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公开(公告)号：US20220164972A1
公开(公告)日：2022-05-26
申请号：US17534167
申请日：2021-11-23
Applicant: Applied Materials, Inc.
Inventor： Jinxin FU , Yangyang SUN , Ludovic GODET
Abstract: Embodiments herein provide for a method of determining an optical device modulation transfer function (MTF). The method described herein includes projecting a baseline image of a pattern from a light engine to a detector. The baseline image is analyzed to determine a baseline function. A baseline fast Fourier transform (FFT) or a baseline MTF of the baseline function is obtained. The method further includes projecting an image of the pattern from the light engine to one or more optical devices. The pattern is outcoupled from the one or more optical devices to the detector. The image is analyzed to determine a function. A function FFT or a function MTF is obtained corresponding to the image. An optical device MTF of the one or more optical devices is determined by comparing the baseline FFT and the function FFT determined by analyzing the image or by comparing the baseline MTF and the function MTF determined by analyzing the image.
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公开(公告)号：US20220163423A1
公开(公告)日：2022-05-26
申请号：US17456240
申请日：2021-11-23
Applicant: Applied Materials, Inc.
Inventor： Yangyang SUN , Jinxin FU , Kazuya DAITO , Ludovic GODET
Abstract: Embodiments described herein provide for light engines of a measurement system and methods of using the light engines. The measurement system includes a light engine operable to illuminate a first grating of an optical device. The light engine projects a pattern with a light from a light engine. The light engine projects a pattern to the first grating such that a metrology metric may be extracted from one or more images captured by a detector of the measurement system. The metrology metrics are extracted by processing the image. The metrology metrics determine if the optical device meets image quality standards.
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公开(公告)号：US20220122241A1
公开(公告)日：2022-04-21
申请号：US17492958
申请日：2021-10-04
Applicant: Applied Materials, Inc.
Inventor： Yangyang SUN , Jinxin FU , Kazuya DAITO , Ludovic GODET
IPC: G06T7/00 , G02B26/10 , G02B26/08 , G01B11/26 , H04N5/247 , H04N5/225 , H04N5/235 , G06T7/90 , G06T7/80
Abstract: Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of first metrics and one or more second metrics for optical devices, the one or more second metrics including a display leakage metric.
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公开(公告)号：US20220121030A1
公开(公告)日：2022-04-21
申请号：US17492826
申请日：2021-10-04
Applicant: Applied Materials, Inc.
Inventor： Yangyang SUN , Jinxin FU , Kazuya DAITO , Ludovic GODET
Abstract: Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of see-through metrics for optical devices.
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公开(公告)号：US20220120700A1
公开(公告)日：2022-04-21
申请号：US17492857
申请日：2021-10-04
Applicant: Applied Materials, Inc.
Inventor： Yangyang SUN , Jinxin FU , Kazuya DAITO , Ludovic GODET
IPC: G01N21/958
Abstract: Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of see-through metrics for optical devices.
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Patent Agency Ranking
公开(公告)号：US20220077794A1
公开(公告)日：2022-03-10
申请号：US17455312
申请日：2021-11-17
Applicant: Applied Materials, Inc.
Inventor： Wayne MCMILLAN , Visweswaren SIVARAMAKRISHNAN , Joseph C. OLSON , Ludovic GODET , Rutger MEYER TIMMERMAN THIJSSEN , Naamah ARGAMAN
Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.
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公开(公告)号：US20200332414A1
公开(公告)日：2020-10-22
申请号：US16795232
申请日：2020-02-19
Applicant: Applied Materials, Inc.
Inventor： Jinrui GUO , Ludovic GODET , Rutger MEYER TIMMERMAN THIJSSEN , Yongan XU , Jhenghan YANG , Chien-An CHEN
Abstract: Embodiments of the present disclosure generally relate to processing a workpiece containing a substrate during deposition, etching, and/or curing processes with a mask to have localized deposition on the workpiece. A mask is placed on a first layer of a workpiece, which protects a plurality of trenches from deposition of a second layer. In some embodiments, the mask is placed before deposition of the second layer. In other embodiments, the second layer is cured before the mask is deposited. In other embodiments, the second layer is etched after the mask is deposited. Methods disclosed herein allow the deposition of a second layer in some of the trenches present in the workpiece, while at least partially preventing deposition of the second layer in other trenches present in the workpiece.
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公开(公告)号：US20200270746A1
公开(公告)日：2020-08-27
申请号：US16395005
申请日：2019-04-25
Applicant: Applied Materials, Inc.
Inventor： Tapashree ROY , Rutger MEYER TIMMERMAN THIJSSEN , Ludovic GODET , Jinxin FU
Abstract: A method and apparatus for creating a flat optical structure is disclosed. The method includes etching at least one trench in a substrate, placing a dielectric material in at least one trench in the substrate and encapsulating the top of the substrate with a film.
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公开(公告)号：US20190187563A1
公开(公告)日：2019-06-20
申请号：US16272962
申请日：2019-02-11
Applicant: Applied Materials, Inc.
Inventor： Viachslav BABAYAN , Douglas A. BUCHBERGER, JR. , Qiwei LIANG , Ludovic GODET , Srinivas D. NEMANI , Daniel J. WOODRUFF , Randy HARRIS , Robert B. MOORE
IPC: G03F7/20 , G03F7/38 , H01L21/687 , G03F7/16 , G03F7/26
CPC classification number: G03F7/2035 , G03F7/168 , G03F7/26 , G03F7/38 , H01L21/68764
Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.
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公开(公告)号：US20180366318A1
公开(公告)日：2018-12-20
申请号：US15624648
申请日：2017-06-15
Applicant: Applied Materials, Inc.
Inventor： Christine Y. OUYANG , Ludovic GODET
IPC: H01L21/027 , H01L21/285 , H01L21/02 , H01L21/32 , C23C16/455 , B05D1/00 , B05D3/02
Abstract: Methods for depositing desired materials formed on different locations of a substrate with different materials using a selective deposition process for semiconductor applications are provided. In one embodiment, a method of forming a structure with desired materials on a substrate includes disposing organic materials on a surface of a substrate, performing a thermal treatment process to form polymer brush materials from the organic materials selective on a first region of the substrate, and selectively forming a material layer on a second region of the substrate uncovered by the polymer brush materials.
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