公开(公告)号：USD945226S1

公开(公告)日：2022-03-08

申请号：US29778115

申请日：2021-04-11

Applicant: Guangzhou Jin Zhong Wang Luo Ji Shu You Xian Gong Si

Designer： Jinkun Li

公开(公告)号：US20120125781A1

公开(公告)日：2012-05-24

申请号：US12998867

申请日：2009-12-10

Applicant: Jin Zhong Zhang ,  Abraham Wilcott ,  Jennifer Hensel ,  Tzarara Lopez-Luke ,  Yat Li

Inventor： Jin Zhong Zhang ,  Abraham Wilcott ,  Jennifer Hensel ,  Tzarara Lopez-Luke ,  Yat Li

IPC: C25B1/02 ,  C25B9/04 ,  H01L31/0272 ,  H01L31/0224

CPC classification number: C25B1/003 ,  B01J21/063 ,  B01J27/0573 ,  B01J35/004 ,  B01J37/10 ,  C25B11/0405

Abstract: The invention provides new methods and compositions for synthesizing hydrogen fuel using simple and inexpensive materials.

Abstract translation: 本发明提供使用简单且便宜的材料合成氢燃料的新方法和组合物。

公开(公告)号：US07554185B2

公开(公告)日：2009-06-30

申请号：US11718396

申请日：2005-10-31

Applicant: Chee Seng Foong ,  Aminuddin Ismail ,  Wai Yew Lo ,  Bee Hoon Liau ,  Jin- Mei Liu ,  Jian- Hong Wang ,  Jin- Zhong Yao ,  Fu- Bin Song

Inventor： Chee Seng Foong ,  Aminuddin Ismail ,  Wai Yew Lo ,  Bee Hoon Liau ,  Jin- Mei Liu ,  Jian- Hong Wang ,  Jin- Zhong Yao ,  Fu- Bin Song

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package and method of forming the package, including a substrate having an opening formed therein. Contact pads are formed about a periphery of the opening on a first side of the substrate and a second opposing side of the substrate. A flip chip die is mounted to the substrate, having an active side mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.

Abstract translation: 一种形成封装的半导体封装和方法，包括其中形成有开口的基板。 在衬底的第一侧和衬底的第二相对侧上围绕开口的周边形成接触焊盘。 倒装芯片裸片安装到基板上，其主动侧安装在基板的第一侧上并且与形成在基板的第一侧上的至少一些接触焊盘电连通。 通过开口安装至少一个引线接合管芯，其中非有源侧安装在倒装芯片管芯的有源侧上。 引线接合管芯与形成在基板的第二相对侧上的多个接触焊盘中的至少一些电连接。

公开(公告)号：US20090098686A1

公开(公告)日：2009-04-16

申请号：US12126943

申请日：2008-05-26

Applicant: Xue-song Xu ,  Zhi-gang Bai ,  Nan Xu ,  Jin-zhong Yao

Inventor： Xue-song Xu ,  Zhi-gang Bai ,  Nan Xu ,  Jin-zhong Yao

IPC: H01L21/02

CPC classification number: H01L23/49861 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49558 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.

Abstract translation: 形成具有增加的支架的预成型引线框的方法包括以下步骤：将第一带附着到引线框的第一侧，将第二带附接到引线框的第二侧。 带状引线框架放置在模具中，并开始第一模具化合物流。 模具化合物的第一流动填充第一带和模具的上模追逐之间的空间。 然后开始模具化合物的第二流程。 模具化合物的第二流动填充了管芯焊盘和引线框架的引线之间的空间。 然后将第一和第二带从引线框架移除。 提供了改进的支架，因为第一带被模具化合物的第一流动压下。