公开(公告)号：US20240136485A1

公开(公告)日：2024-04-25

申请号：US18490847

申请日：2023-10-19

Applicant: Applied Materials, Inc.

Inventor： Zhiyong LI ,  Sivapackia GANAPATHIAPPAN ,  Mingwei ZHU ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Lisong XU ,  Ding KAI ,  Kulandaivelu SIVANANDAN

IPC: H01L33/60 ,  H01L25/16

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L2933/0058

Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device includes a backplane, at least three LEDs disposed on the backplane, subpixel isolation (SI) structures disposed defining wells of at least three subpixels, a reflection material is disposed on sidewalls and a top surface of the SI structures, at least three of the subpixels have a color conversion material disposed in the wells, an encapsulation layer disposed over the subpixel isolation structures and the subpixels, a light filter layer disposed over the encapsulation layer and micro-lenses disposed over the light filter layer and over each of the wells of the subpixels.

公开(公告)号：US20240234655A9

公开(公告)日：2024-07-11

申请号：US18490847

申请日：2023-10-20

Applicant: Applied Materials, Inc.

Inventor： Zhiyong LI ,  Sivapackia GANAPATHIAPPAN ,  Mingwei ZHU ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Lisong XU ,  Ding KAI ,  Kulandaivelu SIVANANDAN

IPC: H01L33/60 ,  H01L25/16

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L2933/0058

Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device includes a backplane, at least three LEDs disposed on the backplane, subpixel isolation (SI) structures disposed defining wells of at least three subpixels, a reflection material is disposed on sidewalls and a top surface of the SI structures, at least three of the subpixels have a color conversion material disposed in the wells, an encapsulation layer disposed over the subpixel isolation structures and the subpixels, a light filter layer disposed over the encapsulation layer and micro-lenses disposed over the light filter layer and over each of the wells of the subpixels.

公开(公告)号：US20240145624A1

公开(公告)日：2024-05-02

申请号：US18493426

申请日：2023-10-24

Applicant: Applied Materials, Inc.

Inventor： Peiwen LIU ,  Hyunsung BANG ,  Jianfeng SUN ,  Lisong XU ,  Zhiyong LI ,  Sivapackia GANAPATHIAPPAN ,  Mingwei ZHU ,  Hou T. NG ,  Nag. B. PATIBANDLA

IPC: H01L33/06 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58

CPC classification number: H01L33/06 ,  H01L33/502 ,  H01L33/52 ,  H01L33/58 ,  H01L2933/0041

Abstract: A pixel herein includes a color panel, a light emitting diode (LED) panel, and an adhesive layer disposed between the color panel and the LED panel. The color panel includes a transparent layer, a plurality of sub-pixel isolation structures, and a plurality of black matrix structures disposed between the plurality of sub-pixel isolation structures and the transparent layer. The sub-pixel isolation structures define a plurality color conversion wells of plurality of sub-pixels. A color conversion material is disposed in the color conversion well. The plurality of black matrix structures define a plurality of color resist wells of the plurality of sub-pixels. A color resist is disposed in the color resist wells. The LED panel includes a plurality of micro-LEDs disposed on a backplane. The plurality of micro-LEDs correspond to a sub-pixel.

公开(公告)号：US20240145642A1

公开(公告)日：2024-05-02

申请号：US18495550

申请日：2023-10-26

Applicant: Applied Materials, Inc.

Inventor： Jiacheng FAN ,  Zhiyong LI ,  Da HE

IPC: H01L33/50 ,  H01L25/16

CPC classification number: H01L33/505 ,  H01L25/167 ,  H01L33/502 ,  H01L2933/0041

Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. The pixel includes a plurality of sub-pixels. Each sub-pixel includes a backplane comprising a top surface, a plurality of sub-pixel isolation structures disposed over the backplane, a micro-LED disposed in the well, a color conversion material disposed over the micro-LED within a well, and a filter layer disposed over the sub-pixel isolation structures and the color conversion material. The sub-pixel isolation structures defining the well. The sub-pixel isolation structures include sidewalls and a top surface. The sidewalls are angled at an angle from the top surface of the backplane to the top surface of the sub-pixel isolation structures.