Abstract:
A built-in self-test (BIST) circuit for a liquid crystal display (LCD) source driver includes at least one digital-to-analog converter (DAC) and at least one buffer coupled to the respective DAC, wherein the buffer is reconfigurable as a comparator. A first input signal and a second input signal are coupled to the comparator. The first input signal is a predetermined reference voltage level. The second input signal is a test offset voltage in a test range.
Abstract:
A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately. Parametric parameters or parametric equations may be utilized in the separate models. The separate models may be integrated into a MEMS device model. The MEMS device model may be tested and calibrated, and then may be used to model new designs for microelectromechanical devices.
Abstract:
One or more techniques for buffer offset modulation or buffer offset cancelling are provided herein. In an embodiment, an output for a sigma-delta analog digital converter (ADC) is provided using an output of a first chop-able buffer (FB) and an output of a second chop-able buffer (SB). For example, the output of the FB is associated with a first offset, the output of the SB is associated with a second offset, and the output of the ADC includes an ADC offset associated with the first offset and the second offset. In an embodiment, buffer offset modulation is provided by modulating the ADC offset using an offset rotation. In an example, the offset rotation is based at least in part on a reference clock and the output of the ADC. The buffer offset modulation mitigates the first offset or the second offset, where such offsets are generally undesired.
Abstract:
A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately. Parametric parameters or parametric equations may be utilized in the separate models. The separate models may be integrated into a MEMS device model. The MEMS device model may be tested and calibrated, and then may be used to model new designs for microelectromechanical devices.
Abstract:
A knife case is integrally molded to have a shape matching the blade of a knife, and includes a front end, a rear end, an upper edge, a lower edge, and two lateral sides. A rearward opened blade receiving space is defined on the knife case to extend from the rear end toward the front end, a thumb push is provided on the upper edge to project from the rear end, and a through hole is provided on the thumb push for a fastening strap to extend therethrough. With the knife case having the above structure, the knife received therein can be safely displayed for sale without the need of extra packaging material and a user can conveniently and safely remove the knife from the knife case for use.
Abstract:
An audio processing system for used in a multi-channel audio chip includes a multiplexer, a digital-to-analog converter, a de-multiplexer, a controller and N sample-and-hold circuits. The multiplexer receives N digital signals and outputs the digital signals one by one in a time-division manner. The digital-to-analog converter receives the digital signals from the multiplexer and converts them into corresponding N analog signals. The de-multiplexer outputs the analog signals one by one in a time-division manner. The controller generates control signals to control the selection of the multiplexer and the de-multiplexer. The sample-and-hold circuits hold the analog signals for a predetermined period of time and then outputs the signals, respectively.
Abstract:
An amplifier circuit having a high time constant. An operational amplifier includes a non-converting input terminal coupled to a ground, a converting input terminal and an output terminal. A first resistor network including at least one stage is coupled between the converting input terminal and the output terminal. Each stage of the first resistor network includes a first node, a first current path and a second current path connected to the first node. The first current path of each stage of the first resistor network is connected to the first node of the next stage, the second current path of each stage of the first resistor network is grounded, and the first current path of the first stage of the first resistor network is connected to the converting input terminal. A loading unit is coupled between the converting input terminal and the output terminal.
Abstract:
A phase-lock loop for preventing frequency drift and jitter problems is disclosed. A phase comparator compares an input signal and a feedback signal, and outputs a control voltage according to phase difference therebetween. A voltage-controlled oscillator outputs a plurality of multiple phase oscillating signals according to the control voltage. A phase swallower receives a plurality of multiple phase oscillating signals, and generates a phase swallow signal. The phase swallow signal is formed by adding or removing one phase in the oscillating signal per predetermined number of clocks. An output frequency divider divides the frequency of the phase swallow signal so as to generate a desired output signal.
Abstract:
A mechanical frequency generator has a first mechanical resonator and a second mechanical resonator and a circuit connected with the first and second mechanical resonators. The first and second mechanical resonators having substantially the same resonator frequency coefficients as a function of an environment of the first and the second mechanical resonators. The first mechanical resonator differing in size from the second mechanical resonator. The circuit adapted to generate a difference frequency signal responsive to the first and second mechanical resonator frequency signals and based on the first and the second predetermined resonant frequencies.
Abstract:
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) a grounding element disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface; (4) a package body disposed adjacent to the upper surface and covering the semiconductor device and the grounding element; and (5) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a lateral surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The grounding element corresponds to a remnant of a conductive bump, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.