ENHANCED DEPOSITION RATE BY THERMAL ISOLATION COVER FOR GIS MANIPULATOR

    公开(公告)号:US20240062990A1

    公开(公告)日:2024-02-22

    申请号:US17891028

    申请日:2022-08-18

    Abstract: A system for depositing material over a sample in a localized region of the sample, the system including: a vacuum chamber; a thermal mass disposed outside the vacuum chamber; a sample support configured to hold a sample within the vacuum chamber during a sample evaluation process; a charged particle beam column configured to direct a charged particle beam into the vacuum chamber toward the sample such that the charged particle beam collides with the sample in a deposition region; a gas injection system configured to deliver a process gas to the deposition region of the sample; and a thermal isolation shield spaced apart from and disposed between the gas injection system and the sample, wherein the thermal isolation shield has a high thermal conductivity and a low emissivity and is thermally coupled to the thermal mass to transfer heat radiated from the gas injection system to the thermal mass.

    Back-scatter electrons (BSE) imaging with a SEM in tilted mode using cap bias voltage

    公开(公告)号:US11626267B2

    公开(公告)日:2023-04-11

    申请号:US17243478

    申请日:2021-04-28

    Abstract: A method of evaluating a region of a sample, the method comprising: positioning a sample within a vacuum chamber; generating an electron beam with a scanning electron microscope (SEM) column that includes an electron gun at one end of the column and a column cap at an opposite end of the column; focusing the electron beam on the sample and scanning the focused electron beam across the region of the sample, while the SEM column is operated in tilted mode, thereby generating secondary electrons and backscattered electrons from within the region; and during the scanning, collecting backscattered electrons with one or more detectors while applying a negative bias voltage to the column cap to alter a trajectory of the secondary electrons preventing the secondary electrons from reaching the one or more detectors.

    ANALYZING A SIDEWALL OF HOLE MILLED IN A SAMPLE TO DETERMINE THICKNESS OF A BURIED LAYER

    公开(公告)号:US20230057148A1

    公开(公告)日:2023-02-23

    申请号:US17408876

    申请日:2021-08-23

    Abstract: Analyzing a sidewall of a hole milled in a sample to determine thickness of a buried layer includes milling the hole in the sample using a charged particle beam of a focused ion beam (FIB) column to expose the buried layer along the sidewall of the hole. After milling, the sidewall of the hole has a known slope angle. From a perspective relative to a surface of the sample, a distance is measured between a first point on the sidewall corresponding to an upper surface of the buried layer and a second point on the sidewall corresponding to a lower surface of the buried layer. The thickness of the buried layer is determined using the known slope angle of the sidewall, the distance, and the angle relative to the surface of the sample.

    ANALYZING A BURIED LAYER OF A SAMPLE

    公开(公告)号:US20230019567A1

    公开(公告)日:2023-01-19

    申请号:US17378999

    申请日:2021-07-19

    Abstract: Analyzing a buried layer on a sample includes milling a spot on the sample using a charged particle beam of a focused ion beam (FIB) column to expose the buried layer along a sidewall of the spot. From a first perspective a first distance is measured between a first point on the sidewall corresponding to an upper surface of the buried layer and a second point on the sidewall corresponding to a lower surface of the buried layer. From a second perspective a second distance is measured between the first point on the sidewall corresponding to the upper surface of the buried layer and the second point on the sidewall corresponding to the lower surface of the buried layer. A thickness of the buried layer is determined using the first distance and the second distance.

    X-RAY IMAGING IN CROSS-SECTION USING UN-CUT LAMELLA WITH BACKGROUND MATERIAL

    公开(公告)号:US20220367146A1

    公开(公告)日:2022-11-17

    申请号:US17320526

    申请日:2021-05-14

    Abstract: A method of performing x-ray spectroscopy material analysis of a region of interest within a cross-section of a sample using an evaluation system that includes a focused ion beam (FIB) column, a scanning electron microscope (SEM) column, and an x-ray detector, including: forming a lamella having first and second opposing side surfaces in the sample by milling, with the FIB column, first and second trenches in the sample to expose the first and second sides surface of the lamella, respectively; depositing background material in the second trench, wherein the background material is selected such that the background material does not include any chemical elements that are expected to be within the region of interest of the sample; generating a charged particle beam with the SEM column and scanning the charged particle beam across a region of interest on the first side surface of the lamella such that the charged particle beam collides with the first side surface of the lamella at a non-vertical angle; and detecting x-rays generated while the region of interest is scanned by the charged particle beam.

    Holes tilt angle measurement using FIB diagonal cut

    公开(公告)号:US11280749B1

    公开(公告)日:2022-03-22

    申请号:US17079297

    申请日:2020-10-23

    Abstract: A method of evaluating a region of a sample that includes a plurality of holes, wherein the method includes: taking a first image of the region by scanning the region with a first charged particle beam; evaluating the first image to determine a first center-to-center distance between first and second holes in the plurality of holes; milling a diagonal cut in an area within the region that includes the second hole at an angle such that an upper surface of the sample in the milled area where the second hole is located is recessed with respect to an upper surface of the sample where the first hole is located; thereafter, taking a second image of the region by scanning the region with the first charged particle beam; evaluating the second image to determine a second center-to-center distance between first and second holes in the plurality of holes; and comparing the second center-to-center distance to the first center-to-center distance.

    PRECISION IN STEREOSCOPIC MEASUREMENTS USING A PRE-DEPOSITION LAYER

    公开(公告)号:US20240153738A1

    公开(公告)日:2024-05-09

    申请号:US17983225

    申请日:2022-11-08

    Inventor: Yehuda Zur

    CPC classification number: H01J37/28 H01J37/222 H01J2237/2815

    Abstract: A method of determining the depth of a hole milled into a first region of a sample, the method comprising: positioning the sample in a processing chamber having a charged particle beam column; depositing material directly over a top surface of the sample in a second region of the sample adjacent to the first region; milling the hole in the first region of the sample using a charged particle beam generated by the charged particle beam column, wherein the hole abuts the material deposited over the top surface and includes a sidewall that extends from a bottom surface of the hole to an interface between the deposited material and the top surface of the sample; and using stereoscopic measurement techniques to calculate the depth of the hole based on distance measurements between a first point along an interface between the material and the top surface and a second point along a bottom surface of the hole.

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