Abstract:
This is directed to a cable structure for use with an electronic device. The cable structure can include one or more conductors around which a sheath is provided. To prevent the cable structure from tangling, the cable structure can include a core placed between the conductors and the sheath, where a stiffness of the core can be varied along different segments of the cable structure to facilitate or hinder bending of the cable structure in different areas. The size and distribution of the stiffer portions can be selected to prevent the cable from forming loops. The resistance of the core to bending can be varied using different approaches including, for example, by varying the materials used in the core, varying a cross-section of portions of the core, or combinations of these.
Abstract:
An electronic device may include a biometric sensing device that has a sensing area, and a substrate positioned above the sensing area and/or the biometric sensing device. The substrate can include vias that are formed through at least a portion of the substrate. The vias can be positioned at least above the sensing area of the biometric sensing device. The vias may be filled with a conductive material or a dielectric material. Alternatively, some vias can be filled with a conductive material while other vias are filled with a non-conductive or dielectric material.
Abstract:
Systems and methods for strengthening a sapphire part are described herein. One embodiment may take the form of a method including orienting a first surface of a sapphire member relative to an ion implantation device and performing a first implantation step. The implanting step may include directing ions at the first surface of the sapphire member to embed them under the first surface. The systems and methods may also include one or more of heating the sapphire member to diffuse the implanted ions into deeper layers of sapphire member, cooling the sapphire member, and performing at least a second implantation step directing ions at the first surface of the sapphire member to embed the ions under the first surface.
Abstract:
A strengthened film for a substrate such as a glass panel is provided. The strengthened film may be formed by implanting sodium in the film, and then performing an exchange through which the sodium is replaced by potassium. The film may be an anti-reflective coating. Related assemblies and methods are also provided.
Abstract:
An electronic device may include a biometric sensing device that has a sensing area, and a substrate positioned above the sensing area and/or the biometric sensing device. The substrate can include vias that are formed through at least a portion of the substrate. The vias can be positioned at least above the sensing area of the biometric sensing device. The vias may be filled with a conductive material or a dielectric material. Alternatively, some vias can be filled with a conductive material while other vias are filled with a non-conductive or dielectric material.
Abstract:
A method of inspecting and forming sapphire structures. The method of inspecting a sapphire structure may include may include providing an annealed sapphire structure, and measuring a profile of at least a portion of the annealed sapphire structure. The profile of at least the portion of the annealed sapphire structure may be measured using a non-x-ray based measuring device. Additionally, the method of inspecting may include identifying a defect within at least a portion of the measured profile of the annealed sapphire structure.
Abstract:
A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device.
Abstract:
An electronic device may be provided with a display mounted in a housing. The display may have an array of display pixels that provide image light to a user. The array of display pixels may form an active display structure with a rectangular shape. The rectangular active display structure may be surrounded by an inactive border region. Optical structures such as a sheet of glass or another optical member may have portions that are configured to bend light from the display pixels along the periphery of the active display structure. The optical member may have an area that is larger than the area of the active display structure, so that the presence of the optical member may serve to enlarge the apparent size of the display. Solidified liquid polymer may be used to support the optical structures and may be interposed between the optical structures and the active display structures.
Abstract:
An electronic device may be provided with a display mounted in a housing. The display may have an array of display pixels that provide light to a user. The array of display pixels may form active display structures with a rectangular shape. The rectangular active display structures may be surrounded by an inactive border region. Reflector structures may be used to reflect light that is emitted from peripheral portions of the active display structures to a portion of the display overlapping the inactive border region, thereby providing the display with an effective active area that is larger than the area of the active display structures. The reflector structures may include rotatable reflectors. Control circuitry may use a rotatable positioner to rotate rotatable reflector structures in synchronization with controlling which pixel data is displayed by the display pixels in the peripheral portions of the active display structures.
Abstract:
Systems and methods are presented for efficient heating during production of corundum. One embodiment takes the form of a system for processing corundum including a first furnace and a second furnace. The first and second furnaces are sequentially arranged and heat from the first furnace is subsequently used to heat the second furnace.