-
公开(公告)号：US20230028370A1
公开(公告)日：2023-01-26
申请号：US17380491
申请日：2021-07-20
Applicant: Apple Inc.
Inventor： Alireza Pourghorban Saghati , Mohammed W. Mokhtar , Ali N. Ergun , Oren S. Levy , Arman Samimi-Dehkordi , Sean T. McIntosh
Abstract: An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.
-
公开(公告)号：US11240585B2
公开(公告)日：2022-02-01
申请号：US17023237
申请日：2020-09-16
Applicant: Apple Inc.
Inventor： Jeffrey J. Terlizzi , Kathleen A. Bergeron , Ali N. Ergun , Dustin A. Hatfield , Ethan L. Huwe , Todd P. Marco , Jason Joseph LeBlanc , Robert D. Zupke , Michael B. Minerbi , Prathamesh R. Bhagwat , Daniel R. Bloom
Abstract: A personal audio device (e.g., headphones, earphones) can have an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., headphone cushions or ear tips for earbuds). The cushioning member can include an identification tag that encodes identification data for the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity with a tag sensor in the earpiece and the earpiece can read the identification tag to determine identification data for the cushioning member. The identification data can be used to modify a behavior of the earpiece and/or of a host device communicably coupled to the earpiece.
-
公开(公告)号：US11689842B2
公开(公告)日：2023-06-27
申请号：US17555141
申请日：2021-12-17
Applicant: Apple Inc.
Inventor： Jeffrey J. Terlizzi , Kathleen A. Bergeron , Ali N. Ergun , Dustin A. Hatfield , Ethan L. Huwe , Todd P. Marco , Jason Joseph LeBlanc , Robert D. Zupke , Michael B. Minerbi , Prathamesh R. Bhagwat , Daniel R. Bloom
CPC classification number: H04R1/1041 , H04R1/1016 , H04R2420/07 , H04R2460/01
Abstract: A personal audio device (e.g., headphones, earphones) can have an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., headphone cushions or ear tips for earbuds). The cushioning member can include an identification tag that encodes identification data for the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity with a tag sensor in the earpiece and the earpiece can read the identification tag to determine identification data for the cushioning member. The identification data can be used to modify a behavior of the earpiece and/or of a host device communicably coupled to the earpiece.
-
公开(公告)号：US20230022471A1
公开(公告)日：2023-01-26
申请号：US17900720
申请日：2022-08-31
Applicant: Apple Inc.
Inventor： Alireza Pourghorban Saghati , Mohammed W. Mokhtar , Ali N. Ergun , Oren S. Levy , Arman Samimi-Dehkordi , Sean T. McIntosh
Abstract: An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.
-
公开(公告)号：US12148741B2
公开(公告)日：2024-11-19
申请号：US17806412
申请日：2022-06-10
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
IPC: H05K1/02 , G01D11/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L25/16 , H01R12/59 , H01R12/62 , H01R12/79 , H01R13/6581 , H01R43/20 , H05K1/18 , H05K3/14 , H05K3/18 , H10K59/131
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
-
Patent Agency Ranking
公开(公告)号：US11831061B2
公开(公告)日：2023-11-28
申请号：US17900720
申请日：2022-08-31
Applicant: Apple Inc.
Inventor： Alireza Pourghorban Saghati , Mohammed W. Mokhtar , Ali N. Ergun , Oren S. Levy , Arman Samimi-Dehkordi , Sean T. McIntosh
CPC classification number: H01P5/028 , H01P3/08 , H04R1/1091 , H05K1/0243 , H04R2420/07 , H05K2201/10083 , H05K2201/10098
Abstract: An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.
-
公开(公告)号：US11765838B2
公开(公告)日：2023-09-19
申请号：US17407670
申请日：2021-08-20
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
CPC classification number: H05K3/363 , H05K1/189 , H05K3/0014 , H05K3/3436 , H05K3/4038 , H05K2201/10151 , H05K2203/048
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
-
公开(公告)号：US20240080970A1
公开(公告)日：2024-03-07
申请号：US18122339
申请日：2023-03-16
Applicant: Apple Inc.
Inventor： Leilei ZHANG , Abhay Maheshwari , Ali N. Ergun , Arun Chawan
CPC classification number: H05K1/028 , H01L23/3135 , H01L25/162 , H05K1/189 , H05K3/284 , H01L25/0655
Abstract: Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.
-
公开(公告)号：US20230055647A1
公开(公告)日：2023-02-23
申请号：US17407670
申请日：2021-08-20
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
-
公开(公告)号：US20220116697A1
公开(公告)日：2022-04-14
申请号：US17555141
申请日：2021-12-17
Applicant: Apple Inc.
Inventor： Jeffrey J. Terlizzi , Kathleen A. Bergeron , Ali N. Ergun , Dustin A. Hatfield , Ethan L. Huwe , Todd P. Marco , Jason Joseph LeBlanc , Robert D. Zupke , Michael B. Minerbi , Prathamesh R. Bhagwat , Daniel R. Bloom
IPC: H04R1/10
Abstract: A personal audio device (e.g., headphones, earphones) can have an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., headphone cushions or ear tips for earbuds). The cushioning member can include an identification tag that encodes identification data for the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity with a tag sensor in the earpiece and the earpiece can read the identification tag to determine identification data for the cushioning member. The identification data can be used to modify a behavior of the earpiece and/or of a host device communicably coupled to the earpiece.
-
-
-
-
-
-
-
-
-
Search Results
17
records
(took 0.013 seconds)
