公开(公告)号：US20180267409A1

公开(公告)日：2018-09-20

申请号：US15986901

申请日：2018-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Min OH ,  Mi-Hyun PARK ,  Hyo-San LEE ,  Ji-Hoon JEONG ,  Yong-Sun KO ,  In-Gi KIM ,  Na-Rim KIM ,  Sang-Tae KIM ,  Seong-Min KIM ,  Kyong-Ho LEE

IPC: G03F7/42 ,  H01L29/16 ,  H01L21/8238 ,  H01L21/311 ,  G03F7/039 ,  H01L21/266

CPC classification number: G03F7/426 ,  G03F7/039 ,  G03F7/42 ,  G03F7/422 ,  G03F7/425 ,  H01L21/266 ,  H01L21/31133 ,  H01L21/823814 ,  H01L21/823828 ,  H01L29/16

Abstract: A composition for removing photoresist, including an alkyl ammonium fluoride salt in an amount ranging from about 0.5 weight percent to about 10 weight percent, based on a total weight of the composition; an organic sulfonic acid in an amount ranging from about 1 weight percent to about 20 weight percent, based on the total weight of the composition; and a lactone-based solvent in an amount ranging from about 70 weight percent to about 98.5 weight percent, based on the total weight of the composition.