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公开(公告)号：US20180298236A1
公开(公告)日：2018-10-18
申请号：US15767496
申请日：2016-10-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Doreen Eckhardt , Claudia Torre , Regina Sikora , Kerstin Unverhau , Jan Wieneke , Frank Kuester , Jan Heimink , Jan Forster , Bettina Radek , Thomas Q. Chastek , Ross J. DeVolder , Shujun J. Wang , Robert D. Waid , Panu K. Zoller , Peggy S. Willett , Gregory B. Gadbois , Jeremy D. Unruh , Steven D. Bray , Jack J. Williams, III , Zhong Chen
Abstract: The present disclosure relates to a method of adhering a first part to a second part, wherein the first part and the second part are used for outdoor applications and comprise a thermoplastic or a thermosetting organic polymer. The present disclosure is also directed to a composite assembly comprising: a) a first part and a second part used for outdoor applications and comprising a thermoplastic or a thermosetting organic polymer; and b) a multilayer pressure sensitive adhesive foam tape as described in the present disclosure, wherein the first pressure sensitive adhesive layer is adhered to the first part, and the second pressure sensitive adhesive layer is adhered to the second part.
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公开(公告)号：US20180215964A1
公开(公告)日：2018-08-02
申请号：US15745531
申请日：2016-07-20
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jan U. Wieneke , Susanne H. Rieder-Otterburg , Frank Kuester , Simone Raynoschek , Armin Kayser , Krishna B. Uibel
IPC: C09J11/04 , C09J9/00 , C09J133/08 , C08K3/38 , C08K7/00
CPC classification number: C09J11/04 , C08K3/38 , C08K7/00 , C08K2003/385 , C08K2201/001 , C08K2201/003 , C08K2201/005 , C08K2201/014 , C09J9/00 , C09J133/06 , C09J133/08
Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d50 comprised between 100 and 420 m; ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 25 m; iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d50 which is lower than the first average agglomerate size d50; iv. optionally, a third type of hexagonal boron nitride primary particle agglomerates having a third average agglomerate size d50, wherein the third average agglomerate size d50 is lower than the first average agglomerate size d50 and is different from second average agglomerate size d50; and wherein the hexagonal boron nitride primary particles have a platelet shape; wherein the envelope density of the first type of agglomerates, and optionally, the second type of agglomerates and the third type of agglomerates, are comprised between 0.3 and 2.2 g/cm3, when measured according to the test method described in the experimental section; and wherein the content of the boron nitride mixture composition is greater than 15 vol %, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.
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公开(公告)号：US09845414B2
公开(公告)日：2017-12-19
申请号：US14889289
申请日：2014-05-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jan U. Wieneke , Frank Kuester , Zhong Chen , Jingjing Ma , Kerstin Unverhau , Doreen Eckhardt , Claudia Torre , Jonathan E. Janoski , Jayshree Seth , Arlin L. Weikel
CPC classification number: C09J7/0217 , B05D3/067 , B05D7/04 , B05D7/14 , B05D7/5423 , B32B37/26 , B32B2037/268 , B32B2333/12 , C08L2312/00 , C09J7/385 , C09J133/08 , C09J2201/36 , C09J2205/31 , C08F2220/1875 , C08F220/06 , C08F2220/1858
Abstract: The present disclosure relates to a multilayer pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer superimposed to a second polymer layer, wherein a curable liquid precursor of the first pressure sensitive adhesive polymer layer comprises a low Tg (meth)acrylate copolymer and a high Tg (meth)acrylate copolymer having a weight average molecular weight (Mw) of above 20,000 Daltons. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly and uses thereof.
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公开(公告)号：US20150307751A1
公开(公告)日：2015-10-29
申请号：US14443426
申请日：2013-11-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Doreen Eckhardt , Regina Sikora , Jan U. Wieneke , Jan D. Forster , Kerstin Unverhau , Frank Kuester
CPC classification number: B32B5/18 , B32B7/12 , B32B27/065 , B32B27/08 , B32B27/20 , B32B27/302 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/40 , B32B2264/101 , B32B2264/102 , B32B2266/0221 , B32B2266/0228 , B32B2266/0242 , B32B2266/025 , B32B2266/0278 , B32B2307/4026 , B32B2307/542 , B32B2307/728 , B32B2307/73 , B32B2605/00 , C08K7/22 , C08L2203/14 , C09J7/22 , C09J7/26 , C09J7/38 , C09J133/06 , C09J133/08 , C09J2201/36 , C09J2201/606 , C09J2205/102 , C09J2205/106 , C09J2205/11 , C09J2205/114 , C09J2400/24 , C09J2400/243 , C09J2433/00
Abstract: The present disclosure is directed to a multilayer pressure sensitive adhesive (PSA) assembly, comprising at least one pressure sensitive adhesive layer and a polymeric foam layer, wherein the pressure sensitive adhesive layer comprises a pressure-sensitive adhesive composition comprising a reaction product of a polymerizable material comprising: a) 2-propylheptyl acrylate as a first monomer; and optionally b) a second monomer having an ethylenically unsaturated group. The present disclosure is also directed to a method of manufacturing such a multilayer PSA assembly.
Abstract translation: 本公开涉及一种包含至少一个压敏粘合剂层和聚合物泡沫层的多层压敏粘合剂（PSA）组件，其中该压敏粘合剂层包括压敏粘合剂组合物，其包含可聚合的 材料包括：a）作为第一单体的丙烯酸2-丙基庚酯; 和任选地b）具有烯属不饱和基团的第二单体。 本公开还涉及制造这种多层PSA组件的方法。
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