公开(公告)号：US20110024510A1

公开(公告)日：2011-02-03

申请号：US12902174

申请日：2010-10-12

申请人： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO ,  Katsumi TANIGUCHI

发明人： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO ,  Katsumi TANIGUCHI

IPC分类号： G06K19/077

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01Q1/38 ,  H01Q7/00 ,  H04B5/0081 ,  Y10T29/49124

摘要： A wireless IC device prevents deviations of the resonant frequency from the desired value. An antenna coil has an end portion positioned in a connector provided on the negative-most side in the z-axis direction and an end portion positioned in a connector provided on the positive-most side in the z-axis direction. A wireless IC is electrically connected to the end portions. A via hole conductor is provided between the end portion and the wireless IC and penetrates through a plurality of insulator layers. A via hole conductor is provided in the antenna coil such that the length of a current path thereto from the end portion is the shortest among a plurality of via hole conductors. The distance between the via hole conductor and the via hole conductor is larger than the distances between the penetrating via hole conductor and the via hole conductors.

摘要翻译： 无线IC器件防止谐振频率偏离期望值。 天线线圈具有位于设置在z轴方向最负侧的连接器中的端部和位于设置在z轴方向最正侧的连接器中的端部。 无线IC电连接到端部。 通孔导体设置在端部与无线IC之间并穿透多个绝缘体层。 在天线线圈中设置有通孔导体，使得从端部到其的电流路径的长度在多个通孔导体中是最短的。 通孔导体和通孔导体之间的距离大于穿透通孔导体和通孔导体之间的距离。

公开(公告)号：US20100283694A1

公开(公告)日：2010-11-11

申请号：US12845846

申请日：2010-07-29

申请人： Noboru KATO

发明人： Noboru KATO

IPC分类号： H01Q1/00

CPC分类号： G06K19/07749 ,  G06K19/07767 ,  G06K19/07777 ,  G06K19/07779 ,  G06K19/07786 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/26 ,  H01Q9/285

摘要： A composite antenna achieves favorable radiation characteristics and favorable communication performance, and can be used in short distance communication as well as long distance communication. The composite antenna includes a dipole antenna having an elongated shape, a loop antenna including at least one pair of opposing end portions, and a connection portion arranged to connect the dipole antenna and a point of the loop antenna at which the amplitude of a current flowing in the loop antenna has a maximum value. The dipole antenna performs long distance communication utilizing an electric field, and the loop antenna performs short distance communication utilizing a magnetic field. This composite antenna may be used as a wireless IC device in RFID systems.

摘要翻译： 复合天线实现良好的辐射特性和良好的通信性能，可用于短距离通信以及远距离通信。 复合天线包括具有细长形状的偶极天线，包括至少一对相对的端部的环形天线，以及连接部分，其连接偶极子天线和环形天线的点，其中流动的电流的振幅 在环形天线中具有最大值。 偶极天线利用电场进行长距离通信，环形天线利用磁场进行短距离通信。 该复合天线可以用作RFID​​系统中的无线IC器件。

公开(公告)号：US20100103058A1

公开(公告)日：2010-04-29

申请号：US12688072

申请日：2010-01-15

申请人： Noboru KATO ,  Satoshi ISHINO ,  Takeshi KATAYA ,  Ikuhei KIMURA ,  Nobuo IKEMOTO ,  Yuya DOKAI

发明人： Noboru KATO ,  Satoshi ISHINO ,  Takeshi KATAYA ,  Ikuhei KIMURA ,  Nobuo IKEMOTO ,  Yuya DOKAI

IPC分类号： H01Q1/24

CPC分类号： G06K19/07749 ,  G06K19/06187 ,  G06K19/0723 ,  G06K19/07756 ,  G06K19/07773 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  G06K19/07786 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00014 ,  H01L2924/00

摘要： A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

摘要翻译： 无线IC器件包括：电磁耦合模块，包括布置成处理发送和接收信号的无线IC芯片和包括电感元件的馈电电路板。 馈电电路板包括电磁耦合到馈电电路的外部电极，并且外部电极电连接到屏蔽壳体或布线电缆。 屏蔽壳或接线电缆用作辐射板。 无线IC芯片由屏蔽壳或布线接收到的信号进行操作，来自无线IC芯片的应答信号从屏蔽壳或布线电缆向外部辐射。 金属部件用作辐射板，并且金属部件可以是布置在印刷线路板上的接地电极。

公开(公告)号：US20100038437A1

公开(公告)日：2010-02-18

申请号：US12603608

申请日：2009-10-22

申请人： Noboru KATO ,  Yuya DOKAI

发明人： Noboru KATO ,  Yuya DOKAI

IPC分类号： G06K19/07

CPC分类号： G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q7/00

摘要： A wireless IC device has a structure such that the size of a radiation plate and a radiation characteristic may be determined irrespective of an impedance of a wireless IC chip. The wireless IC device includes a wireless IC chip that is arranged to process transmission and reception signals, a spiral matching inductance element and a plane electrode that are located on a surface of a feeder circuit substrate, and a coil-shaped radiation plate located on a radiation substrate. Plane electrodes connected to both ends of the radiation plate are electromagnetically coupled respectively to the inductance element and the plane electrode. The wireless IC chip is operated by a signal received by the radiation plate, and a response signal from the wireless IC chip is radiated outside from the radiation plate.

摘要翻译： 无线IC器件具有能够确定辐射板的尺寸和辐射特性而不考虑无线IC芯片的阻抗的结构。 无线IC器件包括布置成处理发送和接收信号的无线IC芯片，位于馈电电路基板的表面上的螺旋匹配电感元件和平面电极以及位于馈电电路基板的表面上的线圈形辐射板 辐射基板。 连接到辐射板两端的平面电极分别电磁耦合到电感元件和平面电极。 无线IC芯片由辐射板接收的信号操作，并且来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US20090302972A1

公开(公告)日：2009-12-10

申请号：US12536663

申请日：2009-08-06

申请人： Makoto OSAMURA ,  Norio SAKAI ,  Noboru KATO

发明人： Makoto OSAMURA ,  Norio SAKAI ,  Noboru KATO

IPC分类号： H03H7/00

CPC分类号： H01Q1/2208 ,  B65D65/403 ,  B65D2203/10 ,  G06K19/07749 ,  H01L2224/16225 ,  H01Q1/12 ,  H01Q1/2216 ,  H01Q1/2225

摘要： A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.

摘要翻译： 包装材料包括用于RFID系统的电磁耦合模块，其中无线电IC芯片被保护免受外部冲击和环境变化而不影响包装材料的平面性，促进了包括电磁耦合模块的组件，并且辐射特性 令人满意 包装材料包括衬垫和波形芯材料，其中电磁耦合模块布置在包装材料的内部。 电磁耦合模块包括无线电IC芯片和馈电电路板，其上安装有无线电IC芯片，馈电电路板包括包括电感元件的谐振电路。 包装材料由电介质制成，其中电介质和电磁耦合模块电磁耦合以发送/接收高频信号。

公开(公告)号：US20090160719A1

公开(公告)日：2009-06-25

申请号：US12336629

申请日：2008-12-17

申请人： Noboru KATO ,  Jun SASAKI

发明人： Noboru KATO ,  Jun SASAKI

IPC分类号： H01Q7/06 ,  H01Q11/12

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  H01F2017/002

摘要： A radio frequency IC device includes a radio frequency IC chip, a feeder circuit substrate, and a radiating plate. The feeder circuit substrate includes a feeder circuit that electrically connects to the radio IC chip and that includes a resonance circuit and/or a matching circuit including inductance elements. The feeder circuit substrate is bonded to the radiating plate, which radiates a transmission signal supplied from the feeder circuit and supplies a received signal to the feeder circuit. The inductance elements are arranged in spiral patterns wound in opposite directions and couple to each other in opposite phases. The radio frequency IC device is able to obtain a radio frequency IC device that is not susceptible to being affected by a usage environment, minimizes variations in radiation characteristics, and can be used in a wide frequency band.

摘要翻译： 射频IC器件包括射频IC芯片，馈电电路基板和散热板。 供电电路基板包括电连接到无线电IC芯片并且包括谐振电路和/或包括电感元件的匹配电路的馈电电路。 供电电路基板被接合到辐射板，辐射从馈电电路提供的传输信号，并将接收到的信号提供给馈电电路。 电感元件以相反方向缠绕的螺旋图案布置，并以相反的方式相互耦合。 无线射频IC器件能够获得不易受到使用环境影响的射频IC器件，使辐射特性的变化最小化，可以在宽频带中使用。

公开(公告)号：US20090121030A1

公开(公告)日：2009-05-14

申请号：US12339198

申请日：2008-12-19

申请人： Noboru KATO ,  Nobuo IKEMOTO

发明人： Noboru KATO ,  Nobuo IKEMOTO

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/07756 ,  G06K19/07758 ,  G06K19/07771 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01Q1/2225 ,  H01Q7/00 ,  H04B5/0012

摘要： A wireless IC device includes a cutout portion having no aluminum-deposited film that is provided at an end of an article package made of an aluminum-deposited laminated film, and an electromagnetic coupling module is provided at the cutout portion. The electromagnetic coupling module and the aluminum-deposited film of the package define a wireless IC device. A loop electrode, which is a magnetic field transmission auxiliary radiator of the electromagnetic coupling module, is coupled to the aluminum-deposited film of the package. Thus, the article package functions as a radiator of an antenna.

摘要翻译： 无线IC器件包括没有铝沉积膜的切口部分，其设置在由铝沉积层压膜制成的物品包装的端部，并且在切口部分设置电磁耦合模块。 封装的电磁耦合模块和铝沉积膜定义了无线IC器件。 作为电磁耦合模块的磁场传输辅助散热器的环形电极耦合到封装的铝沉积膜。 因此，物品包用作天线的辐射器。

公开(公告)号：US20080143630A1

公开(公告)日：2008-06-19

申请号：US12042399

申请日：2008-03-05

申请人： Noboru KATO ,  Satoshi ISHINO

发明人： Noboru KATO ,  Satoshi ISHINO

IPC分类号： H01Q9/28

CPC分类号： H01Q9/285 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/50

摘要： A wireless IC device includes a flexible sheet provided with a wireless IC chip and radiation plates. The wireless IC chip is connected by an Au bump to a feeder circuit which is located on the sheet and which has a predetermined resonant frequency and a predetermined impedance. The feeder circuit includes electrode patterns, and the feeder circuit and the radiation plates are capacitively coupled with each other through the flexible sheet.

摘要翻译： 无线IC器件包括具有无线IC芯片和辐射板的柔性片。 无线IC芯片通过Au凸块连接到位于薄片上并具有预定谐振频率和预定阻抗的馈电电路。 馈线电路包括电极图案，并且馈电电路和辐射板通过柔性片彼此电容耦合。

公开(公告)号：US20080061983A1

公开(公告)日：2008-03-13

申请号：US11930818

申请日：2007-10-31

申请人： Yuya DOKAI ,  Noboru KATO ,  Satoshi ISHINO

发明人： Yuya DOKAI ,  Noboru KATO ,  Satoshi ISHINO

IPC分类号： G08B1/08

CPC分类号： H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

摘要翻译： 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

公开(公告)号：US20070252703A1

公开(公告)日：2007-11-01

申请号：US11740509

申请日：2007-04-26

申请人： Noboru KATO ,  Ikuhei KIMURA ,  Kimikazu IWASAKI ,  Satoshi ISHINO

发明人： Noboru KATO ,  Ikuhei KIMURA ,  Kimikazu IWASAKI ,  Satoshi ISHINO

IPC分类号： G08B13/14

CPC分类号： H02J50/12 ,  G06K19/07749 ,  G06K19/07771 ,  G06K19/07773 ,  H01L2224/16227 ,  H02J17/00

摘要： An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.

摘要翻译： 一种电磁耦合模块，其包括无线电IC芯片和其上安装有无线电IC芯片的馈电电路板，以及包括具有预定谐振频率的谐振电路的馈电电路。 该物品具有通过电磁耦合辐射从电磁耦合模块的馈电电路提供的传输信号并且经由电磁耦合将接收到的接收信号提供给馈电电路的辐射元件。