公开(公告)号：US20140306349A1

公开(公告)日：2014-10-16

申请号：US13861086

申请日：2013-04-11

Applicant: QUALCOMM INCORPORATED

Inventor： Shiqun Gu ,  Urmi Ray ,  Roawen Chen ,  Brian Matthew Henderson ,  Ratibor Radojcic ,  Matthew Nowak ,  Nicholas Yu

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49811 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Some implementations provide an interposer that includes a substrate, a via in the substrate, and an oxidation layer. The via includes a metal material. The oxidation layer is between the via and the substrate. In some implementations, the substrate is a silicon substrate. In some implementations, the oxidation layer is a thermal oxide formed by exposing the substrate to heat. In some implementations, the oxidation layer is configured to provide electrical insulation between the via and the substrate. In some implementations, the interposer also includes an insulation layer. In some implementations, the insulation layer is a polymer layer. In some implementations, the interposer also includes at least one interconnect on the surface of the interposer. The at least one interconnect is positioned on the surface of the interposer such that the oxidation layer is between the interconnect and the substrate.

Abstract translation: 一些实施方案提供了一种插入器，其包括衬底，衬底中的通孔和氧化层。 通孔包括金属材料。 氧化层位于通孔和衬底之间。 在一些实施方式中，衬底是硅衬底。 在一些实施方案中，氧化层是通过将基底暴露于热而形成的热氧化物。 在一些实施方案中，氧化层被配置为在通孔和基底之间提供电绝缘。 在一些实施方案中，插入件还包括绝缘层。 在一些实施方案中，绝缘层是聚合物层。 在一些实现中，插入器还包括在插入器的表面上的至少一个互连。 所述至少一个互连件位于所述插入件的表面上，使得所述氧化层位于所述互连件和所述基板之间。

公开(公告)号：US08889431B2

公开(公告)日：2014-11-18

申请号：US13683783

申请日：2012-11-21

Applicant: QUALCOMM Incorporated

Inventor： Xiaochun Zhu ,  Matthew Nowak ,  Xia Li ,  Seung H. Kang

IPC: H01L43/02 ,  H01F10/32 ,  G11C11/16 ,  H01L27/22 ,  H01L43/12

CPC classification number: H01L43/02 ,  G11C11/16 ,  G11C11/161 ,  G11C11/1659 ,  H01F10/3254 ,  H01F10/3272 ,  H01L27/228 ,  H01L43/08 ,  H01L43/12

Abstract: Magnetic tunnel junctions (MTJs) and methods of forming same are disclosed. A pinned layer is disposed in the MTJ such that a free layer of the MTJ can couple to a drain of an access transistor when provided in a magnetic random access memory (MRAM) bitcell. This structure alters the write current flow direction to align the write current characteristics of the MTJ with write current supply capability of an MRAM bitcell employing the MTJ. As a result, more write current can be provided to switch the MTJ from a parallel (P) to anti-parallel (AP) state. An anti-ferromagnetic material (AFM) layer is provided on the pinned layer to fix pinned layer magnetization. To provide enough area for depositing the AFM layer to secure pinned layer magnetization, a pinned layer having a pinned layer surface area greater than a free layer surface area of the free layer is provided.

Abstract translation: 公开了磁隧道结（MTJ）及其形成方法。 被钉扎层设置在MTJ中，使得当提供在磁性随机存取存储器（MRAM）位单元中时，MTJ的自由层可以耦合到存取晶体管的漏极。 该结构改变写入电流流动方向，以使MTJ的写入电流特性与使用MTJ的MRAM位单元的写入电流供应能力对准。 结果，可以提供更多的写入电流以将MTJ从并行（P）切换到反并行（AP）状态。 在钉扎层上提供反铁磁材料（AFM）层以固定钉扎层的磁化强度。 为了提供足够的用于沉积AFM层以确保钉扎层磁化的区域，提供了具有大于自由层的自由层表面积的钉扎层表面积的钉扎层。

公开(公告)号：US20130134533A1

公开(公告)日：2013-05-30

申请号：US13683783

申请日：2012-11-21

Applicant: QUALCOMM INCORPORATED

Inventor： Xiaochun Zhu ,  Matthew Nowak ,  Xia Li ,  Seung H. Kang

IPC: H01L43/02 ,  H01L43/12

CPC classification number: H01L43/02 ,  G11C11/16 ,  G11C11/161 ,  G11C11/1659 ,  H01F10/3254 ,  H01F10/3272 ,  H01L27/228 ,  H01L43/08 ,  H01L43/12

Abstract: Magnetic tunnel junctions (MTJs) and methods of forming same are disclosed. A pinned layer is disposed in the MTJ such that a free layer of the MTJ can couple to a drain of an access transistor when provided in a magnetic random access memory (MRAM) bitcell. This structure alters the write current flow direction to align the write current characteristics of the MTJ with write current supply capability of an MRAM bitcell employing the MTJ. As a result, more write current can be provided to switch the MTJ from a parallel (P) to anti-parallel (AP) state. An anti-ferromagnetic material (AFM) layer is provided on the pinned layer to fix pinned layer magnetization. To provide enough area for depositing the AFM layer to secure pinned layer magnetization, a pinned layer having a pinned layer surface area greater than a free layer surface area of the free layer is provided.

Abstract translation: 公开了磁隧道结（MTJ）及其形成方法。 被钉扎层设置在MTJ中，使得当提供在磁随机存取存储器（MRAM）位单元中时，MTJ的自由层可以耦合到存取晶体管的漏极。 该结构改变写入电流流动方向，以使MTJ的写入电流特性与使用MTJ的MRAM位单元的写入电流供应能力对准。 结果，可以提供更多的写入电流以将MTJ从并行（P）切换到反并行（AP）状态。 在钉扎层上提供反铁磁材料（AFM）层以固定钉扎层的磁化强度。 为了提供足够的用于沉积AFM层以确保钉扎层磁化的区域，提供了具有大于自由层的自由层表面积的钉扎层表面积的钉扎层。