Abstract:
A method of forming bumps of a semiconductor device with reduced solder bump collapse. The method includes preparing a semiconductor substrate in which pads are exposed externally from a passivation layer; forming a seed layer on the semiconductor substrate; forming a photoresist pattern to expose the seed layer on the pads; forming pillars by performing a primary electroplating on a region exposed by the photoresist pattern; forming a solder layer by performing a secondary electroplating on the pillars; removing the photoresist pattern; forming solder bumps, in which solders partially cover surfaces of the pillars, by performing a reflow process on the semiconductor substrate; and removing portions of the seed layer formed in regions other than the solder bumps.
Abstract:
A backlight assembly includes a light source, a light-guide plate, a mold frame and a bottom chassis. The mold frame includes a first bottom portion, a protrusion on a first surface of the first bottom portion and a first sidewall portion on a second surface of the first bottom portion opposite to the first surface of the first bottom portion and facing the light guide plate. The bottom chassis includes a second bottom portion having a hole to receive the protrusion of the first bottom portion, and a second sidewall portion facing the light guide plate. A cross sectional area of a first opening of the hole corresponding to an inner surface of the bottom chassis and contacting the first surface of mold frame is different than a cross sectional area of a second opening of the hole corresponding to an outer surface of the bottom chassis.
Abstract:
Upsampling for video signals is described. In particular chroma pixels may be upsampled in a luminance, chrominance signal using motion adaptive approaches. In one example, the operations include selecting an absent chroma pixel of the current frame, developing a spatial candidate value for the absent chroma pixel using pixel values for nearby pixels in the current frame, developing a temporal candidate value for the absent chroma pixel using pixel values for nearby pixels in the previous and subsequent frames, computing a value for the absent chroma pixel by combining the spatial candidate value and the temporal candidate value, and producing an output video frame including the computed absent chroma pixel values.
Abstract:
There are provided a video processing apparatus, a video processing system, and an information providing method in the video processing apparatus. The video processing apparatus includes: a communication part performing communication with a service providing server providing broadcasting services; a video processing part performing video processing with respect to the broadcasting services; an output part outputting information on the broadcasting services; and a controller controlling the communication part, the output part and the video processing part to transmit user information and viewing information with respect to the video processing apparatus to the service providing server, to receive recommendation information based on the user information and the viewing information from the service providing server, and to output the received recommendation information, respectively.
Abstract:
Provided are an image processing apparatus and an image processing method thereof. The image processing apparatus includes: an information reader which collects information related to a search word; and a controller which selects a favorite broadcast depending on a viewing pattern and provides the information reader with the search word corresponding to the favorite broadcast.
Abstract:
A backlight assembly includes a light source, a light-guide plate, a mold frame and a bottom chassis. The mold frame includes a first bottom portion, a protrusion on a first surface of the first bottom portion and a first sidewall portion on a second surface of the first bottom portion opposite to the first surface of the first bottom portion and facing the light guide plate. The bottom chassis includes a second bottom portion having a hole to receive the protrusion of the first bottom portion, and a second sidewall portion facing the light guide plate. A cross sectional area of a first opening of the hole corresponding to an inner surface of the bottom chassis and contacting the first surface of mold frame is different than a cross sectional area of a second opening of the hole corresponding to an outer surface of the bottom chassis.
Abstract:
A method of providing an external input list using item grouping and a video apparatus adopting the same are disclosed. The video apparatus includes a combination unit combining an image to be displayed with specified information, and a control unit creating an external input list including at least one external input group item to which at least one external input item is subordinate as a lower item, and controlling the combination unit to combine the image to be displayed with the created external input list. Accordingly, more simplified external input list is provided to a user and the user can select the external input more quickly and conveniently.
Abstract:
A display device is provided. The display device comprises a display panel. The display device further comprises a transparent film disposed on the display panel and a buffer layer having an adhesive characteristic interposed between the transparent film and the second plate.
Abstract:
Disclosed are an exposure method and a method of manufacturing a mask and a semiconductor device using the same, which minimize time taken by mask data preparation (MDP) to optimize a total exposure process and enhance a quality of a pattern by using an inverse solution concept, based on a multi-beam mask writer. The exposure method includes receiving mask tape output (MTO) design data obtained through optical proximity correction (OPC), preparing mask data, including a job deck, for the MTO design data without a data format conversion, performing complex correction, including proximity effect correction (PEC) of an error caused by an e-beam proximity effect and mask process correction (MPC) of an error caused by an exposure process, on the mask data, generating pixel data, based on data for which the complex correction is performed, and performing e-beam writing on a substrate for a mask, based on the pixel data.
Abstract:
A method of manufacturing semiconductor devices is disclosed. The method includes determining fractured shots that do not overlap each other based on a final pattern; determining overlapping shots that are shots that overlap each other based on the final pattern; generating area difference data by comparing the areas of the overlapping shots and the fractured shots with each other; calculating a radiation influenced pattern based on the area difference data; and correcting the overlapping shots based on the radiation influenced pattern.