-
公开(公告)号：US20250048576A1
公开(公告)日：2025-02-06
申请号：US18915613
申请日：2024-10-15
Applicant: Apple Inc.
Inventor： Abhijeet Misra , Hoishun Li , Todd S. Mintz , Isabel Yang , James A. Curran , Lei Gao , Chuan Liu , Yu Yan
Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
-
公开(公告)号：US20240373575A1
公开(公告)日：2024-11-07
申请号：US18651139
申请日：2024-04-30
Applicant: Apple Inc.
Inventor： Abhijeet Misra , Hoishun Li , Todd S. Mintz , Isabel Yang , James A. Curran , Lei Gao , Chuan Liu , Yu Yan
Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
-
公开(公告)号：US12114453B2
公开(公告)日：2024-10-08
申请号：US16449061
申请日：2019-06-21
Applicant: Apple Inc.
Inventor： William A. Counts , Andrew W. Meschke , Lei Gao , Abhijeet Misra , Alexander W. Williams , Hoishun Li , Lee E. Hooton , Michael B. Wittenberg , James A. Yurko
CPC classification number: H05K5/04 , A45C11/00 , G06F1/1626 , H04M1/0283 , H05K5/0004 , H05K5/0213 , H05K5/03 , A45C2011/002 , G06F2200/1633
Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.
-
公开(公告)号：US20240284624A1
公开(公告)日：2024-08-22
申请号：US18650720
申请日：2024-04-30
Applicant: Apple Inc.
Inventor： William A. Counts , Andrew W. Meschke , Lei Gao , Abhijeet Misra , Alexander W. Williams , Hoishun Li , Lee E. Hooton , Michael B. Wittenberg , James A. Yurko
CPC classification number: H05K5/04 , A45C11/00 , G06F1/1626 , H04M1/0283 , H05K5/0004 , H05K5/0213 , H05K5/03 , A45C2011/002 , G06F2200/1633
Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.
-
公开(公告)号：US20210159477A1
公开(公告)日：2021-05-27
申请号：US16953656
申请日：2020-11-20
Applicant: Apple Inc.
Inventor： Hoishun Li , Herng-Jeng Jou , James A. Yurko , Wai Man Raymund Kwok , Zechariah D. Feinberg , Daniel C. Wagman , Eric S. Jol , Hani Esmaeili
IPC: H01M2/26 , H01M10/0525 , C22C5/06 , C22C9/00
Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.
-
Patent Agency Ranking
公开(公告)号：US20200245487A1
公开(公告)日：2020-07-30
申请号：US16449061
申请日：2019-06-21
Applicant: Apple Inc.
Inventor： William A. Counts , Andrew W. Meschke , Lei Gao , Abhijeet Misra , Alexander W. Williams , Hoishun Li , Lee E. Hooton , Michael B. Wittenberg , James A. Yurko
Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.
-
公开(公告)号：US10372166B2
公开(公告)日：2019-08-06
申请号：US15212029
申请日：2016-07-15
Applicant: Apple Inc.
Inventor： Brian M. Gable , Carlo Di Nallo , Colin M. Ely , Craig A. Horton , Erik G. de Jong , Fletcher R. Rothkopf , Henry B. Wettersten , Hoishun Li , Jason C. Sauers , Jayesh Nath , Mario Martinis , Mattia Pascolini , Michael P. Coleman , Rex T. Ehman , Zheyu Wang
IPC: G06F1/16 , H01Q1/22 , H04B1/3888 , H04M1/02 , H05K5/00 , H05K5/04 , B29C70/76 , H01Q1/24 , H01Q21/28 , H04M1/18 , B29L31/34
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
-
18.发明授权公开(公告)号：US12205399B2
公开(公告)日：2025-01-21
申请号：US18331867
申请日：2023-06-08
Applicant: Apple Inc.
Inventor： Daniel J. Hiemstra , George Ho Yin Mak , Ehsan Khajeh , Hoishun Li
Abstract: Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.
-
公开(公告)号：US12150264B1
公开(公告)日：2024-11-19
申请号：US18651139
申请日：2024-04-30
Applicant: Apple Inc.
Inventor： Abhijeet Misra , Hoishun Li , Todd S. Mintz , Isabel Yang , James A. Curran , Lei Gao , Chuan Liu , Yu Yan
Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
-
公开(公告)号：US20240373574A1
公开(公告)日：2024-11-07
申请号：US18461458
申请日：2023-09-05
Applicant: Apple Inc.
Inventor： Abhijeet Misra , Hoishun Li , Todd S. Mintz , Isabel Yang , James A. Curran , Lei Gao , Chuan Liu , Yu Yan
Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
-
-
-
-
-
-
-
-
-
Search Results
24
records
(took 0.017 seconds)
