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公开(公告)号:US20230185460A1
公开(公告)日:2023-06-15
申请号:US18076628
申请日:2022-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kiheung Kim , Taeyoung Oh , Hyeran Kim , Sungyong Cho , Kyungsoo Ha
IPC: G06F3/06
CPC classification number: G06F3/0619 , G06F3/0653 , G06F3/0659 , G06F3/0673
Abstract: A semiconductor memory device includes a memory cell array, a row hammer management circuit and a control logic circuit. The memory cell array includes a plurality of memory cell rows. The row hammer management circuit counts the number of instances of access of each of the memory cell rows, such as in response to the receipt of an active command, to store the counted values in count cells of each of the memory cell rows as count data and, in response to a first command, initiates an internal read-update-write operation to read the count data, to update the read count data, and to write the updated count data in the count cells. The control logic circuit may performs an internal write operation to write the updated count data in the count cells during a second write time interval that is smaller than a first write time interval associated with a normal write operation.
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公开(公告)号:US20230075459A1
公开(公告)日:2023-03-09
申请号:US17987032
申请日:2022-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changkyo LEE , Dongkeon Lee , Jinhoon Jang , Kyungsoo Ha , Kiseok Oh , Kyungryun Kim
IPC: H03K19/00 , G11C7/10 , H03K19/0175 , G06F3/06 , H03K19/018
Abstract: A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
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公开(公告)号:US20240012712A1
公开(公告)日:2024-01-11
申请号:US18169769
申请日:2023-02-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jongcheol Kim , Hyunsung Shin , Hohyun Shin , Taeyoung Oh , Kyungsoo Ha
IPC: G06F11/10 , G06F3/06 , G11C11/4096 , G11C11/408
CPC classification number: G06F11/1068 , G06F3/0619 , G06F3/0659 , G06F3/0679 , G11C11/4096 , G11C11/4082
Abstract: A semiconductor memory device includes a memory cell array, a data input/output (I/O) buffer, an I/O gating circuit and a control logic circuit. The memory cell array includes a plurality of sub array blocks arranged in a first direction and a second direction. The data I/O buffer exchanges user data with a memory controller through I/O pads. The I/O gating circuit is connected to the data I/O buffer through data buses and connected to the memory cell array through data I/O lines, and programs mapping relationship between the sub array blocks and the I/O pads, based on a mapping control signal such that uncorrectable errors that are detected by an error correction code engine in the memory controller are reduced. The control logic circuit generates the mapping control signal based on identifier information indicating a type of a central processing unit of the memory controller.
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公开(公告)号:US20220140829A1
公开(公告)日:2022-05-05
申请号:US17577141
申请日:2022-01-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Changkyo Lee , Dongkeon Lee , Jinhoon Jang , Kyungsoo Ha , Kiseok Oh , Kyungryun Kim
IPC: H03K19/00 , G06F3/06 , G11C7/10 , H03K19/0175 , H03K19/018
Abstract: A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
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公开(公告)号:US12073910B2
公开(公告)日:2024-08-27
申请号:US18169769
申请日:2023-02-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jongcheol Kim , Hyunsung Shin , Hohyun Shin , Taeyoung Oh , Kyungsoo Ha
IPC: G11C7/10 , G06F3/06 , G11C11/4093 , G11C11/4096 , G06F11/10 , G11C11/408
CPC classification number: G11C7/1012 , G06F3/0619 , G11C11/4093 , G11C11/4096 , G06F3/0659 , G06F3/0679 , G06F11/1068 , G11C11/4082 , G11C2207/005
Abstract: A semiconductor memory device includes a memory cell array, a data input/output (I/O) buffer, an I/O gating circuit and a control logic circuit. The memory cell array includes a plurality of sub array blocks arranged in a first direction and a second direction. The data I/O buffer exchanges user data with a memory controller through I/O pads. The I/O gating circuit is connected to the data I/O buffer through data buses and connected to the memory cell array through data I/O lines, and programs mapping relationship between the sub array blocks and the I/O pads, based on a mapping control signal such that uncorrectable errors that are detected by an error correction code engine in the memory controller are reduced. The control logic circuit generates the mapping control signal based on identifier information indicating a type of a central processing unit of the memory controller.
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公开(公告)号:US11664803B2
公开(公告)日:2023-05-30
申请号:US17577141
申请日:2022-01-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changkyo Lee , Dongkeon Lee , Jinhoon Jang , Kyungsoo Ha , Kiseok Oh , Kyungryun Kim
IPC: H03K19/00 , G06F3/06 , G11C7/10 , H03K19/0175 , H03K19/018
CPC classification number: H03K19/0005 , G06F3/061 , G06F3/0604 , G11C7/1051 , G11C7/1084 , H03K19/01825 , H03K19/017545
Abstract: A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
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公开(公告)号:US10797700B2
公开(公告)日:2020-10-06
申请号:US16552147
申请日:2019-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changkyo Lee , Dongkeon Lee , Jinhoon Jang , Kyungsoo Ha , Kiseok Oh , Kyungryun Kim
IPC: H03K19/00 , G06F3/06 , G11C7/10 , H03K19/0175 , H03K19/018
Abstract: A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
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公开(公告)号:US20240371417A1
公开(公告)日:2024-11-07
申请号:US18771859
申请日:2024-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jongcheol Kim , Hyunsung Shin , Hohyun Shin , Taeyoung Oh , Kyungsoo Ha
IPC: G11C7/10 , G06F3/06 , G06F11/10 , G11C11/408 , G11C11/4093 , G11C11/4096
Abstract: A semiconductor memory device includes a memory cell array, a data input/output (I/O) buffer, an I/O gating circuit and a control logic circuit. The memory cell array includes a plurality of sub array blocks arranged in a first direction and a second direction. The data VO buffer exchanges user data with a memory controller through I/O pads. The I/O gating circuit is connected to the data I/O buffer through data buses and connected to the memory cell array through data I/O lines, and programs mapping relationship between the sub array blocks and the I/O pads, based on a mapping control signal such that uncorrectable errors that are detected by an error correction code engine in the memory controller are reduced. The control logic circuit generates the mapping control signal based on identifier information indicating a type of a central processing unit of the memory controller.
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公开(公告)号:US12088291B2
公开(公告)日:2024-09-10
申请号:US18372726
申请日:2023-09-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changkyo Lee , Dongkeon Lee , Jinhoon Jang , Kyungsoo Ha , Kiseok Oh , Kyungryun Kim
IPC: H03K19/00 , G06F3/06 , G11C7/10 , H03K19/0175 , H03K19/018
CPC classification number: H03K19/0005 , G06F3/0604 , G06F3/061 , G11C7/1051 , G11C7/1084 , H03K19/017545 , H03K19/01825
Abstract: A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
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公开(公告)号:US12040704B2
公开(公告)日:2024-07-16
申请号:US18063777
申请日:2022-12-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sungju Lee , Kyungsoo Ha
CPC classification number: H02M3/07 , H02M1/0025 , H02M1/0041 , G11C5/145
Abstract: A voltage generator includes a charge pump circuit including a first charge pump having a plurality of first pumping capacitors, and a second charge pump having a plurality of second pumping capacitors having a capacitance different from a capacitance of each of the plurality of first pumping capacitors. The charge pump circuit is configured to supply a power supply voltage to a power mesh. The voltage generator further includes a controller configured to output a control signal based on a target level of the power supply voltage, and an oscillator configured to output a clock signal to the charge pump circuit. The oscillator outputs the clock signal to one of the first charge pump and the second charge pump based on the control signal.
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