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    METHOD AND SYSTEM FOR PROVIDING A PERPENDICULAR MAGNETIC RECORDING HEAD
    12.
    发明申请
    METHOD AND SYSTEM FOR PROVIDING A PERPENDICULAR MAGNETIC RECORDING HEAD 有权
    用于提供一个完整的磁记录头的方法和系统

    公开(公告)号：US20100112486A1

    公开(公告)日：2010-05-06

    申请号：US12262572

    申请日：2008-10-31

    申请人： JINQIU ZHANG ,  HAI SUN ,  HONGPING YUAN ,  TSUNG YUAN CHEN ,  GUANXIONG LI

    发明人： JINQIU ZHANG ,  HAI SUN ,  HONGPING YUAN ,  TSUNG YUAN CHEN ,  GUANXIONG LI

    IPC分类号： G03F7/20

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  Y10T29/49041

    摘要： A method and system for providing a PMR pole in a magnetic recording transducer including an intermediate layer are disclosed. The method and system include providing a mask on the intermediate layer. The mask includes a line having at least one side. A hard mask layer is provided on the mask. At least a portion of the hard mask layer resides on the side(s) of the line. At least part of the hard mask layer on the side(s) of the line is removed. Thus, at least a portion of the line is exposed. The line is then removed, providing an aperture in the hard mask corresponding to the line. The method also includes forming a trench in the intermediate layer under the aperture. The trench top is wider than its bottom. The method further includes providing a PMR pole, at least a portion of which resides in the trench.

    摘要翻译： 公开了一种用于在包括中间层的磁记录换能器中提供PMR极的方法和系统。 该方法和系统包括在中间层上提供掩模。 掩模包括具有至少一个侧面的线。 在掩模上设置硬掩模层。 硬掩模层的至少一部分位于线的一侧。 除去线的侧面上的硬掩模层的至少一部分。 因此，线的至少一部分被暴露。 然后去除线，在对应于线的硬掩模中提供孔。 该方法还包括在孔下方的中间层中形成沟槽。 沟槽顶部比底部宽。 该方法还包括提供PMR极，其至少一部分位于沟槽中。

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    15.
    发明申请
    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
    电路板及其制造方法

    公开(公告)号：US20090205852A1

    公开(公告)日：2009-08-20

    申请号：US12193460

    申请日：2008-08-18

    申请人： Chun-Chien Chen ,  Tsung-Yuan Chen

    发明人： Chun-Chien Chen ,  Tsung-Yuan Chen

    IPC分类号： H05K1/00 ,  H05K3/02

    CPC分类号： H05K3/44 ,  H05K3/20 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/445 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2203/0369 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24917

    摘要： A manufacturing method of a circuit board is provided. A metal core is provided. A conductive layer is formed on each of some carriers. The carriers and dielectric layers are laminated at both sides of the metal core to form a stacked structure. Each of the dielectric layers is located between the corresponding carrier and the metal core, and a portion of the conductive layer is embedded in the corresponding dielectric layer. Then, the carriers are removed. A blind via and/or a through via are/is formed in the stacked structure to connect the corresponding conductive layer and the metal core and/or connect the conductive layers at both sides of the metal core, wherein the through via penetrates the metal core. The conductive layer on a surface of the dielectric layer is removed.

    摘要翻译： 提供电路板的制造方法。 提供金属芯。 在一些载体的每一个上形成导电层。 载体和电介质层被层叠在金属芯的两侧以形成堆叠结构。 每个电介质层位于相应的载体和金属芯之间，并且导电层的一部分嵌入相应的介电层中。 然后，移除载体。 在堆叠结构中形成盲通孔和/或通孔，以将相应的导电层和金属芯连接和/或连接金属芯两侧的导电层，其中通孔穿过金属芯 。 去除介电层表面上的导电层。

    Method of fabricating a magnetic sensor on a wafer
    17.
    发明授权
    Method of fabricating a magnetic sensor on a wafer 失效
    在晶片上制造磁传感器的方法

    公开(公告)号：US07500303B2

    公开(公告)日：2009-03-10

    申请号：US11437585

    申请日：2006-05-19

    申请人： Tsung Yuan Chen ,  Kuok San Ho ,  Mustafa Michael Pinarbasi

    发明人： Tsung Yuan Chen ,  Kuok San Ho ,  Mustafa Michael Pinarbasi

    IPC分类号： G11B5/127 ,  H04R31/00

    CPC分类号： G11B5/3932 ,  B82Y10/00 ,  B82Y25/00 ,  G11B5/3163 ,  G11B2005/3996 ,  Y10T29/49043 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052 ,  Y10T29/49156

    摘要： A read head for a disk drive and a method of fabricating the read head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures to define the electrically active region of the sensor are described. The invention deposits the GMR and lead layers before milling away the unwanted material. A photoresist mask with a hole defining the active area of the sensor is preferably patterned over a layer of DLC that is formed into a mask. A selected portion of the exposed lead material is then removed using the DLC as a mask defining the active region of the sensor. A photoresist mask pad is patterned to define the full sensor width. The excess sensor and lead material exposed around the mask is milled away. The layers for the hardbias structure are deposited.

    摘要翻译： 描述了用于磁盘驱动器的读取头和制造具有覆盖的引线焊盘的读取头的方法，所述引导焊盘在硬质结构之间接触传感器的顶表面以限定传感器的电活性区域。 本发明在铣削不想要的材料之前沉积GMR和铅层。 具有限定传感器的有效区域的孔的光致抗蚀剂掩模优选地在形成为掩模的DLC层上图案化。 然后使用DLC作为限定传感器的有源区域的掩模来去除暴露的引线材料的选定部分。 图案化光致抗蚀剂掩模垫以限定完整的传感器宽度。 暴露在面罩周围的多余传感器和铅材料被磨掉。 硬质合金结构的层被沉积。

    EMBEDDED CIRCUIT BOARD AND PROCESS THEREOF
    18.
    发明申请
    EMBEDDED CIRCUIT BOARD AND PROCESS THEREOF 有权
    嵌入式电路板及其工艺

    公开(公告)号：US20080223605A1

    公开(公告)日：2008-09-18

    申请号：US11774728

    申请日：2007-07-09

    申请人： Tsung-Yuan Chen ,  Shu-Sheng Chiang

    发明人： Tsung-Yuan Chen ,  Shu-Sheng Chiang

    IPC分类号： H05K3/02 ,  H01K3/10 ,  H05K1/11

    CPC分类号： H05K1/0366 ,  H05K3/205 ,  H05K3/426 ,  H05K2201/0959 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： An embedded circuit board including a glass fiber layer, two dielectric layers, and two circuit layers is provided. The glass fiber layer has a first surface and a second surface corresponding to the first surface. The dielectric layers are disposed on the first surface and the second surface, respectively. The circuit layers are embedded in the dielectric layers above the first surface and the second surface, respectively. The outer surface of each circuit layer is coplanar with the outer surface of each dielectric layer, and a distance between the circuit layer and the glass fiber layer is greater than or equal to 3 μm. In addition, a process of the embedded circuit board is provided.

    摘要翻译： 提供了包括玻璃纤维层，两个电介质层和两个电路层的嵌入式电路板。 玻璃纤维层具有对应于第一表面的第一表面和第二表面。 电介质层分别设置在第一表面和第二表面上。 电路层分别嵌入在第一表面和第二表面上方的电介质层中。 每个电路层的外表面与每个电介质层的外表面共面，并且电路层和玻璃纤维层之间的距离大于或等于3μm。 此外，提供了嵌入式电路板的处理。

    Serpentine resistive shunt for MR heads having conductive shields
    20.
    发明授权
    Serpentine resistive shunt for MR heads having conductive shields 失效
    具有导电屏蔽的MR磁头的蛇形电阻分流器

    公开(公告)号：US06344952B1

    公开(公告)日：2002-02-05

    申请号：US09648169

    申请日：2000-08-25

    申请人： Robert Glenn Biskeborn ,  Tsung Yuan Chen ,  Michael J. Doscher ,  Peter V. Koeppe ,  James Devereaux Jarratt

    发明人： Robert Glenn Biskeborn ,  Tsung Yuan Chen ,  Michael J. Doscher ,  Peter V. Koeppe ,  James Devereaux Jarratt

    IPC分类号： G11B533

    CPC分类号： B82Y25/00 ,  B82Y10/00 ,  G11B5/02 ,  G11B5/09 ,  G11B5/11 ,  G11B5/39 ,  G11B5/3903 ,  G11B5/40 ,  G11B2005/3996

    摘要： A read element for a tape drive system is disclosed. The read element generally comprises a magneto-resistive sensor electrically coupled to first and second leads and at least one electrically conductive magnetic shield proximate the magneto-resistive element. A resistor is electrically connected to the conductive magnetic shield and to one or more of the first and second leads. The resistor is disposed between the first and second leads. The resistor continuously discharges electric charge that builds up on the conductive magnetic shield. The resistor typically has a resistance that is large enough to protect against noise due electrical shorting of the conductive magnetic shield and small enough to prevent a build-up of electric charge on the shield.

    摘要翻译： 公开了一种用于磁带驱动器系统的读取元件。 读取元件通常包括电耦合到第一和第二引线的磁阻传感器以及靠近磁阻元件的至少一个导电磁屏蔽。 电阻器电连接到导电磁屏蔽以及第一和第二引线中的一个或多个。 电阻器设置在第一和第二引线之间。 电阻器连续放电导电磁屏蔽上积聚的电荷。 电阻器通常具有足够大的电阻以防止导电磁屏蔽的电短路引起的噪声，并且足够小以防止在屏蔽上积累电荷。