公开(公告)号：US10796628B2

公开(公告)日：2020-10-06

申请号：US16172463

申请日：2018-10-26

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: G09G3/34 ,  H04N5/367 ,  G09G3/32

Abstract: A luminance compensation method of a light-emitting device is disclosed. The light-emitting device has a plurality of light-emitting elements. The luminance compensation method includes following steps of: obtaining a position of at least one of the light-emitting elements in a brightness anomalous status; and changing a brightness of at least one of the light-emitting elements disposed adjacent to the light-emitting element in the brightness anomalous status for compensating a brightness of the light-emitting elements in the brightness anomalous status.

公开(公告)号：US11955453B2

公开(公告)日：2024-04-09

申请号：US17583364

申请日：2022-01-25

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: H01L23/00 ,  H01L25/04 ,  H01L25/075

CPC classification number: H01L24/73 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L25/0753 ,  H01L25/042 ,  H01L2224/1601 ,  H01L2224/16221 ,  H01L2224/17134 ,  H01L2224/2919 ,  H01L2224/32053 ,  H01L2224/32055 ,  H01L2224/32056 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32221 ,  H01L2224/33051 ,  H01L2224/33132 ,  H01L2224/33133 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/12043

Abstract: An electronic device includes a substrate, a plurality of micro semiconductor structure, a plurality of conductive members, and a non-conductive portion. The substrate has a first surface and a second surface opposite to each other. The micro semiconductor structures are distributed on the first surface of the substrate. The conductive members electrically connect the micro semiconductor structures to the substrate. Each conductive member is defined by an electrode of one of the micro semiconductor structures and a corresponding conductive pad on the substrate. The non-conductive portion is arranged on the first surface of the substrate. The non-conductive portion includes one or more non-conductive members, and the one or more non-conductive members are attached to the corresponding one or more conductive members of the one or more micro conductive structures.

公开(公告)号：US11538785B2

公开(公告)日：2022-12-27

申请号：US17131092

申请日：2020-12-22

Applicant: Ultra Display Technology Corp.

Inventor： Hsien-Te Chen

IPC: H01L23/00

Abstract: A method of using an optoelectronic semiconductor stamp to manufacture an optoelectronic semiconductor device comprises the following steps: a preparation step: preparing at least one optoelectronic semiconductor stamp group and a target substrate, wherein each optoelectronic semiconductor stamp group comprises at least one optoelectronic semiconductor stamp, each optoelectronic semiconductor stamp comprises a plurality of optoelectronic semiconductor components disposed on a heat conductive substrate, each optoelectronic semiconductor component has at least one electrode, and the target substrate has a plurality of conductive portions; an align-press step: aligning and attaching at least one optoelectronic semiconductor stamp to the target substrate, so that the electrodes are pressed on the corresponding conductive portions; and a bonding step: electrically connecting the electrodes to the corresponding conductive portions.

公开(公告)号：US10854566B2

公开(公告)日：2020-12-01

申请号：US16561546

申请日：2019-09-05

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: H01L23/52 ,  H01L23/00 ,  H01L33/62

Abstract: A pre-conductive array disposed on a target circuit substrate comprises a plurality of conductive electrode groups disposed on the target circuit substrate, and at least a conductive particle dispose on each of conductive electrodes of a part or all of the conductive electrode groups. The at least a conductive particle and the corresponding conductive electrode form a pre-conductive structure, and the pre-conductive structures form the pre-conductive array.

公开(公告)号：US10672347B2

公开(公告)日：2020-06-02

申请号：US16162752

申请日：2018-10-17

Applicant: Ultra Display Technology Corp.

Inventor： Hsien-Te Chen

IPC: G09G3/34 ,  G02F1/13357 ,  G02F1/1335 ,  H01L27/32

Abstract: A display device has a plurality of sub-pixels, and includes a circuit substrate, a plurality of micro light-emitting semiconductor elements, a light conversion layer and an opposite substrate. The micro light-emitting semiconductor elements are disposed separately on the circuit substrate and configured corresponding to the sub-pixels. The light conversion layer has a plurality of light conversion portions disposed respectively corresponding to at least partial of the micro light-emitting semiconductor elements. The light emitted from the micro light-emitting semiconductor element corresponding to the sub-pixel passes through the light conversion portion to generate white light. The opposite substrate is disposed at one side of the light conversion layer away from the circuit substrate. In another display device, the light emitted from the micro light-emitting semiconductor element passes through the light conversion layer to generate white light.

公开(公告)号：US12148786B2

公开(公告)日：2024-11-19

申请号：US18505463

申请日：2023-11-09

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: H01L31/062 ,  G01R31/26 ,  H01L27/146 ,  H01L31/113

Abstract: An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips comprises a substrate structure and a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips. The substrate structure includes a circuit layer, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units. Each of the resilient conductive pillars comprises a non-conductive photoresist and a conductive layer entirely covering the non-conductive photoresist.

公开(公告)号：US11940575B2

公开(公告)日：2024-03-26

申请号：US17872661

申请日：2022-07-25

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: G01T1/20 ,  G01T1/202

CPC classification number: G01T1/2018 ,  G01T1/202

Abstract: An image detector includes a substrate, a circuit layer, a plurality of light detecting elements, a plurality of driving elements and a crystal scintillation layer. The substrate has a surface. The circuit layer is arranged on the surface of the substrate, and defines a plurality of detecting areas arranged in an array. The light detecting elements and the driving elements are disposed at the detecting areas and electrically connected with the circuit layer. Each driving element drives one or more of the light detecting elements. The crystal scintillation layer is arranged opposite to the substrate and covers the detecting areas. The light detecting elements and the driving elements connect with the surface of the substrate. At least one of the light detecting elements and the driving elements is formed by a process different from the process of forming the circuit layer on the substrate.

公开(公告)号：US10431561B2

公开(公告)日：2019-10-01

申请号：US16137197

申请日：2018-09-20

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: H01L23/52 ,  H01L23/00 ,  H01L23/498

Abstract: A pre-conductive array disposed on a target circuit substrate comprises a plurality of conductive electrode groups disposed on the target circuit substrate, and at least a conductive particle dispose on each of conductive electrodes of a part or all of the conductive electrode groups. The at least a conductive particle and the corresponding conductive electrode form a pre-conductive structure, and the pre-conductive structures form the pre-conductive array.

公开(公告)号：US12154932B2

公开(公告)日：2024-11-26

申请号：US18300133

申请日：2023-04-13

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: H01L31/062 ,  G01R31/26 ,  H01L27/146 ,  H01L31/113

Abstract: An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips comprises a substrate structure and a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips. The substrate structure includes a circuit film, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units through a conductive pad. Each of the resilient conductive pillars is a conductive photoresist.

公开(公告)号：US11888011B2

公开(公告)日：2024-01-30

申请号：US16992838

申请日：2020-08-13

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te Chen

IPC: H01L31/062 ,  H01L31/113 ,  H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14603

Abstract: An electronic detection interface comprises a substrate structure and a plurality of detection units in array. The substrate structure includes a circuit film, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units.