公开(公告)号：US10218644B1

公开(公告)日：2019-02-26

申请号：US15705156

申请日：2017-09-14

Applicant: Apple Inc.

Inventor： Fernando A. Mujica ,  Joyce Y. Kwong ,  Leland W. Lew

IPC: H04L12/24 ,  H04L12/939 ,  H04L12/825 ,  H04L12/707

Abstract: Data generated by one or more data producers may be transmitted via multiple communication paths according to a path transmission scheme that divides transmission of different portions of the data amongst different communication paths. Upon a failure of a communication path, transmission of data may continue for those portions of data that are not assigned to the failed communication path. In some embodiments, modifications to the path transmission scheme may be made to change the division of data amongst remaining communication paths in the event of failure.

公开(公告)号：US10198726B2

公开(公告)日：2019-02-05

申请号：US14500927

申请日：2014-09-29

Applicant: Apple Inc.

Inventor： Cyril de la Cropte de Chanterac ,  Joseph Hakim ,  Leland W. Lew ,  Hue Duc Tran

IPC: G06Q20/36 ,  G06Q20/32 ,  H04W52/02 ,  G07F7/08

Abstract: This application relates to systems, methods, and apparatus for using a computing device to perform payment transactions while the computing device is operating in a low power wallet mode during a low battery state of the computing device. During a low power wallet mode, various subsystems are prevented from receiving current from a battery of the computing device, while a near field communication (NFC) system of the computing device is provided with an operating current for detecting target systems. A target system and the NFC system can communicate during the low power wallet mode of the computing device, thereby allowing a user of the computing device to conduct payment transactions when the computing device is in a low power wallet mode. Such payment transactions can be useful if the user is ever stranded without enough power to fully operate the computing device and needs to pay for transportation.

公开(公告)号：US09853676B2

公开(公告)日：2017-12-26

申请号：US14641317

申请日：2015-03-07

Applicant: Apple Inc.

Inventor： Leland W. Lew

IPC: H04W4/00 ,  H04B1/40 ,  H04B3/54 ,  H04L12/10

CPC classification number: H04B1/40 ,  H04B3/54 ,  H04L12/10

Abstract: Circuits, methods, and apparatus that may provide a wired communication path that is simple to implement and does not greatly increase costs and complexity. One example may provide an electronic device having wired data path, where the wired data path is implemented using a power connection. Data from a wireless signal path may be routed and combined with a power supply voltage. This combined signal may then be provided to, or received from, a second electronic device over the power connection. The combined signal may be provided at a power connection that may include a power and ground path, paths for multiple power supplies, or paths for multiple power supplies and ground.

公开(公告)号：US09236355B2

公开(公告)日：2016-01-12

申请号：US14331363

申请日：2014-07-15

Applicant: Apple Inc.

Inventor： Jun Zhai ,  Mengzhi Pang ,  Se Young Yang ,  Leland W. Lew

IPC: H01L23/60 ,  H01L23/538 ,  H01L23/485 ,  H01L23/552 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/367

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01029 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2224/81

Abstract: In some embodiments, a semiconductor device package assembly may include a first substrate. The first substrate may include a first set of electrical conductors which electrically connect the assembly. In some embodiments, the assembly may include at least one electrical conductor coupled to the first substrate such that at least one of the electrical conductors exposes through a perimeter surface of the semiconductor device package assembly. In some embodiments, the assembly may include a first die electrically connected to a second surface of the first substrate using a second set of electrical conductors. The assembly may include an electronic memory module coupled to the first die. In some embodiments, the assembly may include a shield applied to an upper surface of the assembly and electrically coupled to at least one of the exposed electrical conductors. The shield may inhibit, during use, electromagnetic interference.

Abstract translation: 在一些实施例中，半导体器件封装组件可以包括第一衬底。 第一衬底可以包括电连接组件的第一组电导体。 在一些实施例中，组件可以包括耦合到第一衬底的至少一个电导体，使得电导体中的至少一个暴露于半导体器件封装组件的周边表面。 在一些实施例中，组件可以包括使用第二组电导体电连接到第一衬底的第二表面的第一裸片。 组件可以包括耦合到第一管芯的电子存储器模块。 在一些实施例中，组件可以包括施加到组件的上表面并且电耦合到暴露的电导体中的至少一个的屏蔽。 在使用过程中，屏蔽可能会阻碍电磁干扰。