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公开(公告)号：US20230052048A1
公开(公告)日：2023-02-16
申请号：US17946547
申请日：2022-09-16
Applicant: Applied Materials, Inc.
Inventor： Ashavani KUMAR , Ashwin CHOCKALINGAM , Sivapackia GANAPATHIAPPAN , Rajeev BAJAJ , Boyi FU , Daniel REDFIELD , Nag B. PATIBANDLA , Mario Dagio CORNEJO , Amritanshu SINHA , Yan ZHAO , Ranga Rao ARNEPALLI , Fred C. REDEKER
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号：US20220362904A1
公开(公告)日：2022-11-17
申请号：US17321694
申请日：2021-05-17
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Uma SRIDHAR , Yingdong LUO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Sebastian David ROZO , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA , Hou T. NG , Sudhakar MADHUSOODHANAN
IPC: B24B37/24
Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.
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公开(公告)号：US20180261720A1
公开(公告)日：2018-09-13
申请号：US15980583
申请日：2018-05-15
Applicant: Applied Materials, Inc.
Inventor： Mingwei ZHU , Nag B. PATIBANDLA , Rongjun WANG , Daniel Lee DIEHL , Vivek AGRAWAL , Anantha Subramani
CPC classification number: H01L33/12 , H01J37/32467 , H01J37/32724 , H01J37/3405 , H01J37/347 , H01L29/2003 , H01L31/1856 , H01L33/007 , H01L33/0075 , Y02E10/544
Abstract: Oxygen controlled PVD AlN buffers for GaN-based optoelectronic and electronic devices is described. Methods of forming a PVD AlN buffer for GaN-based optoelectronic and electronic devices in an oxygen controlled manner are also described. In an example, a method of forming an aluminum nitride (AlN) buffer layer for GaN-based optoelectronic or electronic devices involves reactive sputtering an AlN layer above a substrate, the reactive sputtering involving reacting an aluminum-containing target housed in a physical vapor deposition (PVD) chamber with a nitrogen-containing gas or a plasma based on a nitrogen-containing gas. The method further involves incorporating oxygen into the AlN layer.
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公开(公告)号：US20160107295A1
公开(公告)日：2016-04-21
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20240234655A9
公开(公告)日：2024-07-11
申请号：US18490847
申请日：2023-10-20
Applicant: Applied Materials, Inc.
Inventor： Zhiyong LI , Sivapackia GANAPATHIAPPAN , Mingwei ZHU , Nag B. PATIBANDLA , Hou T. NG , Lisong XU , Ding KAI , Kulandaivelu SIVANANDAN
CPC classification number: H01L33/60 , H01L25/167 , H01L2933/0058
Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device includes a backplane, at least three LEDs disposed on the backplane, subpixel isolation (SI) structures disposed defining wells of at least three subpixels, a reflection material is disposed on sidewalls and a top surface of the SI structures, at least three of the subpixels have a color conversion material disposed in the wells, an encapsulation layer disposed over the subpixel isolation structures and the subpixels, a light filter layer disposed over the encapsulation layer and micro-lenses disposed over the light filter layer and over each of the wells of the subpixels.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20200001433A1
公开(公告)日：2020-01-02
申请号：US16541641
申请日：2019-08-15
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Ashwin CHOCKALINGAM , Ashavani KUMAR , Fred C. REDEKER , Nag B. PATIBANDLA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20190224809A1
公开(公告)日：2019-07-25
申请号：US16373121
申请日：2019-04-02
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Fred C. REDEKER , Mahendra C. ORILALL , Boyi FU , Mayu YAMAMURA , Ashwin CHOCKALINGAM
Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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公开(公告)号：US20170203406A1
公开(公告)日：2017-07-20
申请号：US15394044
申请日：2016-12-29
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Fred C. REDEKER , Mahendra C. ORILALL , Boyi FU , Mayu YAMAMURA
Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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公开(公告)号：US20160114458A1
公开(公告)日：2016-04-28
申请号：US14920801
申请日：2015-10-22
Applicant: APPLIED MATERIALS, INC.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava REDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
CPC classification number: B24B37/26 , B24B37/22 , B24B37/24 , B24D3/28 , B24D11/00 , B24D11/001 , B24D11/04 , B33Y10/00 , B33Y80/00
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
Abstract translation: 本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能性聚合物，功能低聚物，反应性稀释剂和固化剂。 例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。
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20.发明申请公开(公告)号：US20160107381A1
公开(公告)日：2016-04-21
申请号：US14863409
申请日：2015-09-23
Applicant: Applied Materials, Inc.
Inventor： Kasiraman KRISHNAN , Daniel REDFIELD , Russell Edward PERRY , Gregory E. MENK , Rajeev BAJAJ , Fred C. REDEKER , Nag B. PATIBANDLA , Mahendra C. ORILALL , Jason G. FUNG
CPC classification number: B29C64/112 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/001 , B29K2105/16 , B29K2995/007 , B29L2031/736
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
Abstract translation: 一种抛光制品制造系统，包括进料部分和卷取部分，所述卷取部分包括供料辊，所述供料辊具有设置在其上用于化学机械抛光工艺的抛光制品，所述打印部分包括设置在所述进料之间的多个打印头 以及设置在所述进料部和所述卷取部之间的固化部，所述固化部包括热固化装置和电磁固化装置中的一个或两个。
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