Abstract:
A film peeling apparatus for detaching a region of a film unit on a substrate and including: a tape supply unit configured to supply an adhesive tape onto the film unit; a plurality of pins arranged above the adhesive tape, vertically descendible toward the adhesive tape to attach a portion of the film unit to an adhesive surface of the adhesive tape, and sequentially vertically liftable after the portion of the film unit is attached to the adhesive surface of the adhesive tape; and a tape recovery unit configured to recover the adhesive tape having the portion of the film attached thereto, and apply a tension force to the adhesive tape after the portion of the film unit is adhered to the adhesive tape.
Abstract:
A laser beam irradiation apparatus includes a laser light source, a controller for controlling energy of light generated by the laser source, a first optical system for adjusting a shape of light that has passed through the controller, a scanner for adjusting the direction of light that has passed through the first optical system, and an F-theta lens for reducing a beam that has passed through the scanner.
Abstract:
A laser irradiation apparatus is provided. The laser irradiation apparatus includes a laser beam generator configured to generate laser beams; a slit unit configured to selectively transmit the laser beams; a mirror unit configured to change a path of the selectively transmitted laser beams, so as to irradiate the selectively transmitted laser beams onto a processing target; a first optical system, wherein a first portion of the selectively transmitted laser beams penetrates through the mirror unit and is projected to the first optical system; and a second optical system, wherein a second portion of the selectively transmitted laser beams penetrates through the mirror unit and is projected to the second optical system.
Abstract:
A laser beam irradiation apparatus includes a laser light source, a controller for controlling energy of light generated by the laser source, a first optical system for adjusting a shape of light that has passed through the controller, a scanner for adjusting the direction of light that has passed through the first optical system, and an F-theta lens for reducing a beam that has passed through the scanner.
Abstract:
A method for inspecting a polysilicon layer includes: radiating excitation light to the polysilicon layer; and detecting a photoluminescence signal generated by the excitation light, wherein average power of the excitation light has a range of 1 W/cm2 to 10 W/cm2, and peak power of the excitation light has a range of 100 W/cm2 to 1000 W/cm2.
Abstract translation:一种用于检查多晶硅层的方法包括:向多晶硅层辐射激发光; 并且检测由激发光产生的光致发光信号,其中激发光的平均功率具有1W / cm 2至10W / cm 2的范围,并且激发光的峰值功率具有100W / cm 2至1000W的范围 / cm2。
Abstract:
Apparatus for uniformizing light amount distribution by shaking line beams along a longitudinal axis direction is provided. The apparatus includes a mirror mount, a mirror, an actuator, and a deformation member. The mirror fixed to the mirror mount and includes a reflective surface. The actuator is disposed at a distance from the mirror mount and configured to repeat expansion and contraction along a first direction. The deformation member includes a plurality of blocks connected to each other by flexible joints and is coupled to the actuator and the mirror mount. The deformation member is configured to change a displacement in the first direction due to operation of the actuator to a displacement in a second direction that crosses the first direction, amplify the changed displacement, and transmit the amplified displacement to the mirror mount.