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    AIR CONDITIONER INDOOR UNIT
    1.
    发明申请
    AIR CONDITIONER INDOOR UNIT 审中-公开

    公开(公告)号：US20180340699A1

    公开(公告)日：2018-11-29

    申请号：US15777734

    申请日：2016-11-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Young-Jae KIM ,  Do Yeon KIM ,  Je Myung MOON ,  Hyeong Joon SEO ,  Bu Youn LEE

    IPC: F24F1/00 ,  F24F13/10 ,  F24F13/20

    Abstract: Disclosed is an air conditioner (AC) indoor unit including a housing installed on the ceiling and having an inlet and an outlet provided around the inlet and having a pair of straight sections facing each other and a pair of curved sections facing each other; a heat exchanger provided inside the housing and arranged in a main flow path between the inlet and the outlet; a blower fan configured to suck in air through the inlet, allow the air to exchange heat with the heat exchanger, and discharge the air through the outlet; and an auxiliary flow path guiding an auxiliary air current to change a direction of an air current discharged from the outlet. The direction of the discharged air current may be controlled by sucking in air around the outlet or blowing air to the periphery of the outlet through the auxiliary flow path without a blade.

    SEMICONDUCTOR DEVICE
    3.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20170069828A1

    公开(公告)日：2017-03-09

    申请号：US15227953

    申请日：2016-08-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Baik-Woo LEE ,  Eun-Seok SONG ,  Young-Jae KIM ,  Jae-Gwon JANG

    IPC: H01L43/02 ,  H01L43/08

    CPC classification number: H01L23/552 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014

    Abstract: In one embodiment, a semiconductor device comprising, a substrate comprising a wiring layer, a first conductive shielding layer disposed on the substrate and electrically isolated from the wiring layer, the first conductive shielding layer comprising a first bonding surface and a first end surface extending from the first bonding surface, a semiconductor chip disposed on the first conductive shielding layer, a molding member disposed over the first conductive shielding layer to cover the semiconductor chip, a second conductive shielding layer disposed over the first conductive shielding layer and the molding member, the second conductive shielding layer comprising a second bonding surface and a second end surface extending from the second bonding surface, and a bonding portion disposed between the first and second bonding surfaces, the bonding portion comprising a top surface and a bottom surface opposite to the top surface. The bottom surface of the bonding portion contacts the first bonding surface to form a first contact surface. The top surface of the bonding portion contacts the second bonding surface to form a second contact surface. An area of the second contact surface is larger than an area of the second end surface.

    Abstract translation: 在一个实施例中，一种半导体器件，包括：衬底，其包括布线层，设置在衬底上并与布线层电隔离的第一导电屏蔽层，第一导电屏蔽层包括第一接合表面和第一端面， 所述第一接合表面，设置在所述第一导电屏蔽层上的半导体芯片，设置在所述第一导电屏蔽层上以覆盖所述半导体芯片的成型构件，设置在所述第一导电屏蔽层和所述模制构件上方的第二导电屏蔽层， 第二导电屏蔽层，包括从第二接合表面延伸的第二接合表面和第二端表面，以及设置在第一和第二接合表面之间的接合部分，接合部分包括顶表面和与顶表面相对的底表面 。 接合部分的底表面接触第一接合表面以形成第一接触表面。 接合部分的顶表面接触第二接合表面以形成第二接触表面。 第二接触面的面积大于第二端面的面积。

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