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公开(公告)号：US20240168693A1
公开(公告)日：2024-05-23
申请号：US18425638
申请日：2024-01-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sejun KIM , Kibo KIM , Jinsub KIM
IPC: G06F3/14
CPC classification number: G06F3/1446
Abstract: A multi-display device is configured to display an image, and the multi-display device includes display modules sequentially connected according to a prescribed connection configuration. Each of the display modules may include a signal input unit for acquiring an image signal and control information and a partial image selection unit for obtaining, from the control information, information about the connection configuration of the display modules, wherein each display module selects a partial image corresponding to the display module, from the image signal by referring to a first lookup table based on the information about the connection configuration.
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Patent Agency Ranking
公开(公告)号：US20230180472A1
公开(公告)日：2023-06-08
申请号：US18097592
申请日：2023-01-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoung-Hee KIM , Woo Choel NOH , Ik Soo KIM , Jun Kwan KIM , Jinsub KIM , Yongjin SHIN
Abstract: A semiconductor device including a substrate that includes a cell array region and a peripheral circuit region; a cell transistor on the cell array region of the substrate; a peripheral transistor on the peripheral circuit region of the substrate; a first interconnection layer connected to the cell transistor; a second interconnection layer connected to the peripheral transistor; an interlayer dielectric layer covering the first interconnection layer; and a blocking layer spaced apart from the first interconnection layer, the blocking layer covering a top surface and a sidewall of the second interconnection layer.
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3.发明申请公开(公告)号：US20190206591A1
公开(公告)日：2019-07-04
申请号：US16239680
申请日：2019-01-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunwoo KIM , Hyunjung KOH , Jinsub KIM , Dongjin PARK , Woosub BANG , Changhun BAE , Sungki SON , Seungbok LEE , Jin LEE , Junghwa CHOI
Abstract: An optical signal transferring apparatus, an electronic apparatus, and a source device, and methods of operating the same include a signal transfer unit including one or more signal lines transferring a signal between a first apparatus and a second apparatus and one or more power lines transferring power between the first apparatus and the second apparatus; and a first connector connected to the first apparatus, and a second connector connected to the second apparatus, wherein the signal transfer unit is configured to transfer an optical signal to the second apparatus in response to a power-on input of the first apparatus and transfer, to the first apparatus, power and data which are received from the second apparatus in response to detection of the transferred optical signal, respectively, via the one or more power lines and the one or more signal lines.
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公开(公告)号：US20250149452A1
公开(公告)日：2025-05-08
申请号：US19008197
申请日：2025-01-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jinsub KIM , Kyoung-hee KIM , Munjun KIM , Jun Kwan KIM , Woo Choel NOH
IPC: H01L23/532 , H01L21/768 , H01L23/522 , H10B12/00
Abstract: A semiconductor device includes a substrate including a cell array region and a peripheral circuit region, capacitors on the cell array region of the substrate, peripheral transistors on the peripheral circuit region of the substrate, a first upper interlayer insulating layer on the capacitors and the peripheral transistors, a first upper contact electrically connected to at least one of the peripheral transistors, the first upper contact penetrating the first upper interlayer insulating layer, a first upper interconnection line provided on the first upper interlayer insulating layer and electrically connected to the first upper contact, a second upper interlayer insulating layer covering the first upper interconnection line, and a first blocking layer between the first upper interlayer insulating layer and the second upper interlayer insulating layer. The first blocking layer is absent between the first upper interconnection line and the first upper interlayer insulating layer.
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公开(公告)号：US20230048494A1
公开(公告)日：2023-02-16
申请号：US17737335
申请日：2022-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jinsub KIM , Woosub BANG , Youngjin LEE
Abstract: A display apparatus including: a display panel; a chassis assembly supporting the display panel; a printed circuit board accommodated in the chassis assembly, and configured to drive and control the display panel; and a connector installed on the printed circuit board, and including a seating portion and a connector terminal positioned on one side of the seating portion, wherein the connector is connected to the cable by seating a surface of a body of a cable on the seating portion in a vertical direction while the surface of the body of the cable faces the seating portion and contact-coupling a cable terminal formed at one end of the body of the cable with the connector terminal.
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公开(公告)号：US20210375896A1
公开(公告)日：2021-12-02
申请号：US17099994
申请日：2020-11-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoung-Hee KIM , Woo Choel NOH , Ik Soo KIM , Jun Kwan KIM , Jinsub KIM , Yongjin SHIN
IPC: H01L27/11539 , H01L27/11519 , H01L27/11551 , H01L27/11565 , H01L27/11573 , H01L27/11578
Abstract: A semiconductor device including a substrate that includes a cell array region and a peripheral circuit region; a cell transistor on the cell array region of the substrate; a peripheral transistor on the peripheral circuit region of the substrate; a first interconnection layer connected to the cell transistor; a second interconnection layer connected to the peripheral transistor; an interlayer dielectric layer covering the first interconnection layer; and a blocking layer spaced apart from the first interconnection layer, the blocking layer covering a top surface and a sidewall of the second interconnection layer.
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