公开(公告)号：US20230089258A1

公开(公告)日：2023-03-23

申请号：US17478221

申请日：2021-09-17

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Manoj Vadeentavida ,  Jing Tao

IPC: H01R12/71 ,  H01R12/52 ,  H01R12/58 ,  H01R13/62 ,  H01R12/57 ,  H01R13/631 ,  H01R12/79 ,  H01R12/62

Abstract: Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

公开(公告)号：US12095185B2

公开(公告)日：2024-09-17

申请号：US17478221

申请日：2021-09-17

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Manoj Vadeentavida ,  Jing Tao

IPC: H01R12/71 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/62 ,  H01R12/79 ,  H01R13/62 ,  H01R13/631

CPC classification number: H01R12/718 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/62 ,  H01R12/79 ,  H01R13/6205 ,  H01R13/631

Abstract: Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.