公开(公告)号：US12148786B2

公开(公告)日：2024-11-19

申请号：US18505463

申请日：2023-11-09

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: H01L31/062 ,  G01R31/26 ,  H01L27/146 ,  H01L31/113

Abstract: An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips comprises a substrate structure and a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips. The substrate structure includes a circuit layer, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units. Each of the resilient conductive pillars comprises a non-conductive photoresist and a conductive layer entirely covering the non-conductive photoresist.

公开(公告)号：US20240235141A1

公开(公告)日：2024-07-11

申请号：US18404257

申请日：2024-01-04

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te CHEN

IPC: H01R43/02

CPC classification number: H01R43/0221

Abstract: An electronic device manufacturing system includes a fixture, a target platform, wire mechanisms and a wire breaking mechanism. The fixture has a substrate defining plural channels. The target platform is located at one side of the fixture and defines a plane and plural target positions. Each wire mechanism has a shaft and a wire. The channels of the fixture correspond to at least part of the target positions, and the wire mechanisms correspond to the channels, respectively. The wire of each wire mechanism passes through the corresponding channel, and the fixed end thereof is located at the other side of the fixture, while the free end thereof is located on the target platform and corresponds to one of the target positions. The wire breaking mechanism is located between the fixture and the target platform for cutting the wires so as to form plural wire segments.

公开(公告)号：US11940575B2

公开(公告)日：2024-03-26

申请号：US17872661

申请日：2022-07-25

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: G01T1/20 ,  G01T1/202

CPC classification number: G01T1/2018 ,  G01T1/202

Abstract: An image detector includes a substrate, a circuit layer, a plurality of light detecting elements, a plurality of driving elements and a crystal scintillation layer. The substrate has a surface. The circuit layer is arranged on the surface of the substrate, and defines a plurality of detecting areas arranged in an array. The light detecting elements and the driving elements are disposed at the detecting areas and electrically connected with the circuit layer. Each driving element drives one or more of the light detecting elements. The crystal scintillation layer is arranged opposite to the substrate and covers the detecting areas. The light detecting elements and the driving elements connect with the surface of the substrate. At least one of the light detecting elements and the driving elements is formed by a process different from the process of forming the circuit layer on the substrate.

公开(公告)号：US20240079438A1

公开(公告)日：2024-03-07

申请号：US18505463

申请日：2023-11-09

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te CHEN

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14603

Abstract: An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips comprises a substrate structure and a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips. The substrate structure includes a circuit layer, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units. Each of the resilient conductive pillars comprises a non-conductive photoresist and a conductive layer entirely covering the non-conductive photoresist.

公开(公告)号：US20210202281A1

公开(公告)日：2021-07-01

申请号：US17117352

申请日：2020-12-10

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te CHEN

IPC: H01L21/67

Abstract: A photoelectric device includes a target substrate, a circuit pattern layer disposed on the target substrate, a plurality of micro photoelectric elements electrically connected to the circuit pattern layer, and a supplemental repair element electrically connected to the circuit pattern layer. The target substrate is configured with a plurality of connection positions and a repair position disposed with an offset with relative to a corresponding one of the connection positions. The offset is greater than or equal to zero. The micro photoelectric elements are individually disposed on at least a part of the connection positions of the target substrate. The supplemental repair element has an electrode disposed on the repair position of the target substrate, and the electrode is connected to the circuit pattern layer. On the target substrate, the supplemental repair element is arbitrary with respect to the micro photoelectric elements.

公开(公告)号：US10431561B2

公开(公告)日：2019-10-01

申请号：US16137197

申请日：2018-09-20

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: H01L23/52 ,  H01L23/00 ,  H01L23/498

Abstract: A pre-conductive array disposed on a target circuit substrate comprises a plurality of conductive electrode groups disposed on the target circuit substrate, and at least a conductive particle dispose on each of conductive electrodes of a part or all of the conductive electrode groups. The at least a conductive particle and the corresponding conductive electrode form a pre-conductive structure, and the pre-conductive structures form the pre-conductive array.

公开(公告)号：US10340262B2

公开(公告)日：2019-07-02

申请号：US16236168

申请日：2018-12-28

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Yoshitaka Kajiyama

IPC: H01L25/00 ,  H01L21/683 ,  H01L25/13 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60

Abstract: An optoelectronic semiconductor device is disclosed. The optoelectronic semiconductor device includes a matrix substrate including a matrix circuit and a substrate, and a plurality of microsized optoelectronic semiconductor elements disposed separately and disposed on the matrix circuit. Each of the microsized optoelectronic semiconductor elements includes a first electrode and a second electrode, the matrix circuit includes a plurality of third electrodes and a plurality of fourth electrodes. The first electrodes are coupled with and electrically connected with the third electrodes respectively, or the second electrodes are coupled with and electrically connected with the fourth electrodes respectively. Reflectivities of at least some of junctions between the first electrode and the third electrode, or reflectivities of at least some of junctions between the second electrode and the fourth electrode are less than 20%.

公开(公告)号：US20190096835A1

公开(公告)日：2019-03-28

申请号：US16137197

申请日：2018-09-20

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te CHEN

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/06132 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/13078 ,  H01L2224/13082 ,  H01L2224/14132 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/97 ,  H01L2224/81

Abstract: A pre-conductive array disposed on a target circuit substrate comprises a plurality of conductive electrode groups disposed on the target circuit substrate, and at least a conductive particle dispose on each of conductive electrodes of a part or all of the conductive electrode groups. The at least a conductive particle and the corresponding conductive electrode form a pre-conductive structure, and the pre-conductive structures form the pre-conductive array.

公开(公告)号：US20170170160A1

公开(公告)日：2017-06-15

申请号：US15379962

申请日：2016-12-15

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Yung-Yu YEN

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/16 ,  H01L33/62 ,  H01L27/12

CPC classification number: H01L25/50 ,  H01L24/83 ,  H01L24/97 ,  H01L25/167 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/62 ,  H01L2224/83139 ,  H01L2224/83851 ,  H01L2224/83951 ,  H01L2224/95001 ,  H01L2224/95136 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2924/1515 ,  H01L2933/0066

Abstract: An opto-electronic apparatus and a manufacturing method thereof are disclosed. The manufacturing method of the opto-electronic apparatus includes the following steps of: disposing a matrix circuit on a substrate, wherein the matrix circuit has a matrix circuit thickness between the highest point of the matrix circuit and the surface of the substrate; disposing a plurality of first protrusions above the substrate, wherein at least one of the first protrusions has a first protrusion thickness between the highest point of the first protrusion and the surface of the substrate, and the first protrusion thickness is greater than the matrix circuit thickness; and performing a transfer step for transferring a plurality of first opto-electronic units from a first carrier to the first protrusions and bonding the first protrusions to at least two of the first opto-electronic units with an adhesive material.

公开(公告)号：US12154932B2

公开(公告)日：2024-11-26

申请号：US18300133

申请日：2023-04-13

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: H01L31/062 ,  G01R31/26 ,  H01L27/146 ,  H01L31/113

Abstract: An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips comprises a substrate structure and a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips. The substrate structure includes a circuit film, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units through a conductive pad. Each of the resilient conductive pillars is a conductive photoresist.