ,  Chang Liu ,  Ethan L. Huwe ,  Jeffrey J. Terlizzi ,  Jerzy S. Guterman ,  Jue Wang ,  Kishore N. Renjan ,  Kyusang Kim ,  Lan H. Hoang ,  Mandar S. Painaik ,  Manoj Vadeentavida ,  Sarah B. Gysbers ,  Takayoshi Katahira ,  Zhiqi Wang

IPC: H05K1/02 ,  H05K1/11 ,  H01Q1/22 ,  H01Q1/36

Abstract: System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.

公开(公告)号：US20230056922A1

公开(公告)日：2023-02-23

申请号：US17806412

申请日：2022-06-10

Applicant: Apple Inc.

Inventor： Bilal Mohamed Ibrahim Kani ,  Ali N. Ergun ,  Kishore N. Renjan ,  Kyusang Kim ,  Manoj Vadeentavida ,  Benjamin J. Grena ,  David M. Kindlon ,  Lan H. Hoang

IPC: H01L25/16 ,  H01L23/498 ,  H01R12/79 ,  H01R13/6581 ,  H01L23/31 ,  H01R12/62 ,  H01L21/56 ,  H01R43/20 ,  H01R12/59 ,  G01D11/24

Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

公开(公告)号：US11462461B2

公开(公告)日：2022-10-04

申请号：US16892126

申请日：2020-06-03

Applicant: Apple Inc.

Inventor： Leilei Zhang ,  Lan H. Hoang

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/31

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

公开(公告)号：US10602612B1

公开(公告)日：2020-03-24

申请号：US16512280

申请日：2019-07-15

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira ,  Leilei Zhang ,  Raghunandan R. Chaware

IPC: H05K1/14 ,  H05K1/11

Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.

公开(公告)号：US20190098762A1

公开(公告)日：2019-03-28

申请号：US15713453

申请日：2017-09-22

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira

IPC: H05K1/18 ,  H05K1/11 ,  H05K7/14

CPC classification number: H05K1/182 ,  H05K1/112 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K1/145 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4691 ,  H05K7/1422 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: Connectors that allow system-in-package modules to connect to other circuits in an electronic device in an area-efficient manner.

公开(公告)号：US20190082534A1

公开(公告)日：2019-03-14

申请号：US15699946

申请日：2017-09-08

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Chang Liu

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

Abstract: Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.

公开(公告)号：US20180049311A1

公开(公告)日：2018-02-15

申请号：US15713705

申请日：2017-09-25

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K9/00 ,  H05K1/14 ,  H05K3/36 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4867 ,  H01L23/295 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/112 ,  H01L25/16 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2225/1058 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15322 ,  H01L2924/16251 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K3/341 ,  H05K3/368 ,  H05K3/4038 ,  H05K9/0024 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10287 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.