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公开(公告)号:US20200020774A1
公开(公告)日:2020-01-16
申请号:US16453347
申请日:2019-06-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Cho-eun Lee , Seok-hoon Kim , Sang-gil Lee , Edward Namkyu Cho , Min-hee Choi , Seung-hun Lee
Abstract: A semiconductor device includes: a fin-type active region extending on a substrate in a first direction that is parallel to an upper surface of the substrate; and a source/drain region in a recess region extending into the fin-type active region, wherein the source/drain region includes: a first source/drain material layer; a second source/drain material layer on the first source/drain material layer; and a first dopant diffusion barrier layer on an interface between the first source/drain material layer and the second source/drain material layer.
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2.
公开(公告)号:US10672764B2
公开(公告)日:2020-06-02
申请号:US16174894
申请日:2018-10-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seok-hoon Kim , Dong-myoung Kim , Jin-bum Kim , Seung-hun Lee , Cho-eun Lee , Hyun-jung Lee , Sung-uk Jang , Edward Namkyu Cho , Min-hee Choi
IPC: H01L27/085 , H01L29/06 , H01L29/423 , H01L27/088 , H01L21/8234
Abstract: A semiconductor device includes a first region having a first active pattern with first protrusion portions and first recess portions, and a second region having a second active pattern with second protrusion portions and second recess portions. First gate patterns are on the first protrusion portions. Second gate patterns are on the second protrusion portions. A first source/drain region is on one of the first recess portion of the first active pattern between two of the first gate patterns. The first source/drain region has a first reinforcing epitaxial layer at an upper portion thereof. A second source/drain region is on one of the second recess portions of the second active pattern between two of the second gate patterns. The second source/drain region has a second reinforcing epitaxial layer having an epitaxial growth surface that is shaped differently than a first epitaxial growth surface of the first reinforcing epitaxial layer.
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3.
公开(公告)号:US20190252376A1
公开(公告)日:2019-08-15
申请号:US16174894
申请日:2018-10-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seok-hoon Kim , Dong-myoung Kim , Jin-bum Kim , Seung-hun Lee , Cho-eun Lee , Hyun-jung Lee , Sung-uk Jang , Edward Namkyu Cho , Min-hee Choi
IPC: H01L27/085 , H01L29/423 , H01L29/06
Abstract: A semiconductor device includes a first region having a first active pattern with first protrusion portions and first recess portions, and a second region having a second active pattern with second protrusion portions and second recess portions. First gate patterns are on the first protrusion portions. Second gate patterns are on the second protrusion portions. A first source/drain region is on one of the first recess portion of the first active pattern between two of the first gate patterns. The first source/drain region has a first reinforcing epitaxial layer at an upper portion thereof. A second source/drain region is on one of the second recess portions of the second active pattern between two of the second gate patterns. The second source/drain region has a second reinforcing epitaxial layer having an epitaxial growth surface that is shaped differently than a first epitaxial growth surface of the first reinforcing epitaxial layer.
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公开(公告)号:US12027586B2
公开(公告)日:2024-07-02
申请号:US18347090
申请日:2023-07-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Cho-eun Lee , Seok-hoon Kim , Sang-gil Lee , Edward Cho , Min-hee Choi , Seung-hun Lee
IPC: H01L29/08 , H01L21/8234 , H01L21/8238 , H01L29/78
CPC classification number: H01L29/0847 , H01L21/823418 , H01L21/823425 , H01L21/823814 , H01L29/785
Abstract: A semiconductor device includes: a fin-type active region extending on a substrate in a first direction that is parallel to an upper surface of the substrate; and a source/drain region in a recess region extending into the fin-type active region, wherein the source/drain region includes: a first source/drain material layer; a second source/drain material layer on the first source/drain material layer; and a first dopant diffusion barrier layer on an interface between the first source/drain material layer and the second source/drain material layer.
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公开(公告)号:US11735631B2
公开(公告)日:2023-08-22
申请号:US17470288
申请日:2021-09-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Cho-eun Lee , Seok-hoon Kim , Sang-gil Lee , Edward Namkyu Cho , Min-hee Choi , Seung-hun Lee
IPC: H01L29/08 , H01L29/78 , H01L21/8238 , H01L21/8234
CPC classification number: H01L29/0847 , H01L21/823418 , H01L21/823425 , H01L21/823814 , H01L29/785
Abstract: A semiconductor device includes: a fin-type active region extending on a substrate in a first direction that is parallel to an upper surface of the substrate; and a source/drain region in a recess region extending into the fin-type active region, wherein the source/drain region includes: a first source/drain material layer; a second source/drain material layer on the first source/drain material layer; and a first dopant diffusion barrier layer on an interface between the first source/drain material layer and the second source/drain material layer.
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公开(公告)号:US11145720B2
公开(公告)日:2021-10-12
申请号:US16453347
申请日:2019-06-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Cho-eun Lee , Seok-hoon Kim , Sang-gil Lee , Edward Namkyu Cho , Min-hee Choi , Seung-hun Lee
IPC: H01L29/08 , H01L29/78 , H01L21/8238 , H01L21/8234
Abstract: A semiconductor device includes: a fin-type active region extending on a substrate in a first direction that is parallel to an upper surface of the substrate; and a source/drain region in a recess region extending into the fin-type active region, wherein the source/drain region includes: a first source/drain material layer; a second source/drain material layer on the first source/drain material layer; and a first dopant diffusion barrier layer on an interface between the first source/drain material layer and the second source/drain material layer.
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