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公开(公告)号:US20240234655A9
公开(公告)日:2024-07-11
申请号:US18490847
申请日:2023-10-20
Applicant: Applied Materials, Inc.
Inventor: Zhiyong LI , Sivapackia GANAPATHIAPPAN , Mingwei ZHU , Nag B. PATIBANDLA , Hou T. NG , Lisong XU , Ding KAI , Kulandaivelu SIVANANDAN
CPC classification number: H01L33/60 , H01L25/167 , H01L2933/0058
Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device includes a backplane, at least three LEDs disposed on the backplane, subpixel isolation (SI) structures disposed defining wells of at least three subpixels, a reflection material is disposed on sidewalls and a top surface of the SI structures, at least three of the subpixels have a color conversion material disposed in the wells, an encapsulation layer disposed over the subpixel isolation structures and the subpixels, a light filter layer disposed over the encapsulation layer and micro-lenses disposed over the light filter layer and over each of the wells of the subpixels.
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公开(公告)号:US20240136485A1
公开(公告)日:2024-04-25
申请号:US18490847
申请日:2023-10-19
Applicant: Applied Materials, Inc.
Inventor: Zhiyong LI , Sivapackia GANAPATHIAPPAN , Mingwei ZHU , Nag B. PATIBANDLA , Hou T. NG , Lisong XU , Ding KAI , Kulandaivelu SIVANANDAN
CPC classification number: H01L33/60 , H01L25/167 , H01L2933/0058
Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device includes a backplane, at least three LEDs disposed on the backplane, subpixel isolation (SI) structures disposed defining wells of at least three subpixels, a reflection material is disposed on sidewalls and a top surface of the SI structures, at least three of the subpixels have a color conversion material disposed in the wells, an encapsulation layer disposed over the subpixel isolation structures and the subpixels, a light filter layer disposed over the encapsulation layer and micro-lenses disposed over the light filter layer and over each of the wells of the subpixels.
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