Abstract:
A pattern forming apparatus for forming a pattern on a substrate comprising a first exposure section capable of pattern exposure for a predetermined line width, a second exposure section for conducting pattern exposure for a line width greater than the predetermined line width of the first exposure section, and a means for detecting the relative positional relationship between the first exposure section and the second exposure section, wherein pattern exposure is conducted by using the first exposure section and the second exposure section on the basis of the detected positional relationship.
Abstract:
Disclosed is an exposure method in which a multiple exposure process including a first exposure for a first pattern and a second exposure for a second pattern is performed by use of a projection optical system to thereby resolve a desired pattern, wherein a numerical aperture NA1 of the projection optical system for the first pattern exposure and a numerical aperture NA2 of the projection optical system for the second pattern exposure are made different from each other.
Abstract:
An apparatus for semiconductor device manufacture is disclosed, which apparatus includes first and second, different exposure systems each for forming an image of a circuit pattern on a substrate coated with a photosensitive material, and a stationary member for supporting the first and second exposure systems.
Abstract:
A method of reducing a registration error is provided in which the registration error can be uniformly distributed even if an amount of displacement is larger than others at only one of a plurality of measuring points. According to the method, amounts of displacement are measured first at a plurality of measuring points, then one half the sum of the maximum value and the minimum value of the measured amounts of displacement is calculated to obtain a correction value. The correction value is fed back to an exposure apparatus as a correction value for an exposure condition setting file within the exposure apparatus used in an exposure step. The registration error can be distributed uniformly even if amounts of displacement at a plurality of measuring points are considerably different from each other.
Abstract:
The mask for checking lens distortion comprises a plurality of mother verniers formed at each portion of the quartz and a plurality of the daughter verniers spaced from each of the plurality of the mother verniers.
Abstract:
Photosensitive polyimides used in microelectronic structures are cross-linked without exposing the associated microelectronic structures to elevated temperatures that can lower the process yield and reduce the reliability of the microelectronic structures. The photosensitive polyimides are cured by exposing them to deep ultraviolet radiation that has a spectral output effective to crosslink the polyimide. The cross-linking hardens the polyimide and renders it insoluble in solvents such as photoresist strippers.
Abstract:
A digital lithography system includes adjacent scan regions, exposure units located above the scan regions, a memory, and a processing device operatively coupled to the memory. The exposure units include a first exposure unit associated with a first scan region and a second exposure unit associated with a second scan region. The processing device is to initiate a digital lithography process to pattern a substrate disposed on a stage in accordance with instructions. The processing device is to further perform a first pass of the first exposure unit over a stitching region at an interface of the first scan region and the second scan region at a first time. The processing device is to further perform a second pass of the second exposure unit over the stitching region at a second time that varies from the first time by less than forty seconds.
Abstract:
A method of determining matching performance between tools used in semiconductor manufacture and associated tools is described. The method includes obtaining a plurality of data sets related to a plurality of tools and a representation of the data sets in a reduced space having a reduced dimensionality. A matching metric and/or matching correction is determined based on matching the reduced data sets in the reduced space.
Abstract:
The present invention provides a method for multiscale patterning of a sample. The method includes: placing the sample in an apparatus having both thermo-optical lithography capability and thermal scanning probe lithography capability; and patterning two patterns onto the sample, respectively by: thermo-optical lithography, wherein light is emitted from a light source onto the sample to heat the latter and thereby write a first pattern that is the largest of the two patterns; and thermal scanning probe lithography, wherein the sample and a heated probe tip are brought in contact for writing a second pattern that has substantially smaller critical dimensions than the first pattern. There is also provided an apparatus for multiscale patterning of a sample.
Abstract:
A model-based tuning method for tuning a first lithography system utilizing a reference lithography system, each of which has tunable parameters for controlling imaging performance. The method includes the steps of defining a test pattern and an imaging model; imaging the test pattern utilizing the reference lithography system and measuring the imaging results; imaging the test pattern utilizing the first lithography system and measuring the imaging results; calibrating the imaging model utilizing the imaging results corresponding to the reference lithography system, where the calibrated imaging model has a first set of parameter values; tuning the calibrated imaging model utilizing the imaging results corresponding to the first lithography system, where the tuned calibrated model has a second set of parameter values; and adjusting the parameters of the first lithography system based on a difference between the first set of parameter values and the second set of parameter values.