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公开(公告)号：US12200875B2
公开(公告)日：2025-01-14
申请号：US17277748
申请日：2019-09-20
Applicant: Industrial Technology Research Institute
Inventor： Yiu-Hsiang Chang , Jen-Chieh Lin , Prantik Mazumder , Scott Christopher Pollard , Pei-Lien Tseng
Abstract: A method for metallizing through-glass vias in a glass substrate includes functionalizing a surface of the glass substrate with a silane. The glass substrate has an average thickness t and comprises a plurality of vias extending through the thickness t. The method further includes applying an electroless plating solution comprising a copper ion to deposit a copper seed layer on the functionalized surface, disposing an electrolyte within the plurality of vias, wherein the electrolyte comprises copper ions to be deposited on the copper seed layer within the plurality of vias; positioning an electrode within the electrolyte; and applying a current between the electrode and the glass substrate, thereby reducing the copper ions into copper within the plurality of vias such that each of the plurality of vias is filled with copper and the copper has a void volume fraction of less than 5%.
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公开(公告)号：US12199714B2
公开(公告)日：2025-01-14
申请号：US18085527
申请日：2022-12-20
Applicant: Industrial Technology Research Institute
Inventor： Shih-Hao Fang , Chiu-Ping Wu , Hung-Fu Wei , Jen-Yuan Hsu
Abstract: An aspect of the disclosure includes a communication system and a communication method using reconfigurable intelligent surface and a reconfigurable intelligent surface device. The communication system includes at least one base station, a reconfigurable intelligent surface device, and a control at one least device. The at least one base station respectively transmits at least one beam. The reconfigurable intelligent surface device is coupled to the at least one base station, and measures the at least one beam of the at least one base station to obtain signal measurement results associated with each of the at least one base station. The control device is coupled to the at least one base station. The control device groups the at least one base station and the reconfigurable intelligent surface device into at least one group according to the signal measurement results associated with each of the at least one base station.
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公开(公告)号：US12196542B2
公开(公告)日：2025-01-14
申请号：US17744451
申请日：2022-05-13
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Jhe-Ruei Li , Wei-Shiang Huang , Tsai-Ling Kao , Chun-Yi Lee
IPC: G01B11/25
Abstract: A calibration method of three-dimensional measurement system includes a projection device, a camera and a processor. The projection device projects structural light to a reference object including a first calibration surface and a second calibration surface. The camera photographs the reference object to obtain at least one reference object image. The processor performs decoding according to the at least one reference object image to obtain a plurality of pieces of phase data of the at least one reference object image. The processor computes a first phase corresponding to the first calibration surface and a second phase corresponding to the second calibration surface according to the phase data, calculates a surface phase difference between the first phase and the second phase, and computes according to the surface phase difference and a height of the second calibration surface relative to the first calibration surface to obtain a phase-height conversion parameter.
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公开(公告)号：US12192460B2
公开(公告)日：2025-01-07
申请号：US18460622
申请日：2023-09-04
Applicant: Industrial Technology Research Institute
Inventor： Yao-Jen Chang , Chun-Lung Lin , Ching-Chieh Lin , Jih-Sheng Tu , Chao-Hsiung Hung
IPC: H04N1/64 , H04N19/103 , H04N19/119 , H04N19/13 , H04N19/176 , H04N19/182 , H04N19/186 , H04N19/463 , H04N19/51 , H04N19/593 , H04N19/70 , H04N19/91 , H04N19/124 , H04N19/94
Abstract: An encoding, a decoding method, a system for encoding and decoding, an encoder, and a decoder are provided. The encoding method includes the following. In a palette mode, if colors of pixels of a coding unit block are all represented by one or more major colors of the coding unit block, a flag is set as a first state value, and if the color of at least one pixel of the coding unit block is not represented by the one or more major colors of the coding unit block, the flag is set as a second state value. The encoding method further includes establishing a palette table corresponding to the coding unit block according to a state value of the flag and the one or more major colors.
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公开(公告)号：US12185456B2
公开(公告)日：2024-12-31
申请号：US17564225
申请日：2021-12-29
Applicant: First Hi-tec Enterprise Co., Ltd. , NEXCOM International Co., Ltd. , Industrial Technology Research Institute
Inventor： Min-Lin Lee , Sheng-Che Hung , Ching-Shan Chang , Ying-Tsuen Liou
IPC: H05K1/02 , H01R12/73 , H01R13/6461 , H05K3/42 , H01R12/77 , H01R12/78 , H01R12/81 , H01R13/26 , H01R13/6471 , H01R13/648 , H01R13/658 , H01R13/6581 , H01R13/6585 , H05K3/46
Abstract: A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.
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Patent Agency Ranking
公开(公告)号：US20240422990A1
公开(公告)日：2024-12-19
申请号：US18687308
申请日：2022-08-29
Inventor： Taiwei CHIU , Szu-chun KANG , Yajun ZHANG , Yu LIU
Abstract: A semiconductor device and a manufacturing method therefor are provided. The method includes: depositing a first dielectric layer material on a semiconductor substrate, and etching the first dielectric layer material to form a trench corresponding to each via in the semiconductor substrate in a first dielectric layer; the via being filled with a metal material; depositing a bottom electrode material in the trench, and etching the bottom electrode material to form a bottom electrode covering a bottom of the trench; depositing a resistive layer material to form a resistive layer covering an upper surface of the bottom electrode and a sidewall of the trench; and depositing a top electrode material in a groove of the resistive layer, such that the groove is filled with the top electrode material to form a top electrode which is arranged in the groove and fills the groove.
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公开(公告)号：US20240416478A1
公开(公告)日：2024-12-19
申请号：US18531759
申请日：2023-12-07
Applicant: Industrial Technology Research Institute
Inventor： SHIH-YI LIU , Yu-Fang Huang , Jung-Hsuan Chen , Shen-Chuan Lo
IPC: B24B27/06
Abstract: A material cutting and grinding device is provided. The material cutting and grinding device includes a shaft, a rotor assembly, a cutting grinding sheet, a fixture and a channel set. The rotor assembly includes a housing, a rotor, an air intake opening, blades and accommodating grooves. The rotor is accommodated in a holding groove of the housing. The rotor is sleeved on the shaft. The accommodating grooves are passed through the rotor. The blades are passed through the accommodating grooves. The cutting grinding sheet is connected to the other end of the shaft. The fixture clamps the cutting grinding sheet. The channel set includes a shaft channel and a gas channel. The shaft channel is passing through the shaft. The gas channel is disposed on the fixture. The gas channel is connected to the shaft channel.
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公开(公告)号：US12163989B2
公开(公告)日：2024-12-10
申请号：US17559371
申请日：2021-12-22
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Sih-Han Li , Jie Zhang , Peng-I Mei
Abstract: A high-frequency component test device including a test key and a test module is provided. The test key includes a front-level key and a back-level key which are arranged symmetrically and have the same electrical length and characteristic impedance. The test module is used to measure an S parameter of the front-level key and the back-level key connected directly and an S parameter of a structure where a device under test (DUT) is added between the front-level key and the back-level key. The test module performs S parameter calculation in the frequency domain and converts the S parameter into an ABCD parameter matrix, and then obtains an ABCD parameter of a de-embedded DUT using a matrix root-opening operation and an inverse matrix operation.
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公开(公告)号：US20240400746A1
公开(公告)日：2024-12-05
申请号：US18393589
申请日：2023-12-21
Applicant: Industrial Technology Research Institute
Inventor： Ying-Chen Liao , De-Lun Kuo , Hsu-Tzu Fan , Wei-Cheng Tang , Cheng-Jyun Huang , Shin-Liang Kuo
IPC: C08G18/48 , C08G63/181 , C08G63/82 , C08J11/24
Abstract: A polyurethane and a preparation method thereof are provided. The polyurethane is represented by Formula 1. The preparation method of the polyurethane includes performing an addition reaction between a polyester-polyether polyol represented by the Formula 4 and a di-isocyanate. The formed polyurethane has high elasticity and high moisture-permeable properties.
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公开(公告)号：US12154905B2
公开(公告)日：2024-11-26
申请号：US17372132
申请日：2021-07-09
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Jie Zhang , Tai-Hsing Lee , Sih-Han Li
IPC: H01L27/118 , H01L25/065 , H03K17/60 , H03K17/687 , H01L23/00
Abstract: An arrayed switch circuit includes a substrate, signal conductive pads and signal expansion pins. The signal conductive pads are disposed on the substrate at intervals, and the signal conductive pads are arranged to form a signal conductive pad array. Each of the signal conductive pads has a row position and a column position in the signal conductive pad array. A row signal switch is provided between any two adjacent signal conductive pads corresponding to the same row position, and a column signal switch is provided between any two adjacent signal conductive pads corresponding to the same column position. The signal expansion pins are connected to the signal conductive pads located on at least one side of the signal conductive pad array through signal expansion switches respectively.
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