公开(公告)号：US20230115351A1

公开(公告)日：2023-04-13

申请号：US17804732

申请日：2022-05-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takashi Sasa ,  Kyoung Whan Oh ,  Sang Ho Lee ,  Seok Heo ,  Ho Kyun Kim ,  Ju Hyung Lee

IPC: G03F7/20

Abstract: A photoresist supplying system includes a pump that includes a first tube phragm that stores a photoresist and a filter that filters the photoresist, a second tube phragm that stores the photoresist and is disposed outside the pump, where the second tube phragm transfers the photoresist to the first tube phragm, a storage unit that stores the photoresist, where the storage unit provides the photoresist to the second tube phragm, and a tube phragm drive unit that is connected to the first tube phragm. The tube phragm drive unit adjusts an interior volume of the first tube phragm and applies a pressure to a flexible outer wall of the first tube phragm to transfer the photoresist from the first tube phragm to a nozzle installed in the chamber. At least a part of the photoresist stored in the first tube phragm is transferred to the second tube phragm.

公开(公告)号：US09889556B2

公开(公告)日：2018-02-13

申请号：US14661688

申请日：2015-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun-Ho Kim ,  Ki-Hoon Nam ,  Tae-Min Earmme ,  Seok Heo ,  Jae-Chul Hwang

IPC: A01B1/00 ,  B25J9/04 ,  B25J9/10 ,  H01L21/677

CPC classification number: B25J9/042 ,  B25J9/1065 ,  B25J9/107 ,  H01L21/67742 ,  Y10S901/15 ,  Y10T74/20305

Abstract: A link structure includes a first link, a second link having an end that is connected to an end of the first link, a third link having an end that is connected to the end of the first link, and provided on a portion of the second link, a first rotary shaft partially provided in the first link, a first actuator configured to rotate the first link about the first rotary shaft; a second rotary shaft partially provided in the second link, the second rotary shaft being different from the first rotary shaft, and a second actuator configured to rotate the second link about the second rotary shaft, the first and second actuators being provided in the first link.

公开(公告)号：US20250155814A1

公开(公告)日：2025-05-15

申请号：US18751464

申请日：2024-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulmin Cho ,  Youngho Hwang ,  Juno Park ,  Kyoungwhan Oh ,  Sunyoung Yun ,  Youngkyun Im ,  Jaehong Lim ,  Seok Heo

IPC: G03F7/16 ,  B05C11/08

Abstract: A spin coating apparatus according to an embodiment includes a substrate supporter supporting a substrate, a substrate supporter driver rotating the substrate supporter, a laser supply unit disposed on the substrate supporter and providing a laser, and a laser driver of driving the laser supply unit, wherein the laser supply unit may move along a first direction, which is horizontal to the substrate surface on the substrate supporter.

公开(公告)号：US11733616B2

公开(公告)日：2023-08-22

申请号：US17804732

申请日：2022-05-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takashi Sasa ,  Kyoung Whan Oh ,  Sang Ho Lee ,  Seok Heo ,  Ho Kyun Kim ,  Ju Hyung Lee

IPC: G03F7/20 ,  G03F7/00

CPC classification number: G03F7/70908

Abstract: A photoresist supplying system includes a pump that includes a first tube phragm that stores a photoresist and a filter that filters the photoresist, a second tube phragm that stores the photoresist and is disposed outside the pump, where the second tube phragm transfers the photoresist to the first tube phragm, a storage unit that stores the photoresist, where the storage unit provides the photoresist to the second tube phragm, and a tube phragm drive unit that is connected to the first tube phragm. The tube phragm drive unit adjusts an interior volume of the first tube phragm and applies a pressure to a flexible outer wall of the first tube phragm to transfer the photoresist from the first tube phragm to a nozzle installed in the chamber. At least a part of the photoresist stored in the first tube phragm is transferred to the second tube phragm.

公开(公告)号：US11456195B2

公开(公告)日：2022-09-27

申请号：US16751882

申请日：2020-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho Hwang ,  Sungyong Park ,  Eunseok Seo ,  Hyeongseok Jo ,  Seok Heo

IPC: H01L21/67 ,  G05D16/20 ,  H05B1/02 ,  G05D23/19 ,  G05B19/418 ,  C23C14/54

Abstract: A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.

公开(公告)号：US20210098274A1

公开(公告)日：2021-04-01

申请号：US16906820

申请日：2020-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Euijin Kim ,  Hyungjong Kim ,  Juno Park ,  Seok Heo

IPC: H01L21/677 ,  H01L21/67 ,  H01L23/544

Abstract: An apparatus for transferring a wafer according to the present disclosure includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.

公开(公告)号：US11315817B2

公开(公告)日：2022-04-26

申请号：US16906820

申请日：2020-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Euijin Kim ,  Hyungjong Kim ,  Juno Park ,  Seok Heo

IPC: H01L21/67 ,  H01L21/677 ,  H01L23/544 ,  G01B11/14

Abstract: An apparatus for transferring a wafer includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.

公开(公告)号：US20240379386A1

公开(公告)日：2024-11-14

申请号：US18402844

申请日：2024-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YONGSUK CHOI ,  Ilkyu Jeong ,  Hyunwoong Hwang ,  Kyung-Won Kang ,  Dong-Wook Kim ,  Seok Heo

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate processing system includes a cluster module having substrate processing devices, a load port through which a substrate is loaded, and a substrate cleaning device between the cluster module and the load port, the substrate cleaning device being configured to clean the substrate processed in the substrate processing devices, and the substrate cleaning device including a substrate cleaner having a cleaning chuck to support the substrate, and a cleaning nozzle configured to spray a fluid toward the cleaning chuck.

公开(公告)号：US11027394B2

公开(公告)日：2021-06-08

申请号：US16022166

申请日：2018-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jieun Yang ,  Dong-il Yoon ,  Taemin Earmme ,  Gui Hyun Cho ,  Seok Heo ,  Jong Hwi Seo ,  Yong Won Choi

IPC: B24B37/34 ,  B24B37/005 ,  H01L21/687 ,  H01L21/67

Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.

公开(公告)号：US10553464B2

公开(公告)日：2020-02-04

申请号：US15950303

申请日：2018-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Won Jeong ,  Yi Jin ,  Chang Gi Min ,  Jin Woo Lee ,  Seok Heo ,  Yong Won Choi ,  Yun Jong Choi

IPC: H01L21/67 ,  G05B19/418

Abstract: A method for controlling a semiconductor manufacturing facility includes measuring output change amounts of differential pressure sensors in the facility when pressure conditions change by a number of fans. The fans are then classified into different groups and subgroups and control sequences of the subgroups are determined based on the change amounts. Difference values are then calculated, and a control signal is generated to adjust the rotation speed of the fans.