公开(公告)号：US20150171047A1

公开(公告)日：2015-06-18

申请号：US14132812

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Pramod Malatkar ,  Hemanth Dhavaleswarapu ,  James Neeb

IPC: H01L23/00 ,  B29C65/18

CPC classification number: H01L24/75 ,  B29L2031/34 ,  B29L2031/3425 ,  H01L2021/603 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/0104 ,  H01L2924/01074 ,  H01L2924/0474 ,  H01L2924/0489 ,  H01L2924/04894 ,  H01L2924/05032 ,  H01L2924/0549 ,  Y10T29/49826

Abstract: Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.

Abstract translation: 公开了热压接工艺粘结头的实施例和用于制造热压接工艺粘合头的方法。 在一些实施例中，接合头包括热压接工艺加热器和通过环形结构联接到加热器的冷却块。 环形结构围绕冷却块的下部并且将冷却块连接到加热器，使得冷却块和加热器之间不存在直接的机械接触。

公开(公告)号：US20240128154A1

公开(公告)日：2024-04-18

申请号：US18531002

申请日：2023-12-06

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/3735 ,  H01L23/3731 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/05005 ,  H01L2224/05022 ,  H01L2224/45005 ,  H01L2224/4502 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/04894 ,  H01L2924/0665 ,  H01L2924/351

Abstract: Provided is a thermally conductive film-like adhesive capable of sufficiently advancing a curing reaction under milder conditions, capable of effectively suppressing residual voids between the adhesive and a wiring board in a semiconductor package to be obtained when used as a die attach film, and capable of obtaining a semiconductor package excellent in heat releasing property inside the package. In addition, provided are a semiconductor package using the thermally conductive film-like adhesive and a method of producing the same.

公开(公告)号：US09548284B2

公开(公告)日：2017-01-17

申请号：US14132812

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Pramod Malatkar ,  Hemanth Dhavaleswarapu ,  James Neeb

IPC: H01L23/00 ,  H01L21/603 ,  B29L31/34

CPC classification number: H01L24/75 ,  B29L2031/34 ,  B29L2031/3425 ,  H01L2021/603 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/0104 ,  H01L2924/01074 ,  H01L2924/0474 ,  H01L2924/0489 ,  H01L2924/04894 ,  H01L2924/05032 ,  H01L2924/0549 ,  Y10T29/49826

Abstract: Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.

Abstract translation: 公开了热压接工艺粘结头的实施例和用于制造热压接工艺粘合头的方法。 在一些实施例中，接合头包括热压接工艺加热器和通过环形结构联接到加热器的冷却块。 环形结构围绕冷却块的下部并且将冷却块连接到加热器，使得冷却块和加热器之间不存在直接的机械接触。