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公开(公告)号:US20250028456A1
公开(公告)日:2025-01-23
申请号:US18907760
申请日:2024-10-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyungho Lee , Kiheung Kim , Taeyoung Oh , Jongcheol Kim , Hyongryol Hwang
IPC: G06F3/06
Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cell rows and a row hammer management circuit. The row hammer management circuit stores counted values in count cells of each of the plurality of memory cell rows as count data, and performs an internal read-update-write operation to read the count data from the count cells of a target memory cell row from among the plurality of memory cell rows, to update the count data that was read to obtain updated count data, and to write the updated count data in the count cells of the target memory cell row. The row hammer management circuit includes a hammer address queue. The row hammer management circuit changes the updated count data randomly, based on an event signal indicating a state change of the hammer address queue.
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公开(公告)号:US20240404586A1
公开(公告)日:2024-12-05
申请号:US18651072
申请日:2024-04-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ki-Heung Kim , Taeyoung Oh , Hyongryol Hwang
IPC: G11C11/4097 , G11C11/408 , G11C11/4091
Abstract: A memory device includes a bank connected to a plurality of wordlines, a first global input and output (GIO) line, and a second GIO line formed to have a larger length than the first GIO line in a column direction. One of the first GIO line and the second GIO line may be allocated for metadata.
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公开(公告)号:US12118221B2
公开(公告)日:2024-10-15
申请号:US18136915
申请日:2023-04-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jongcheol Kim , Kiheung Kim , Taeyoung Oh , Kyungho Lee
CPC classification number: G06F3/0632 , G06F3/0604 , G06F3/0679
Abstract: A semiconductor memory device includes a memory cell array, a row hammer management circuit and a refresh control circuit. The row hammer management circuit automatically stores random count data in count cells of each of a plurality of memory cell rows during a power-up sequence of the semiconductor memory device and determines counted values by counting a number of times of access associated with each of the plurality of memory cell rows in response to an active command from an external memory controller and stores the counted values in the count cells of each of the plurality of memory cell rows as count data. The refresh control circuit receives a hammer address and performs a hammer refresh operation on one or more of the plurality of memory cell rows that are physically adjacent to a memory cell row that corresponds to the hammer address.
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公开(公告)号:US20240289058A1
公开(公告)日:2024-08-29
申请号:US18590324
申请日:2024-02-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ki-Heung KIM , Taeyoung Oh , Taekwoon Kim , Jinseong Yun , Yoonjae Jeong , Hyongryol Hwang
IPC: G06F3/06
CPC classification number: G06F3/0659 , G06F3/0604 , G06F3/0683
Abstract: A method of operating a memory module that communicates with a memory controller includes: entering a one-time programmable (OTP) addressing mode based on an OTP command received from the memory controller; determining whether a guard key sequence is satisfied based on a plurality of mode register commands received from the memory controller; and programming, based on a determination that the guard key sequence is satisfied, a unique identifier (ID), corresponding to a target memory device, into the target memory device, among a plurality of memory devices included in the memory module.
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公开(公告)号:US20240220149A1
公开(公告)日:2024-07-04
申请号:US18243268
申请日:2023-09-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kiheung Kim , Taeyoung Oh
IPC: G06F3/06
CPC classification number: G06F3/0655 , G06F3/0604 , G06F3/064 , G06F3/0673
Abstract: A semiconductor memory device includes a memory cell array and a column access circuit. The memory cell array includes a plurality of sub-array blocks and each of the sub-array blocks includes volatile memory cells. The column access circuit receives a plurality of data units, each of which includes normal data and meta data having a ratio of k:1, which is associated with managing the normal data, allocates p column selection lines associated with transferring the data units to the bit-lines to a plurality of normal data and a plurality of meta data in the data units with the ratio of k:1, and stores a sub unit of a first normal data among the plurality of normal data and a sub unit of a first meta data in a first region and a second region of a first sub-array block of the plurality of sub-array blocks, respectively.
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公开(公告)号:US20230185460A1
公开(公告)日:2023-06-15
申请号:US18076628
申请日:2022-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kiheung Kim , Taeyoung Oh , Hyeran Kim , Sungyong Cho , Kyungsoo Ha
IPC: G06F3/06
CPC classification number: G06F3/0619 , G06F3/0653 , G06F3/0659 , G06F3/0673
Abstract: A semiconductor memory device includes a memory cell array, a row hammer management circuit and a control logic circuit. The memory cell array includes a plurality of memory cell rows. The row hammer management circuit counts the number of instances of access of each of the memory cell rows, such as in response to the receipt of an active command, to store the counted values in count cells of each of the memory cell rows as count data and, in response to a first command, initiates an internal read-update-write operation to read the count data, to update the read count data, and to write the updated count data in the count cells. The control logic circuit may performs an internal write operation to write the updated count data in the count cells during a second write time interval that is smaller than a first write time interval associated with a normal write operation.
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公开(公告)号:US10665558B2
公开(公告)日:2020-05-26
申请号:US16036198
申请日:2018-07-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sihong Kim , Young-Hoon Son , Taeyoung Oh , Kyung-Soo Ha
Abstract: A semiconductor memory includes a plurality of first pads arranged in a first direction, a plurality of second pads arranged parallel to the plurality of first pads and in the first direction, a plurality of third pads arranged in a second direction perpendicular to the first direction, and a plurality of fourth pads arranged in the second direction. The semiconductor memory further includes first interconnection wires extending from the plurality of first pads in the second direction, the first interconnection wires being connected to the plurality of third pads, and second interconnection wires extending from the plurality of second pads in an opposite direction to the second direction, the second interconnection wires being connected to the plurality of fourth pads.
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公开(公告)号:US20240411467A1
公开(公告)日:2024-12-12
申请号:US18811955
申请日:2024-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jongcheol Kim , Kiheung Kim , Taeyoung Oh , Kyungho Lee
IPC: G06F3/06
Abstract: A semiconductor memory device includes a memory cell array, a row hammer management circuit and a refresh control circuit. The row hammer management circuit automatically stores random count data in count cells of each of a plurality of memory cell rows during a power-up sequence of the semiconductor memory device and determines counted values by counting a number of times of access associated with each of the plurality of memory cell rows in response to an active command from an external memory controller and stores the counted values in the count cells of each of the plurality of memory cell rows as count data. The refresh control circuit receives a hammer address and performs a hammer refresh operation on one or more of the plurality of memory cell rows that are physically adjacent to a memory cell row that corresponds to the hammer address.
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公开(公告)号:US12142314B2
公开(公告)日:2024-11-12
申请号:US18154945
申请日:2023-01-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taeyoung Oh
IPC: G11C11/4097 , G11C7/10 , G11C11/4076 , G11C11/4093 , H01L23/48 , H03K19/0175 , H10B80/00
Abstract: A semiconductor die includes a first pin configured to output a first on-die termination (ODT) control signal to a second semiconductor die, the second semiconductor die comprising a plurality of second ODT circuits each having an ODT that is responsive to the first ODT control signal; and a second pin configured to receive a second ODT control signal output from the second semiconductor die, the semiconductor die comprising a plurality of first ODT circuits each having an ODT that is responsive to the second ODT control signal.
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公开(公告)号:US20240371417A1
公开(公告)日:2024-11-07
申请号:US18771859
申请日:2024-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jongcheol Kim , Hyunsung Shin , Hohyun Shin , Taeyoung Oh , Kyungsoo Ha
IPC: G11C7/10 , G06F3/06 , G06F11/10 , G11C11/408 , G11C11/4093 , G11C11/4096
Abstract: A semiconductor memory device includes a memory cell array, a data input/output (I/O) buffer, an I/O gating circuit and a control logic circuit. The memory cell array includes a plurality of sub array blocks arranged in a first direction and a second direction. The data VO buffer exchanges user data with a memory controller through I/O pads. The I/O gating circuit is connected to the data I/O buffer through data buses and connected to the memory cell array through data I/O lines, and programs mapping relationship between the sub array blocks and the I/O pads, based on a mapping control signal such that uncorrectable errors that are detected by an error correction code engine in the memory controller are reduced. The control logic circuit generates the mapping control signal based on identifier information indicating a type of a central processing unit of the memory controller.
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