公开(公告)号：US20220362904A1

公开(公告)日：2022-11-17

申请号：US17321694

申请日：2021-05-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Uma SRIDHAR ,  Yingdong LUO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Sebastian David ROZO ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Sudhakar MADHUSOODHANAN

IPC: B24B37/24

Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.

公开(公告)号：US20220111579A1

公开(公告)日：2022-04-14

申请号：US17070854

申请日：2020-10-14

Applicant: Applied Materials, Inc.

Inventor： Daihua ZHANG ,  Uma SRIDHAR ,  Hou T. NG ,  Sivapackia GANAPATHIAPPAN ,  Nag B. PATIBANDLA

IPC: B29C64/112 ,  B29C64/264 ,  B29C64/209 ,  B29C64/245 ,  B29C64/232 ,  B33Y70/00 ,  A61F2/02

Abstract: A method of forming a three dimensional object includes dispensing droplets of an electromagnetic energy curable liquid onto a surface to form a plurality of layers of the three dimensional object in liquid form, wherein each droplet forms a layer of liquid on the surface which is larger than a minimum feature size of a structure to be formed by curing the curable liquid, and directing electromagnetic energy capable of curing the liquid and having a beam width intersecting the layer of liquid which is at least as small as the smallest feature of a structure to be formed in the curable liquid.

公开(公告)号：US20250056920A1

公开(公告)日：2025-02-13

申请号：US18797189

申请日：2024-08-07

Applicant: Applied Materials, Inc.

Inventor： Peiwen LIU ,  Uma SRIDHAR ,  Hyunsung BANG ,  Kai DING ,  Jeffrey L. FRANKLIN ,  Mingwei ZHU ,  Hou T. NG ,  Nag B. PATIBANDLA

IPC: H01L33/00 ,  H01L25/075

Abstract: The present disclosure provides devices and methods for repairing dice during micro-LED display fabrication. The devices include a backplane. The backplane has a plurality of backplane electrodes. Each backplane electrode includes a first material. A plurality of micro-LEDs having a plurality of micro-LED electrodes is included in the device. Each micro-LED electrode includes a second material. Each micro-LED electrode is bonded to each backplane electrode with an alloy of the first material and the second material therebetween. At least one backplane electrode is bonded to the micro-LED electrode via a repair material. The device includes a plurality of subpixel isolation (SI) structures formed over the backplane. The SI structures define wells of sub-pixels. Each well includes a respective micro-LED between adjacent SI structures. The sub-pixels have a color conversion material disposed in the wells.

公开(公告)号：US20200325353A1

公开(公告)日：2020-10-15

申请号：US16668961

申请日：2019-10-30

Applicant: Applied Materials, Inc.

Inventor： Uma SRIDHAR ,  Sivapackia GANAPATHIAPPAN ,  Ashwin CHOCKALINGAM ,  Yingdong LUO ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Sudhakar MADHUSOODHANAN

IPC: C09D11/38 ,  B24B37/24 ,  C09D11/107 ,  C09D11/101 ,  B33Y70/00 ,  B33Y80/00

Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.