公开(公告)号：US20160133605A1

公开(公告)日：2016-05-12

申请号：US14938788

申请日：2015-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Kwon BAE ,  Jae Choon KIM ,  Jichul KIM ,  Kyol PARK ,  Chajea JO

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367

CPC classification number: H01L25/0657 ,  H01L23/36 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5385 ,  H01L24/00 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/29011 ,  H01L2224/3205 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.

Abstract translation: 半导体器件包括衬底，设置在衬底上的第一半导体封装以及与衬底上的第一半导体封装间隔开的第二半导体封装。 第二半导体封装包括堆叠在基板上的半导体芯片，覆盖半导体芯片的粘附部分和设置在基板和半导体芯片之间的热阻结构。 由第一半导体封装产生的并通过衬底传输到第二半导体封装件的热被隔热结构阻挡。

公开(公告)号：US20150104905A1

公开(公告)日：2015-04-16

申请号：US14577490

申请日：2014-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyol PARK ,  Yun-Hyeok IM

IPC: H01L23/367 ,  H01L23/00 ,  H05K3/30 ,  H01L21/56

CPC classification number: H01L23/3675 ,  H01L21/561 ,  H01L23/367 ,  H01L23/3677 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0209 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0215 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.

Abstract translation: 半导体封装包括具有内部电路图案和连接到内部电路图案的多个接触焊盘的电路板，电路板上的至少一个集成电路（IC）装置并与接触焊盘接触，模具在 电路板，将IC器件固定到电路板上的模具，以及IC器件表面和模具表面上的表面轮廓改性剂，以及将IC器件和模具的表面积扩大的表面轮廓修改器 散热