Submicron thermal imaging method and enhanced resolution (super-resolved) ac-coupled imaging for thermal inspection of integrated circuits
    1.
    发明申请
    Submicron thermal imaging method and enhanced resolution (super-resolved) ac-coupled imaging for thermal inspection of integrated circuits 有权
    亚微米热成像方法和增强分辨率(超分辨率)交流耦合成像用于集成电路的热检测

    公开(公告)号:US20020126732A1

    公开(公告)日:2002-09-12

    申请号:US10039290

    申请日:2002-01-04

    Abstract: Methods and apparatus for non-contact thermal measurement which are capable of providing sub micron surface thermal characterization of samples, such as active semiconductor devices. The method obtains thermal image information by reflecting a light from a surface of a device in synchronous with the modulation of the thermal excitation and then acquiring and processing an AC-coupled thermoreflective image. The method may be utilized for making measurements using different positioning techniques, such as point measurements, surface scanning, two-dimensional imaging, and combinations thereof. A superresolution method is also described for increasing the resultant image resolution, based on multiple images with fractional pixel offsets, without the need to increase the resolution of the image detectors being utilized. The thermoreflective method provides a spatial resolution better than current infrared cameras, operates within a wide temperature range, and is capable of a thermal resolution on the order of 10 mKnull.

    Abstract translation: 用于非接触式热测量的方法和装置,其能够提供诸如有源半导体器件的样品的亚微米表面热表征。 该方法通过与热激发的调制同步地反射来自装置的表面的光,然后获取和处理AC耦合的热反射图像来获得热图像信息。 该方法可以用于使用不同的定位技术进行测量,例如点测量,表面扫描,二维成像及其组合。 还描述了超分辨率方法,用于基于具有分数像素偏移的多个图像来增加所得到的图像分辨率,而不需要增加正在使用的图像检测器的分辨率。 该热反射方法提供的空间分辨率优于目前的红外摄像机,在宽温度范围内工作,并能够在10 mK°的数量级下进行热分解。

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