Abstract:
Embodiments of the invention provide a package for holding an integrated circuit or other electronic component and/or a packaged integrated circuit or electronic component which is formed at least in part via an electrochemical fabrication process from a plurality of adhered layers of conductive and dielectric materials.
Abstract:
A differential pressure sensor based on pressure induced micro-flow that includes two connecting hoses that are considered when the pressure sensor is calibrated. The inventive differential pressure sensor includes a flexible hose as part of the device itself, and is calibrated with the flexible hose in place (consequently, a usable hose length needs to be specified beforehand). Calibration constants for the air flow channel are determined and stored in non-volatile memory, and used to provide accurate pressure measurements. Thus, impedance in the air flow path introduced by the flexible hose is considered when the pressure sensor is calibrated. That insures that any measurement of air flow is not adversely effected by the introduction of an impedance in the air flow path previously not considered by the sensor. The present invention thus provides a self-contained differential pressure sensing device suitable for detecting changes in pressure for applications where a small amount of leakage is acceptable.
Abstract:
An environmental monitoring and controlling system for a ventilated cage and rack system that monitors and measures air flow in the rack at either the rack or cage level. At the rack level, two pressure sensors are provided in a supply air system to accurately monitor the air flow rate into the rack. In addition, two pressure sensors may be provided in an exhaust air system to accurately monitor the air flow rate out of the rack. At the cage level, a cage may be equipped with a highly accurate pressure sensor, including a Venturi tube and thermistor, the monitor the air flow rate in a cage located at any cage position in the rack.
Abstract:
Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.
Abstract:
Various embodiments of the invention present miniature medical devices that may be formed totally or in part using electrochemical fabrication techniques. Sample medical devices include micro-tweezers or forceps, internally expandable stents, bifurcated or side branch stents, drug eluting stents, micro-valves and pumps, rotary ablation devices, electrical ablation devices (e.g. RF devices), micro-staplers, ultrasound catheters, and fluid filters. In some embodiments devices may be made out of a metal material while in other embodiments they may be made from a material (e.g. a polymer) that is molded from an electrochemically fabricated mold. Structural materials may include gold, platinum, silver, stainless steel, titanium or pyrolytic carbon-coated materials such as nickel, copper, and the like.
Abstract:
Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.
Abstract:
Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.
Abstract:
The invention provides an optical system for use in a stable, temperature-insensitive birefringent crystal interferometer (BCI). The optical system includes a first block of light transmissive birefringent material having an input port and an output port, the material having in the spectral region of desired device operation a net retardance at a first temperature, and straining means for inducing a strain in one of the first block and a second block of light transmissive material optically coupled to the first block, the strain induced for maintaining the net retardance substantially unchanged from the net retardance at least a second other temperature. Advantageously, the optical system uses a single variety of crystal, which is cheaper, more robust, and has better performance than BCIs having two crystal varieties.