公开(公告)号：US20170185119A1

公开(公告)日：2017-06-29

申请号：US15459403

申请日：2017-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heungkyu KWON ,  Jae Choon KIM ,  Eunseok CHO ,  Jichul KIM

IPC: G06F1/20 ,  G01J5/10 ,  G05B15/02

CPC classification number: G06F1/206 ,  G01J5/10 ,  G05B15/02

Abstract: A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.

公开(公告)号：US20220361334A1

公开(公告)日：2022-11-10

申请号：US17431900

申请日：2021-08-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taewon SUN ,  Jichul KIM ,  Kicheol BAE ,  Jinyong PARK ,  Jungje BANG ,  Yongjae SONG

IPC: H05K1/14 ,  H05K7/14 ,  H05K1/18 ,  H05K1/02 ,  H04M1/02

Abstract: An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.

公开(公告)号：US20240334588A1

公开(公告)日：2024-10-03

申请号：US18739889

申请日：2024-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jichul KIM ,  Jaeheung YE ,  Kyuhwan LEE ,  Kwangho JUNG

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/145 ,  H05K1/181 ,  H05K7/20409 ,  H05K2201/10159 ,  H05K2201/10318 ,  H05K2201/10568

Abstract: An electronic device according to an embodiment of the disclosure may include: a first circuit board; a second circuit board with a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction and facing the first circuit board; a first electronic component disposed between the first circuit board and the second surface of the second circuit board, and disposed in a first area of the second circuit board; a second electronic component disposed in a second area of the second circuit board; a heat dissipation device comprising a thermally conductive material disposed on the first surface of the second circuit board; a first heat transfer member comprising a thermally conductive material configured to transfer heat from the first electronic component to the heat dissipation device; and a second heat transfer member comprising a thermally conductive material configured to transfer heat from the second electronic component to the first circuit board.

公开(公告)号：US20220418108A1

公开(公告)日：2022-12-29

申请号：US17900687

申请日：2022-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonkyung CHUNG ,  Jichul KIM ,  Jinyong PARK ,  Gyeongmin JIN

IPC: H05K1/11 ,  H04M1/02 ,  H05K3/34 ,  H05K1/02

Abstract: According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.

公开(公告)号：US20220386465A1

公开(公告)日：2022-12-01

申请号：US17886327

申请日：2022-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyeongmin JIN ,  Jichul KIM ,  Yongjae SONG ,  Jaeyeon RA ,  Chagyu SONG

IPC: H05K1/14 ,  H05K1/02

Abstract: Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.

公开(公告)号：US20220171434A1

公开(公告)日：2022-06-02

申请号：US17564773

申请日：2021-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinyong PARK ,  Dongku KANG ,  Jichul KIM ,  Bongkyu MIN ,  Baekeun CHO ,  Chihyun CHO ,  Hyuncheol JIN

IPC: G06F1/16 ,  G06F1/18

Abstract: An electronic device is provided. The electronic device includes a rollable display. The electronic device may include a main bracket configured to support the first portion of the rollable display, a roller member disposed in the first direction from the main bracket and arranged in a third direction perpendicular to the first direction, at least one folding support member disposed between the main bracket and the roller member and configured to support the second portion of the rollable display, a circuit board disposed to overlap at least a portion of the main bracket, at least one electronic component disposed adjacent to the roller member, and a FPCB configured to electrically connecting the main circuit board and the electronic component, wherein the FPCB is disposed to pass through the folding support member and extends from a portion of the circuit board to a portion of the electronic component.

公开(公告)号：US20160133605A1

公开(公告)日：2016-05-12

申请号：US14938788

申请日：2015-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Kwon BAE ,  Jae Choon KIM ,  Jichul KIM ,  Kyol PARK ,  Chajea JO

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367

CPC classification number: H01L25/0657 ,  H01L23/36 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5385 ,  H01L24/00 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/29011 ,  H01L2224/3205 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.

Abstract translation: 半导体器件包括衬底，设置在衬底上的第一半导体封装以及与衬底上的第一半导体封装间隔开的第二半导体封装。 第二半导体封装包括堆叠在基板上的半导体芯片，覆盖半导体芯片的粘附部分和设置在基板和半导体芯片之间的热阻结构。 由第一半导体封装产生的并通过衬底传输到第二半导体封装件的热被隔热结构阻挡。