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公开(公告)号：US20240198651A1
公开(公告)日：2024-06-20
申请号：US18590965
申请日：2024-02-29
Inventor： Wei-Jie Huang , Yu-Ching Lo , Ching-Pin Yuan , Wen-Chih Lin , Cheng-Yu Kuo , Yi-Yang Lei , Ching-Hua Hsieh
CPC classification number: B32B38/1858 , H01L21/4857 , H01L24/96
Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.
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公开(公告)号：US11996400B2
公开(公告)日：2024-05-28
申请号：US17731240
申请日：2022-04-27
Inventor： Hsuan-Ting Kuo , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Hao-Jan Pei , Yu-Peng Tsai , Chia-Lun Chang , Chih-Chiang Tsao , Philip Yu-Shuan Chung
IPC: H01L25/10 , H01L21/56 , H01L21/683 , H01L21/768 , H01L23/00 , H01L23/31 , H01L23/522 , H01L25/00 , H01L27/06
CPC classification number: H01L25/50 , H01L21/56 , H01L21/6836 , H01L21/76871 , H01L23/3128 , H01L23/5226 , H01L24/17 , H01L24/33 , H01L27/0688 , H01L2224/02372 , H01L2224/02373
Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.
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公开(公告)号：US20240096740A1
公开(公告)日：2024-03-21
申请号：US18152131
申请日：2023-01-09
Inventor： Chao-Wei Chiu , Chao-Wei Li , Hsiu-Jen Lin , Ching-Hua Hsieh
IPC: H01L23/38 , H01L23/48 , H01L23/498 , H10N10/82
CPC classification number: H01L23/38 , H01L23/481 , H01L23/49816 , H10N10/82
Abstract: Provided is a package structure including a first redistribution layer (RDL) structure, a die, a circuit substrate, and a first thermoelectric cooler. The RDL) structure has a first side and a second side opposite to each other. The die is disposed on the first side of the first RDL structure. The circuit substrate is bonded to the second side of the first RDL structure through a plurality of first conductive connectors. The first thermoelectric cooler is between the first RDL structure and the circuit substrate, wherein the first thermoelectric cooler includes at least a N-type doped region and at least a P-type doped region.
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公开(公告)号：US11862577B2
公开(公告)日：2024-01-02
申请号：US17561744
申请日：2021-12-24
Inventor： Hao-Jan Pei , Ching-Hua Hsieh , Hsiu-Jen Lin , Wei-Yu Chen , Chia-Shen Cheng , Chih-Chiang Tsao , Jen-Jui Yu , Cheng-Shiuan Wong
IPC: H01L23/00 , H01L23/31 , H01L21/56 , H01L23/498
CPC classification number: H01L23/562 , H01L21/568 , H01L23/3128 , H01L23/3135 , H01L23/49822
Abstract: Provided is a package structure, including a die, a plurality of through vias, an encapsulant, a plurality of first connectors, a warpage control material and a protection material. The plurality of through vias are disposed around the die. The encapsulant laterally encapsulate the die and the plurality of through vias. The plurality of first connectors are electrically connected to a first surface of the plurality of through vias. The warpage control material is disposed over a first surface of the die. The protection material is disposed over the encapsulant, around the plurality of first connectors and the warpage control material. A Young's modulus of the warpage control material is greater than a Young's modulus of the encapsulant, and the Young's modulus of the encapsulant is greater than a Young's modulus of the protection material.
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公开(公告)号：US11830781B2
公开(公告)日：2023-11-28
申请号：US17876541
申请日：2022-07-29
Inventor： Wei-Yu Chen , Chih-Hua Chen , Ching-Hua Hsieh , Hsiu-Jen Lin , Yu-Chih Huang , Yu-Peng Tsai , Chia-Shen Cheng , Chih-Chiang Tsao , Jen-Jui Yu
IPC: H01L23/31 , H01L23/528 , H01L23/00 , H01L21/56 , H01L21/48 , H01L23/522 , H01L23/538
CPC classification number: H01L23/3114 , H01L21/486 , H01L21/4853 , H01L21/568 , H01L23/528 , H01L23/5226 , H01L23/5389 , H01L24/03 , H01L24/09 , H01L24/81 , H01L23/3128 , H01L2221/68345 , H01L2221/68359 , H01L2224/02331 , H01L2224/02379 , H01L2224/18 , H01L2224/73267 , H01L2924/37001
Abstract: A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.
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Patent Agency Ranking
公开(公告)号：US20230282629A1
公开(公告)日：2023-09-07
申请号：US18315463
申请日：2023-05-10
Inventor： Sheng-Chieh Yang , Ching-Hua Hsieh , Chih-Wei Lin , Yu-Hao Chen
IPC: H01L25/16 , H01L23/498
CPC classification number: H01L25/167 , H01L23/49822
Abstract: A semiconductor package includes a first integrated circuit and a first waveguide. The first integrated circuit includes an optical coupler. The first waveguide is optically coupled to the optical coupler. In some embodiments, the first waveguide protrudes beyond the optical coupler. In some embodiments, the first waveguide is partially overlapped with the optical coupler.
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公开(公告)号：US20230260961A1
公开(公告)日：2023-08-17
申请号：US17674795
申请日：2022-02-17
Inventor： Kai-Fung Chang , Sheng-Feng Weng , Ming-Yu Yen , Chih-Wei Lin , Ching-Hua Hsieh
IPC: H01L25/065 , H01L21/56 , H01L21/48 , H01L23/00 , H01L23/64 , H01L23/498 , H01L23/31
CPC classification number: H01L25/0655 , H01L21/56 , H01L21/4857 , H01L24/32 , H01L23/647 , H01L23/49811 , H01L23/49822 , H01L24/83 , H01L23/3142 , H01L2224/32221 , H01L2224/83951 , H01L2224/26175
Abstract: A semiconductor package includes a first substrate and a first semiconductor device. The first semiconductor device is bonded to the first substrate and includes a second substrate, a plurality of first dies and a second die. The first dies are disposed between the first substrate and the second substrate. The second die is surrounded by the first dies. A cavity is formed among the first dies, the first substrate and the second substrate, and a gap is formed between the second die and the first substrate.
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公开(公告)号：US20230215837A1
公开(公告)日：2023-07-06
申请号：US18183963
申请日：2023-03-15
Inventor： Ying-Jui Huang , Ching-Hua Hsieh , Chien-Ling Hwang , Chia-Sheng Huang
CPC classification number: H01L21/682 , H01L21/67265 , H01L21/187 , H01L21/681
Abstract: A method and an apparatus for bonding semiconductor substrates are provided. The apparatus includes a first support configured to carry a first semiconductor substrate and a second semiconductor substrate bonded to each other, a gauging component embedded in the first support and comprising a fiducial pattern, and a first sensor disposed proximate to the gauging component, and configured to emit a light source towards the fiducial pattern of the gauging component.
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公开(公告)号：US20230014450A1
公开(公告)日：2023-01-19
申请号：US17377387
申请日：2021-07-16
Inventor： Jen-Jui Yu , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Wei-Yu Chen , Chih-Chiang Tsao , Chao-Wei Chiu
IPC: H01L23/00 , H01L21/48 , H01L25/16 , H01L21/683
Abstract: A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant, a redistribution layer (RDL) structure, a passive device, and a plurality of dummy items. The encapsulant laterally encapsulates the die. The RDL structure is disposed on the die and the encapsulant. The passive device is disposed on and electrically bonded to the RDL structure. The plurality of dummy items are disposed on the RDL structure and laterally aside the passive device, wherein top surfaces of the plurality of dummy items are higher than a top surface of the passive device.
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公开(公告)号：US20220254767A1
公开(公告)日：2022-08-11
申请号：US17731240
申请日：2022-04-27
Inventor： Hsuan-Ting Kuo , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Hao-Jan Pei , Yu-Peng Tsai , Chia-Lun Chang , Chih-Chiang Tsao , Philip Yu-shuan Chung
IPC: H01L25/00 , H01L21/56 , H01L21/683 , H01L21/768 , H01L23/31 , H01L23/00 , H01L27/06 , H01L23/522
Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.
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