公开(公告)号：US11177199B2

公开(公告)日：2021-11-16

申请号：US16807377

申请日：2020-03-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gayoung Kim

IPC: H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes a semiconductor chip including a chip pad and an external bump pad electrically connected to the chip pad of the semiconductor chip. The external bump pad may include a trench portion extending from a perimeter surface of the external bump pad toward a center of the external bump pad. The semiconductor package includes an external connector on the external bump pad, with the external connector including a portion that is in the trench portion of the external bump pad.

公开(公告)号：US20250105187A1

公开(公告)日：2025-03-27

申请号：US18976121

申请日：2024-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gayoung Kim ,  Hyungsun Jang

IPC: H01L23/00

Abstract: A semiconductor package includes: a semiconductor chip including a chip pad on a first surface; a first insulating layer arranged on the semiconductor chip and including an insulating hole exposing the chip pad; a redistribution pattern including a redistribution via pattern arranged on an internal surface of the first insulating layer configured to define the first insulating hole and on a surface of the chip pad, and a redistribution line pattern arranged on a surface of the first insulating layer; an under bump metal (UBM) conformally arranged along a surface of the redistribution pattern; and a connection terminal arranged on the UBM, wherein the redistribution line pattern and the UBM provide a dummy space of a shape protruding in a direction toward the first surface of the semiconductor chip, and a portion of the connection terminal fills the dummy space.

公开(公告)号：US12205913B2

公开(公告)日：2025-01-21

申请号：US18236545

申请日：2023-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gayoung Kim ,  Hyungsun Jang

IPC: H01L23/00

Abstract: A semiconductor package includes: a semiconductor chip including a chip pad on a first surface; a first insulating layer arranged on the semiconductor chip and including an insulating hole exposing the chip pad; a redistribution pattern including a redistribution via pattern arranged on an internal surface of the first insulating layer configured to define the first insulating hole and on a surface of the chip pad, and a redistribution line pattern arranged on a surface of the first insulating layer; an under bump metal (UBM) conformally arranged along a surface of the redistribution pattern; and a connection terminal arranged on the UBM, wherein the redistribution line pattern and the UBM provide a dummy space of a shape protruding in a direction toward the first surface of the semiconductor chip, and a portion of the connection terminal fills the dummy space.

公开(公告)号：US20240079359A1

公开(公告)日：2024-03-07

申请号：US18202126

申请日：2023-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gayoung Kim

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05564 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147

Abstract: A semiconductor package including a redistribution structure comprising a redistribution layer; a semiconductor chip electrically connected to the redistribution layer; bumps disposed on the redistribution structure; and under bump metallurgy (UBM) structures disposed between the bumps and the redistribution structure. Each of the UBM structures includes a first UBM layer including copper or a copper alloy; and a second UBM layer including nickel or nickel alloy and disposed between the redistribution structure and the first UBM layer. An area of a surface of the second UBM layer facing the first UBM layer is greater than an area of a surface of the first UBM layer facing the second UBM layer.

公开(公告)号：US20230395548A1

公开(公告)日：2023-12-07

申请号：US18236545

申请日：2023-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gayoung Kim ,  Hyungsun Jang

IPC: H01L23/00

CPC classification number: H01L24/08 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/08059 ,  H01L2924/35121 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13021 ,  H01L2224/05557

Abstract: A semiconductor package includes: a semiconductor chip including a chip pad on a first surface; a first insulating layer arranged on the semiconductor chip and including an insulating hole exposing the chip pad; a redistribution pattern including a redistribution via pattern arranged on an internal surface of the first insulating layer configured to define the first insulating hole and on a surface of the chip pad, and a redistribution line pattern arranged on a surface of the first insulating layer; an under bump metal (UBM) conformally arranged along a surface of the redistribution pattern; and a connection terminal arranged on the UBM, wherein the redistribution line pattern and the UBM provide a dummy space of a shape protruding in a direction toward the first surface of the semiconductor chip, and a portion of the connection terminal fills the dummy space.

公开(公告)号：US20240258354A1

公开(公告)日：2024-08-01

申请号：US18242597

申请日：2023-09-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungsan Kim ,  Kwansik Kim ,  Jinyong Choi ,  Gayoung Kim ,  Taemin Kim ,  Yongsoon Park ,  Ingyu Baek ,  Seungho Lee

IPC: H01L27/146

CPC classification number: H01L27/14632 ,  H01L27/14603 ,  H01L27/14645

Abstract: An image sensor includes a lower insulating film arranged over a substrate and having a non-flat surface that has a concave-convex shape and includes a first surface, which extends in a horizontal direction parallel to a frontside surface of the substrate, and at least one second surface extending from the first surface toward the substrate, a capacitor arranged on the lower insulating film to contact the non-flat surface of the lower insulating film and conformally covering the non-flat surface of the lower insulating film along the contour of the non-flat surface of the lower insulating film, an upper insulating film covering the capacitor and the lower insulating film, and at least one air gap having a side facing the at least one second surface of the lower insulating film in the horizontal direction and having a height defined by the upper insulating film in a vertical direction.

公开(公告)号：US11769743B2

公开(公告)日：2023-09-26

申请号：US17468008

申请日：2021-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gayoung Kim ,  Hyungsun Jang

IPC: H01L23/00

CPC classification number: H01L24/08 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05557 ,  H01L2224/08059 ,  H01L2224/13021 ,  H01L2924/35121

Abstract: A semiconductor package includes: a semiconductor chip including a chip pad on a first surface; a first insulating layer arranged on the semiconductor chip and including an insulating hole exposing the chip pad; a redistribution pattern including a redistribution via pattern arranged on an internal surface of the first insulating layer configured to define the first insulating hole and on a surface of the chip pad, and a redistribution line pattern arranged on a surface of the first insulating layer; an under bump metal (UBM) conformally arranged along a surface of the redistribution pattern; and a connection terminal arranged on the UBM, wherein the redistribution line pattern and the UBM provide a dummy space of a shape protruding in a direction toward the first surface of the semiconductor chip, and a portion of the connection terminal fills the dummy space.

公开(公告)号：US11756869B2

公开(公告)日：2023-09-12

申请号：US17675209

申请日：2022-02-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gayoung Kim ,  Duckgyu Kim

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49816 ,  H01L23/3114 ,  H01L23/49822 ,  H01L23/49838

Abstract: A semiconductor package includes; a semiconductor chip, a conductive pattern electrically connected to the semiconductor chip, a pad electrically connected to the conductive pattern, and a connection member disposed on and electrically connected to the pad. The pad includes a central portion and a peripheral portion at least partially surrounding the central portion and separated from the peripheral portion by a gap, and the connection member contacts at least one of a side surface of the central portion and an inner side surface of the peripheral portion.

公开(公告)号：US20220246563A1

公开(公告)日：2022-08-04

申请号：US17468008

申请日：2021-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gayoung Kim ,  Hyungsun Jang

IPC: H01L23/00

Abstract: A semiconductor package includes: a semiconductor chip including a chip pad on a first surface; a first insulating layer arranged on the semiconductor chip and including an insulating hole exposing the chip pad; a redistribution pattern including a redistribution via pattern arranged on an internal surface of the first insulating layer configured to define the first insulating hole and on a surface of the chip pad, and a redistribution line pattern arranged on a surface of the first insulating layer; an under bump metal (UBM) conformally arranged along a surface of the redistribution pattern; and a connection terminal arranged on the UBM, wherein the redistribution line pattern and the UBM provide a dummy space of a shape protruding in a direction toward the first surface of the semiconductor chip, and a portion of the connection terminal fills the dummy space.

公开(公告)号：US11276633B2

公开(公告)日：2022-03-15

申请号：US16905560

申请日：2020-06-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gayoung Kim ,  Duckgyu Kim

IPC: H01L23/498 ,  H01L23/31

Abstract: A semiconductor package includes; a semiconductor chip, a conductive pattern electrically connected to the semiconductor chip, a pad electrically connected to the conductive pattern, and a connection member disposed on and electrically connected to the pad. The pad includes a central portion and a peripheral portion at least partially surrounding the central portion and separated from the peripheral portion by a gap, and the connection member contacts at least one of a side surface of the central portion and an inner side surface of the peripheral portion.