公开(公告)号：US20120074595A1

公开(公告)日：2012-03-29

申请号：US13191843

申请日：2011-07-27

Applicant: JeongOh Ha ,  Heungkyu Kwon ,  YunSeok Choi ,  Jong-Won Lee

Inventor： JeongOh Ha ,  Heungkyu Kwon ,  YunSeok Choi ,  Jong-Won Lee

IPC: H01L23/522

CPC classification number: H01L25/105 ,  H01L23/5386 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a first substrate on which a first semiconductor chip is mounted, a second substrate spaced apart from the first substrate and on which a second semiconductor chip is mounted, first pads disposed on the first substrate, second pads disposed on the second substrate to be opposite to the first pads, and connection patterns electrically connecting the opposite first and second pads to each other, respectively. The first pads are disposed asymmetrically with respect to the central axis of the first substrate.

Abstract translation: 半导体封装包括：第一衬底，其上安装有第一半导体芯片;第二衬底，与第一衬底间隔开并且安装有第二半导体芯片;第一焊盘，设置在第一衬底上;第二焊盘，设置在第二衬底上; 与第一焊盘相对，以及将相对的第一焊盘和第二焊盘彼此电连接的连接图案。 第一衬垫相对于第一衬底的中心轴非对称地设置。

公开(公告)号：US20140374900A1

公开(公告)日：2014-12-25

申请号：US14242094

申请日：2014-04-01

Applicant: Heungkyu Kwon ,  Jongkook Kim

Inventor： Heungkyu Kwon ,  Jongkook Kim

IPC: H01L23/498

CPC classification number: H01L25/50 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05553 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06181 ,  H01L2224/06517 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A semiconductor package includes memory I/O bumps and power/ground voltage bumps which are disposed at different positions from each other. In the semiconductor package, memory chips are disposed side by side, and a passivation layer is interposed between a conductive pad and a bump.

Abstract translation: 半导体封装包括设置在彼此不同位置的存储器I / O凸块和电源/接地电压凸块。 在半导体封装中，存储芯片并排布置，并且钝化层插入在导电焊盘和凸块之间。

公开(公告)号：US20130203219A1

公开(公告)日：2013-08-08

申请号：US13835683

申请日：2013-03-15

Applicant: Ji-hyun PARK ,  Heungkyu KWON ,  Min-Ok NA ,  Taehwan KIM

Inventor： Ji-hyun PARK ,  Heungkyu KWON ,  Min-Ok NA ,  Taehwan KIM

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.

Abstract translation: 半导体封装包括具有绝缘层的衬底。 绝缘层具有第一表面粗糙度的第一区域和具有第二表面粗糙度的第二区域。 半导体芯片安装在第一区域中，底部填充树脂溶液填充到半导体芯片和绝缘层之间的空间中。 第二区域的粗糙度防止底部填充树脂从半导体芯片流出，从而减小半导体封装的尺寸。

公开(公告)号：US08426959B2

公开(公告)日：2013-04-23

申请号：US12857928

申请日：2010-08-17

Applicant: Ji-hyun Park ,  Heungkyu Kwon ,  Min-Ok Na ,  Taehwan Kim

Inventor： Ji-hyun Park ,  Heungkyu Kwon ,  Min-Ok Na ,  Taehwan Kim

IPC: H01L23/28

CPC classification number: H01L21/56 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.

Abstract translation: 半导体封装包括具有绝缘层的衬底。 绝缘层具有第一表面粗糙度的第一区域和具有第二表面粗糙度的第二区域。 半导体芯片安装在第一区域中，底部填充树脂溶液填充到半导体芯片和绝缘层之间的空间中。 第二区域的粗糙度防止底部填充树脂从半导体芯片流出，从而减小半导体封装的尺寸。

公开(公告)号：US20130091348A1

公开(公告)日：2013-04-11

申请号：US13617619

申请日：2012-09-14

Applicant: Heungkyu KWON ,  Jae Choon KIM ,  Eunseok CHO ,  Jichul KIM

Inventor： Heungkyu KWON ,  Jae Choon KIM ,  Eunseok CHO ,  Jichul KIM

IPC: G06F9/06

CPC classification number: G06F1/206 ,  G01J5/10 ,  G05B15/02

Abstract: A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.

Abstract translation: 提供了移动设备的表面温度管理方法。 该方法包括在移动设备的操作模式中感测应用处理器的温度; 以及使用感测到的温度来控制应用处理器和表面温度管理表以管理移动设备的目标部分的表面温度。 表面温度管理表包括与操作模式中的目标部件的表面温度相对应的与应用处理器的温度有关的信息。