公开(公告)号：US20150061813A1

公开(公告)日：2015-03-05

申请号：US14155244

申请日：2014-01-14

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Chengjie Zuo ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Robert Paul Mikulka ,  Xiangdong Zhang ,  Jonghae Kim ,  Je-Hsiung Lan

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F41/041 ,  H01F17/0013 ,  H01F27/2804 ,  H01F41/042 ,  H01F2017/0053 ,  H01F2017/0073 ,  H01F2027/2809

Abstract: A particular device includes a substrate and a spiral inductor coupled to the substrate. The spiral inductor includes a first conductive spiral and a second conductive spiral overlaying the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate that is greater than the first thickness. A portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.

Abstract translation: 特定器件包括衬底和耦合到衬底的螺旋电感器。 螺旋电感器包括覆盖第一导电螺旋的第一导电螺旋和第二导电螺旋。 螺旋电感器的最内圈的第一部分在垂直于衬底的方向上具有第一厚度。 最内圈的第一部分包括第一导电螺旋的第一部分，并且不包括第二导电螺旋。 最内圈的第二部分包括第二导电螺旋的第一部分。 螺旋电感器的最外圈的一部分在垂直于衬底的方向上具有大于第一厚度的第二厚度。 最外圈的一部分包括第一导电螺旋的第二部分和第二导电螺旋的第二部分。

公开(公告)号：US20140327496A1

公开(公告)日：2014-11-06

申请号：US13887568

申请日：2013-05-06

Applicant: QUALCOMM INCORPORATED

Inventor： Chengjie Zuo ,  Daeik D. Kim ,  Je-Hsiung Lan ,  Jonghae Kim ,  Mario Francisco Velez ,  Changhan Yun ,  David F. Berdy ,  Robert P. Mikulka ,  Matthew M. Nowak ,  Xiangdong Zhang ,  Puay H. See

IPC: H03H7/46 ,  H03H3/00

CPC classification number: H03H7/461 ,  H03H3/00 ,  H03H7/0115 ,  H03H7/463 ,  Y10T29/49016

Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.

Abstract translation: 公开了三维（3D）集成电路（IC）（3DIC）中的可调谐双工器。 在一个实施例中，可调谐双工器可以通过在双工器中提供变容二极管或可变电感器之一来形成。 可变电抗器或可变电感器的可变特性允许调谐双工器中的陷波，以便选择频带停止以消除期望频率处的谐波以及控制通带的截止频率。 通过将双工器的元件堆叠成三维空间是保守的，并且可以使用各种变容二极管和电感器。

公开(公告)号：US20140055214A1

公开(公告)日：2014-02-27

申请号：US13765669

申请日：2013-02-12

Applicant: QUALCOMM INCORPORATED

Inventor： Sanghoon Joo ,  Chi Shun Lo ,  Chengjie Zuo ,  Changhan Hobie Yun ,  Jonghae Kim

IPC: H03H9/70 ,  H03H9/54

CPC classification number: H03H9/54 ,  H03H9/02062 ,  H03H9/02157 ,  H03H9/02259 ,  H03H9/462 ,  H03H9/525 ,  H03H9/568 ,  H03H9/70 ,  H03H2009/02291 ,  H03H2009/02527

Abstract: A multi-mode bandpass filter is described. The bandpass filter includes a first multi-directional vibrating microelectromechanical systems resonator. The bandpass filter also includes a second multi-directional vibrating microelectromechanical systems resonator. The first multi-directional vibrating microelectromechanical systems resonator is in a parallel configuration. The second multi-directional vibrating microelectromechanical systems resonator is in a series configuration.

Abstract translation: 描述了多模式带通滤波器。 带通滤波器包括第一多向振动微机电系统谐振器。 带通滤波器还包括第二多向振动微机电系统谐振器。 第一多向振动微机电系统谐振器处于并联配置。 第二多向振动微机电系统谐振器是串联配置。

公开(公告)号：US10944379B2

公开(公告)日：2021-03-09

申请号：US15379392

申请日：2016-12-14

Applicant: QUALCOMM Incorporated

Inventor： David Francis Berdy ,  Changhan Hobie Yun ,  Shiqun Gu ,  Niranjan Sunil Mudakatte ,  Mario Francisco Velez ,  Chengjie Zuo ,  Jonghae Kim

IPC: H03H9/05 ,  H03H9/64 ,  H03H3/08 ,  H03H9/72 ,  H03H9/70 ,  H03H3/02

Abstract: An integrated radio frequency (RF) circuit combines complementary features of passive devices and acoustic filters and includes a first die, a second die, and a third die. The first die includes a substrate having one or more passive devices. The second die includes a first acoustic filter. The second die is stacked and coupled to a first surface of the first die. The third die includes a second acoustic filter. The third die is stacked and coupled to a second surface opposite the first surface of the first die.

公开(公告)号：US10607980B2

公开(公告)日：2020-03-31

申请号：US15861140

申请日：2018-01-03

Applicant: QUALCOMM Incorporated

Inventor： Je-Hsiung Jeffrey Lan ,  Niranjan Sunil Mudakatte ,  Changhan Hobie Yun ,  Daeik Daniel Kim ,  Chengjie Zuo ,  David Francis Berdy ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H01L27/01 ,  H01L23/15 ,  H01L23/522 ,  H01L49/02 ,  H01L23/498 ,  H01L21/48 ,  H01G2/02 ,  H01G4/005

Abstract: A device includes a glass substrate and a capacitor. The capacitor includes a first metal coupled to a first electrode, a dielectric structure, and a via structure comprising a second electrode of the capacitor. The first metal structure is separated from the via structure by the dielectric structure.

公开(公告)号：US10354795B2

公开(公告)日：2019-07-16

申请号：US15242007

申请日：2016-08-19

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Chengjie Zuo ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Robert Paul Mikulka ,  Xiangdong Zhang ,  Jonghae Kim ,  Je-Hsiung Lan

IPC: H01F7/06 ,  H01F41/04 ,  H01F27/28 ,  H01F17/00

Abstract: A method includes forming a first conductive spiral and a second conductive spiral of a spiral inductor coupled to a substrate. The second conductive spiral overlays the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate. The second thickness is greater than the first thickness. The portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.

公开(公告)号：US10312193B2

公开(公告)日：2019-06-04

申请号：US15235790

申请日：2016-08-12

Applicant: QUALCOMM Incorporated

Inventor： Shiqun Gu ,  Chengjie Zuo ,  Steve Fanelli ,  Husnu Ahmet Masaracioglu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/538 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/66 ,  H01L25/07 ,  H01L25/00 ,  H03H1/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: A package includes a redistribution portion, a first portion, and a second portion. The first portion is coupled to the redistribution portion. The first portion includes a first switch comprising a plurality of switch interconnects, and a first encapsulation layer that at least partially encapsulates the first switch. The second portion is coupled to the first portion. The second portion includes a first plurality of filters. Each filter includes a plurality of filter interconnects. The second portion also includes a second encapsulation layer that at least partially encapsulates the first plurality of filters. The first portion includes a second switch positioned next to the first switch, where the first encapsulation layer at least partially encapsulates the second switch. The second portion includes a second plurality of filters positioned next to the first plurality of filters, where the secod encapsulation layer at least partially encapsulates the second plurality of filters.

公开(公告)号：US10290414B2

公开(公告)日：2019-05-14

申请号：US14841132

申请日：2015-08-31

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  Mario Francisco Velez ,  Chengjie Zuo ,  Daeik Daniel Kim ,  David Francis Berdy ,  Je-Hsiung Jeffrey Lan ,  Jonghae Kim ,  Niranjan Sunil Mudakatte ,  Robert Paul Mikulka

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/245 ,  H01F41/14 ,  H01F41/04 ,  H01F17/00 ,  H01F41/32 ,  H01L23/64 ,  H05K1/16

Abstract: A substrate includes a first dielectric layer, a magnetic core at least partially in the first dielectric layer, where the magnetic core comprises a first non-horizontal thin film magnetic (TFM) layer. The substrate also includes a first inductor that includes a plurality of first interconnects, where the first inductor is positioned in the substrate to at least partially surround the magnetic core. The magnetic core may further include a second non-horizontal thin film magnetic (TFM) layer. The magnetic core may further include a core layer. The magnetic core may further include a third thin film magnetic (TFM) layer, and a fourth thin film magnetic (TFM) layer that is substantially parallel to the third thin film magnetic (TFM) layer.

公开(公告)号：US10249580B2

公开(公告)日：2019-04-02

申请号：US15190158

申请日：2016-06-22

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Changhan Hobie Yun ,  David Francis Berdy ,  Chengjie Zuo ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H01L23/64 ,  H01F41/04 ,  H01L23/522 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H01L27/08

Abstract: In conventional device packages, separate standalone inductors are provided and mounted on an interposer substrate along with a die. Separate inductors reduce integration density, decrease flexibility, increase footprint, and generally increase costs. To address such disadvantages, it is proposed to provide a part of an inductor in a substrate below a die. The proposed stacked substrate inductor may include a first inductor in a first substrate, a second inductor in a second a second substrate stacked on the first substrate, and an inductor interconnect coupling the first and second inductors. The core regions of the first and second inductors may overlap with each other at least partially. The proposed stacked substrate inductor may enhance integration density, increase flexibility, decrease footprint, and/or reduce costs.

公开(公告)号：US10242957B2

公开(公告)日：2019-03-26

申请号：US14633934

申请日：2015-02-27

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  David Francis Berdy ,  Chengjie Zuo ,  Jonghae Kim ,  Matthew Michael Nowak

IPC: H01L23/60 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/552

Abstract: Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a multichip module or device, such as a multichip module or device with flip-chip (FC) bumps. Intra-module shielding between individual chips within the multichip module or device is achieved by electromagnetic or radio-signal (RF) isolation provided by the surfaces of the conductor shield immediately surrounding each of the chips. The conductor shield is directly connected to one or more grounded conductor portions of a substrate or interposer to ensure reliable grounding.